公开(公告)号：US20230374660A1

公开(公告)日：2023-11-23

申请号：US17663695

申请日：2022-05-17

Applicant: Applied Materials, Inc.

Inventor： Harpreet SINGH ,  Jallepally RAVI ,  Zubin HUANG ,  Manjunatha KOPPA ,  Sandesh YADAMANE ,  Srinivas TOKUR MOHANA ,  Shreyas PATIL SHANTHAVEERASWAMY ,  Kai WU ,  Peiqi WANG ,  Mingrui ZHAO

IPC: C23C16/455 ,  C23C16/06 ,  H01L21/285

CPC classification number: C23C16/45561 ,  C23C16/06 ,  H01L21/28568 ,  C23C16/45591

Abstract: A substrate processing system is provided having a processing chamber. The processing chamber includes a lid plate, one or more chamber sidewalls, and a chamber base that collectively define a processing volume. An annular plate is coupled to the lid plate, and an edge manifold is fluidly coupled to the processing chamber through the annular plate and the lid plate. The substrate processing system includes a center manifold that is coupled to the lid plate.