公开(公告)号：US20220301915A1

公开(公告)日：2022-09-22

申请号：US17208441

申请日：2021-03-22

Applicant: Applied Materials, Inc.

Inventor： Job George Konnoth Joseph ,  Syam Sundeep Boosa ,  Gopu Krishna ,  Rupankar Choudhury

IPC: H01L21/683 ,  H01L21/66 ,  H01L21/67

Abstract: Exemplary support assemblies may include an electrostatic chuck body defining a support surface that defines a substrate seat. The assemblies may include a support stem coupled with the chuck body. The assemblies may include a heater embedded within the chuck body. The assemblies may include a first bipolar electrode embedded within the electrostatic chuck body between the heater and support surface. The assemblies may include a second bipolar electrode embedded within the chuck body between the heater and support surface. The assemblies may include at least one inner capacitive sensor embedded within the electrostatic chuck body at a position proximate a center of the substrate seat. The assemblies may include at least one outer capacitive sensor embedded within the electrostatic chuck body at a position proximate a peripheral edge of the substrate seat.

公开(公告)号：US20220122851A1

公开(公告)日：2022-04-21

申请号：US17071618

申请日：2020-10-15

Applicant: Applied Materials, Inc.

Inventor： Fang Ruan ,  Diwakar Kedlaya ,  Amit Bansal ,  Venkata Sharat Chandra Parimi ,  Rajaram Narayanan ,  Badri N. Ramamurthi ,  Sherry L. Mings ,  Job George Konnoth Joseph ,  Rupankar Choudhury

IPC: H01L21/3213 ,  H01L21/3065

Abstract: A semiconductor processing system includes a remote plasma source (RPS), a faceplate, and an output manifold positioned between the RPS and the faceplate. The output manifold is characterized by a plurality of purge outlets that are fluidly coupled with a purge gas source and a plurality of deposition outlets that are fluidly coupled with a deposition gas source. A delivery tube extends between and fluidly couples the RPS and the faceplate. The delivery tube is characterized by a generally cylindrical sidewall that defines an upper plurality of apertures that are arranged in a radial pattern. Each of the upper apertures is fluidly coupled with one of the purge outlets. The generally cylindrical sidewall defines a lower plurality of apertures that are arranged in a radial pattern and below the upper plurality of apertures. Each of the lower apertures is fluidly coupled with one of the deposition outlets.

公开(公告)号：US20240234167A1

公开(公告)日：2024-07-11

申请号：US18095262

申请日：2023-01-10

Applicant: Applied Materials, Inc.

Inventor： Shashank Sharma ,  Udit Suryakant Kotagi ,  Diwakar Kedlaya ,  Mayur Govind Kulkarni ,  Rupankar Choudhury

IPC: H01L21/67

CPC classification number: H01L21/67017 ,  H01L21/67103 ,  H01L21/67196

Abstract: Exemplary substrate processing systems may include a lid plate. The systems may include a plurality of processing regions. The systems may include at least one splitter. Each splitter may include a top surface and side surfaces. Each splitter may define an inlet and a plurality of outlets. Each inlet and outlet may extend through a side surface. Each splitter may define an inlet lumen that extends from the fluid inlet to a hub. Each splitter may define a plurality of outlet lumens that each extend from the hub to one of the outlets. Each of the outlet lumens may have a same length. The systems may include a plurality of output manifolds. Each of the output manifolds may be coupled with a respective processing region. The systems may include a plurality of valves. At least one valve may be coupled between each outlet and an output manifold.

公开(公告)号：US11862475B2

公开(公告)日：2024-01-02

申请号：US17071618

申请日：2020-10-15

Applicant: Applied Materials, Inc.

Inventor： Fang Ruan ,  Diwakar Kedlaya ,  Amit Bansal ,  Venkata Sharat Chandra Parimi ,  Rajaram Narayanan ,  Badri N. Ramamurthi ,  Sherry L. Mings ,  Job George Konnoth Joseph ,  Rupankar Choudhury

IPC: H01J37/32 ,  H01L21/3213 ,  H01L21/3065

CPC classification number: H01L21/32136 ,  H01L21/3065 ,  H01J37/32623

Abstract: A semiconductor processing system includes a remote plasma source (RPS), a faceplate, and an output manifold positioned between the RPS and the faceplate. The output manifold is characterized by a plurality of purge outlets that are fluidly coupled with a purge gas source and a plurality of deposition outlets that are fluidly coupled with a deposition gas source. A delivery tube extends between and fluidly couples the RPS and the faceplate. The delivery tube is characterized by a generally cylindrical sidewall that defines an upper plurality of apertures that are arranged in a radial pattern. Each of the upper apertures is fluidly coupled with one of the purge outlets. The generally cylindrical sidewall defines a lower plurality of apertures that are arranged in a radial pattern and below the upper plurality of apertures. Each of the lower apertures is fluidly coupled with one of the deposition outlets.

公开(公告)号：US10510567B2

公开(公告)日：2019-12-17

申请号：US15970496

申请日：2018-05-03

Applicant: Applied Materials, Inc.

Inventor： Yizhen Zhang ,  Rupankar Choudhury ,  Jay D. Pinson, II ,  Jason M. Schaller ,  Hanish Kumar Panavalappil Kumarankutty

IPC: H01L21/67 ,  G02B6/42 ,  G01J5/00 ,  C23C16/458 ,  C23C16/46 ,  G01J5/02 ,  G01J5/04 ,  C23C16/52 ,  H01J37/32 ,  G01J5/06 ,  H01L21/687 ,  G01J5/08

Abstract: Embodiments described herein include integrated systems used to directly monitor a substrate temperature during a plasma enhanced deposition process and methods related thereto. In one embodiment, a substrate support assembly includes a support shaft, a substrate support disposed on the support shaft, and a substrate temperature monitoring system for measuring a temperature of a substrate to be disposed on the substrate support. The substrate temperature monitoring system includes a optical fiber tube, a light guide coupled to the optical fiber tube, and a cooling assembly disposed about a junction of the optical fiber tube and the light guide. Herein, at least a portion of the light guide is disposed in an opening extending through the support shaft and into the substrate support and the cooling assembly maintains the optical fiber tube at a temperature of less than about 100° C. during substrate processing.

公开(公告)号：US20250037980A1

公开(公告)日：2025-01-30

申请号：US18359772

申请日：2023-07-26

Applicant: Applied Materials, Inc.

Inventor： Rupankar Choudhury ,  Sanjay G. Kamath ,  Juan Carlos Rocha-Alvarez ,  Sridhar Bachu ,  Mukesh Singh Dhami ,  Dan-il Yoon

IPC: H01J37/32 ,  C23C16/44 ,  C23C16/455

Abstract: A processing chamber and port adaptor are provided. Processing chambers include a chamber body having a lid coupled to the first end of the chamber body, a gas ring adjacent the first end of the chamber body, and a substrate support, where a processing region is defined between the substrate support and the lid. The processing chamber includes a port adapter coupled to the second end of the chamber body. The port adapter includes a body defining a plurality of apertures in fluid communication with the processing region, where each of the apertures are spaced apart along the body such that a distance between adjacent apertures is within about 20% of an average aperture spacing distance, an individually controllable valve fluidly coupled to one or more of the plurality of apertures, and an exhaust system in fluid communication with a system foreline and the plurality of apertures.

公开(公告)号：US11610800B2

公开(公告)日：2023-03-21

申请号：US17208441

申请日：2021-03-22

Applicant: Applied Materials, Inc.

Inventor： Job George Konnoth Joseph ,  Syam Sundeep Boosa ,  Gopu Krishna ,  Rupankar Choudhury

IPC: H01T23/00 ,  H01L21/683 ,  H01L21/66 ,  H01L21/67

Abstract: Exemplary support assemblies may include an electrostatic chuck body defining a support surface that defines a substrate seat. The assemblies may include a support stem coupled with the chuck body. The assemblies may include a heater embedded within the chuck body. The assemblies may include a first bipolar electrode embedded within the electrostatic chuck body between the heater and support surface. The assemblies may include a second bipolar electrode embedded within the chuck body between the heater and support surface. The assemblies may include at least one inner capacitive sensor embedded within the electrostatic chuck body at a position proximate a center of the substrate seat. The assemblies may include at least one outer capacitive sensor embedded within the electrostatic chuck body at a position proximate a peripheral edge of the substrate seat.

公开(公告)号：US11326256B2

公开(公告)日：2022-05-10

申请号：US16691259

申请日：2019-11-21

Applicant: Applied Materials, Inc.

Inventor： Luke Bonecutter ,  Yunzhe Yang ,  Rupankar Choudhury ,  Abhijit Kangude

IPC: C23C16/455 ,  C23C16/458 ,  C23C16/44

Abstract: Embodiments described herein relate to apparatus and techniques for mechanical isolation and thermal insulation in a process chamber. In one embodiment, an insulating layer is disposed between a dome assembly and a gas ring. The insulating layer is configured to maintain a temperature of the dome assembly and prevent thermal energy transfer from the dome assembly to the gas ring. The insulating layer provides mechanical isolation of the dome assembly from the gas ring. The insulating layer also provides thermal insulation between the dome assembly and the gas ring. The insulating layer may be fabricated from a polyimide containing material, which substantially reduces an occurrence of deformation of the insulating layer.

公开(公告)号：US10858735B2

公开(公告)日：2020-12-08

申请号：US16561329

申请日：2019-09-05

Applicant: Applied Materials, Inc.

Inventor： Danny D. Wang ,  Jason Michael Lamb ,  Jun Tae Choi ,  Rupankar Choudhury ,  Zhong Qiang Hua ,  Juan Carlos Rocha-Alvarez

IPC: C23C16/44 ,  B01J3/00 ,  C23C16/455 ,  C23C16/507

Abstract: Alignment systems employing actuators provide relative displacement between lid assemblies of process chambers and substrates, and related methods are disclosed. A process chamber includes chamber walls defining a process volume in which a substrate may be placed and the walls support a lid assembly of the process chamber. The lid assembly contains at least one of an energy source and a process gas dispenser. Moreover, an alignment system may include at least one each of a bracket, an interface member, and an actuator. By attaching the bracket to the chamber wall and securing the interface member to the lid assembly, the actuator may communicate with the bracket and the interface member to provide relative displacement between the chamber wall and the lid assembly. In this manner, the lid assembly may be positioned relative to the substrate to improve process uniformity across the substrate within the process chamber.

公开(公告)号：US10435786B2

公开(公告)日：2019-10-08

申请号：US14522350

申请日：2014-10-23

Applicant: Applied Materials, Inc.

Inventor： Danny D. Wang ,  Jun Tae Choi ,  Rupankar Choudhury ,  Zhong Qiang Hua ,  Juan Carlos Rocha-Alvarez ,  Jason Michael Lamb

IPC: C23C16/44 ,  B01J3/00 ,  C23C16/455 ,  C23C16/507

Abstract: Alignment systems employing actuators provide relative displacement between lid assemblies of process chambers and substrates, and related methods are disclosed. A process chamber includes chamber walls defining a process volume in which a substrate may be placed and the walls support a lid assembly of the process chamber. The lid assembly contains at least one of an energy source and a process gas dispenser. Moreover, an alignment system may include at least one each of a bracket, an interface member, and an actuator. By attaching the bracket to the chamber wall and securing the interface member to the lid assembly, the actuator may communicate with the bracket and the interface member to provide relative displacement between the chamber wall and the lid assembly. In this manner, the lid assembly may be positioned relative to the substrate to improve process uniformity across the substrate within the process chamber.