公开(公告)号：US20210176831A1

公开(公告)日：2021-06-10

申请号：US17106735

申请日：2020-11-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Pingyan LEI ,  Dien-Yeh WU ,  Jallepally RAVI ,  Manjunatha KOPPA ,  Ambarish TOORIHAL ,  Sandesh YADAMANE ,  Vinod Konda PURATHE ,  Xiaoxiong YUAN

IPC: H05B3/48 ,  C23C14/54 ,  C23C16/458 ,  C23C16/455 ,  H05B3/14

Abstract: Embodiments of a lid heater for a deposition chamber are provided herein. In some embodiments, a lid heater for a deposition chamber includes a ceramic heater body having a first side opposite a second side, wherein the ceramic heater body includes a first plurality of gas channels extending from one or more first gas inlets on the first side, wherein each of the one or more first gas inlets extend to a plurality of first gas outlets on the second side; a heating element embedded in the ceramic heater body; and an RF electrode embedded in the ceramic heater body proximate the second side, wherein the first plurality of gas channels extend through the RF electrode.

公开(公告)号：US20230130756A1

公开(公告)日：2023-04-27

申请号：US17508581

申请日：2021-10-22

Applicant: Applied Materials, Inc.

Inventor： Zubin HUANG ,  Srinivas Tokur MOHANA ,  Sandesh YADAMANE ,  Kai WU ,  Jallepally RAVI ,  Xiaozhou YU ,  Peiqi WANG

IPC: H01L21/67 ,  C23C16/458 ,  C23C16/46 ,  H01L21/687

Abstract: Embodiments of the disclosure provided herein generally relate to a bottom cover plate (BCP) that enables control of radiation loss from a heating element inside a chamber for processing a substrate. The heating element is used to heat the substrate before or during processing and may heat the substrate unevenly due to uneven heat losses within the chamber. For example, the uneven heating of the substrate may result in uneven deposition of a material on the substrate, which may result in excess processing to correct the deposition or wasted product from disposing of improperly processed substrates. The BCP may be used to correct the uneven heating of the substrate.

公开(公告)号：US20230374660A1

公开(公告)日：2023-11-23

申请号：US17663695

申请日：2022-05-17

Applicant: Applied Materials, Inc.

Inventor： Harpreet SINGH ,  Jallepally RAVI ,  Zubin HUANG ,  Manjunatha KOPPA ,  Sandesh YADAMANE ,  Srinivas TOKUR MOHANA ,  Shreyas PATIL SHANTHAVEERASWAMY ,  Kai WU ,  Peiqi WANG ,  Mingrui ZHAO

IPC: C23C16/455 ,  C23C16/06 ,  H01L21/285

CPC classification number: C23C16/45561 ,  C23C16/06 ,  H01L21/28568 ,  C23C16/45591

Abstract: A substrate processing system is provided having a processing chamber. The processing chamber includes a lid plate, one or more chamber sidewalls, and a chamber base that collectively define a processing volume. An annular plate is coupled to the lid plate, and an edge manifold is fluidly coupled to the processing chamber through the annular plate and the lid plate. The substrate processing system includes a center manifold that is coupled to the lid plate.