CONTACTLESS LATCH AND COUPLING FOR VACUUM WAFER TRANSFER CASSETTE

    公开(公告)号:US20200286760A1

    公开(公告)日:2020-09-10

    申请号:US16752502

    申请日:2020-01-24

    IPC分类号: H01L21/673 H01L21/67

    摘要: Embodiments of the present disclosure relate to a substrate transfer device having a contactless latch and contactless coupling providing the ability to lock and unlock the substrate transfer device at atmospheric and vacuum pressure with without particle generation at a base of the substrate transfer device, the contactless latch, and the contactless coupling. The substrate transfer device includes a lid having one or more lid grooves, a base having one or more base grooves, and a rotation member rotatably coupled to the lid. Each flange of one or more flanges of the substrate transfer device is rotatable in aligned lid grooves and base grooves, and each flange of the one or more flanges has an arm with a ferromagnetic material coupled thereto. The base is coupled to the lid when the ferromagnetic material of the arm is aligned and spaced from a magnetic material of a slot of the one or more base grooves.