公开(公告)号：US20200018789A1

公开(公告)日：2020-01-16

申请号：US16582877

申请日：2019-09-25

Applicant: Applied Materials Israel Ltd.

Inventor： Zvi GOREN ,  Adi BOEHM ,  Amit BATIKOFF

IPC: G01R31/26 ,  G01R31/28 ,  H01L21/66

Abstract: Data indicative of location information of a potential defect of interest revealed in a specimen and of one or more layers of the specimen corresponding to the potential defect of interest may be received. A die layout clip may be generated in accordance with the data by deriving the die layout clip based on the location information of the potential defect of interest and the one or more layers of the specimen corresponding to the potential defect of interest. The die layout clip may include information indicative of one or more patterns characterizing an inspection area that includes the potential defect of interest of the specimen. The generated die layout clip may be transmitted to a semiconductor inspection unit where an inspection by the semiconductor inspection unit of a semiconductor wafer that includes the specimen corresponding to the potential defect of interest is based on the one or more patterns of the die layout clip.

公开(公告)号：US20160350905A1

公开(公告)日：2016-12-01

申请号：US14728495

申请日：2015-06-02

Applicant: Applied Materials Israel Ltd.

Inventor： Michele DALLA-TORRE ,  Amit BATIKOFF ,  Efrat ROZENMAN ,  Ron KATZIR ,  Imry KISSOS

IPC: G06T7/00 ,  G06K9/62

CPC classification number: G05B19/41875 ,  G05B2219/37224 ,  G05B2219/45031 ,  G06K9/6202 ,  G06T7/0004 ,  G06T7/001 ,  G06T2200/24 ,  G06T2207/30148 ,  Y02P90/265

Abstract: There are provided a method of inspecting the inspection area and an inspection system thereof. The inspection system comprises an inspection control unit operatively coupled to an inspection tool unit and to a recipe generating unit. The inspection control unit is configured to obtain the design data and the inspection recipe; to provide local segmentation of at least one inspection PoI comprised in an inspection image captured from the inspection area by the inspection tool unit, thereby obtaining inspection structural elements comprised in the at least one inspection PoI, the local segmentation is provided using segmentation configuration data specified in the inspection recipe; to identify one or more target structural elements and design structural elements corresponding thereto, identifying is provided using design association data specified in the inspection recipe; and to enable metrology measurements for the one or more target structural elements using the identified design structural elements.

Abstract translation: 提供检查检查区域的方法及其检查系统。 检查系统包括可操作地联接到检查工具单元和配方生成单元的检查控制单元。 检查控制单元被配置为获得设计数据和检查配方; 提供包括在由检查工具单元从检查区域捕获的检查图像中的至少一个检查PoI的局部分割，从而获得包括在至少一个检查PoI中的检查结构元件，使用指定的分割配置数据提供局部分割 在检验配方中; 识别一个或多个目标结构元件并设计与之对应的结构元件，使用在检查配方中指定的设计关联数据来提供识别; 并且使用所识别的设计结构元件来对一个或多个目标结构元件进行度量测量。

公开(公告)号：US20190121933A1

公开(公告)日：2019-04-25

申请号：US16179700

申请日：2018-11-02

Applicant: Applied Materials Israel Ltd.

Inventor： Ron KATZIR ,  Imry KISSOS ,  Lavi SHACHAR ,  Amit BATIKOFF ,  Shaul COHEN ,  Noam ZAC

IPC: G06F17/50

Abstract: One or more metrology objects and one or more metrology operations may be identified. A design-based representation of a first metrology object of the one or more metrology objects may be received. Furthermore, an image-based representation of the first metrology object of the one or more metrology objects may be received where the one or more metrology operations include a first metrology operation associated with the first metrology object that is to be performed on the image-based representation of the first metrology object. The design-based representation of the first metrology object may be mapped with the image-based representation of the first metrology object. The first metrology operation may be performed based on the mapping.

公开(公告)号：US20190026879A1

公开(公告)日：2019-01-24

申请号：US15655796

申请日：2017-07-20

Applicant: APPLIED MATERIALS ISRAEL LTD.

Inventor： Amit BATIKOFF ,  Doron PORTNOY

IPC: G06T7/00 ,  G06T5/50 ,  G06T5/00 ,  G06K9/62

CPC classification number: G06T7/001 ,  G06K9/6202 ,  G06K9/6215 ,  G06T5/006 ,  G06T5/009 ,  G06T5/50 ,  G06T2207/10024 ,  G06T2207/30148

Abstract: A method, system, and computer program product of detecting defects in an object using a processor operatively connected to a memory, the method comprising: accommodating in the memory an image group comprising a reference image and an image; generating a set of correction parameters to be applied to pixels of an image from the image group, wherein the parameters are determined to minimize a combination of a first factor indicative of variability of the set, and a second factor indicative of a difference between an image from the image group as enhanced by applying the set and another image in the image group, wherein the combination increases as any factor increases; applying the set to the image of the image group to obtain an enhanced image; generating an optimal difference image between the enhanced image and the other image; and using the optimal difference image for detecting defect candidates.

公开(公告)号：US20180321299A1

公开(公告)日：2018-11-08

申请号：US16025869

申请日：2018-07-02

Applicant: Applied Materials Israel Ltd.

Inventor： Zvi GOREN ,  Adi BOEHM ,  Amit BATIKOFF

IPC: G01R31/26 ,  H01L21/66 ,  G01R31/28

CPC classification number: G01R31/2601 ,  G01R31/2831 ,  G01R31/303 ,  H01L22/12

Abstract: There is provided an inspection system for inspecting a specimen, an inspection unit capable to operate in conjunction with an inspection machine unit, a die layout clipping unit, methods of inspecting a specimen, and a method of providing a die layout clip. The method of inspecting a specimen comprises: obtaining location information indicative of coordinates of a potential defect of interest revealed in the specimen and of one or more inspected layers corresponding to the potential defect of interest; sending to a die layout clipping unit a first data indicative of the location information and dimensions of an inspection area containing the potential defect of interest; receiving a die layout clip generated in accordance with the first data; specifying at least one inspection algorithm of the inspection area using information comprised in the die layout clip; and enabling inspection of the inspection area using the specified inspection algorithm.

公开(公告)号：US20170364798A1

公开(公告)日：2017-12-21

申请号：US15675477

申请日：2017-08-11

Applicant: Applied Materials Israel Ltd.

Inventor： Leonid KARLINSKY ,  Boaz COHEN ,  Idan KAIZERMAN ,  Efrat ROSENMAN ,  Amit BATIKOFF ,  Daniel RAVID ,  Moshe ROSENWEIG

IPC: G06N3/08

CPC classification number: G06N3/08 ,  G06K9/036 ,  G06K9/4628 ,  G06K9/6271 ,  G06N3/0454

Abstract: There are provided system and method of classifying defects in a semiconductor specimen. The method comprises: upon obtaining by a computer a Deep Neural Network (DNN) trained to provide classification-related attributes enabling minimal defect classification error, processing a fabrication process (FP) sample using the obtained trained DNN; and, resulting from the processing, obtaining by the computer classification-related attributes characterizing the at least one defect to be classified, thereby enabling automated classification, in accordance with the obtained classification-related attributes, of the at least one defect presented in the FP image. The DNN is trained using a classification training set comprising a plurality of first training samples and ground truth data associated therewith, each first training sample comprising a training image presenting at least one defect and the ground truth data is informative of classes and/or class distribution of defects presented in the respective first training samples; the FP sample comprises a FP image presenting at least one defect to be classified.

公开(公告)号：US20170177997A1

公开(公告)日：2017-06-22

申请号：US15384058

申请日：2016-12-19

Applicant: Applied Materials Israel Ltd.

Inventor： Leonid KARLINSKY ,  Boaz COHEN ,  Idan KAIZERMAN ,  Efrat ROSENMAN ,  Amit BATIKOFF ,  Daniel RAVID ,  Moshe ROSENWEIG

IPC: G06N3/08

CPC classification number: G06N3/08 ,  G06K9/036 ,  G06K9/4628 ,  G06K9/6271 ,  G06N3/0454

Abstract: There are provided system and method of examining a semiconductor specimen. The method comprises: upon obtaining a Deep Neural Network (DNN) trained for a given examination-related application within a semiconductor fabrication process, processing together one or more fabrication process (FP) images using the obtained trained DNN, wherein the DNN is trained using a training set comprising ground truth data specific for the given application; and obtaining examination-related data specific for the given application and characterizing at least one of the processed one or more FP images. The examination-related application can be, for example, classifying at least one defect presented by at least one FP image, segmenting the at least one FP image, detecting defects in the specimen presented by the at least one FP image, registering between at least two FP images, regression application enabling reconstructing the at least one FP image in correspondence with different examination modality, etc.

公开(公告)号：US20160349742A1

公开(公告)日：2016-12-01

申请号：US14727800

申请日：2015-06-01

Applicant: Applied Materials Israel Ltd.

Inventor： Michele DALLA-TORRE ,  Amit BATIKOFF ,  Efrat ROZENMAN ,  Ron KATZIR ,  Imry KISSOS

IPC: G05B19/418

Abstract: There are provided a method of generating an inspection recipe usable for inspecting an inspection area of a specimen and a recipe generating unit. The recipe generating unit is configured: upon obtaining design data informative of design structural elements comprised in a design PoI corresponding to the at least one PoI, to provide global segmentation of a test image captured by an inspection tool unit from the inspection area and comprising at least one test PoI of substantially the same design as the at least one PoI, thereby to obtain segmented structural elements comprised in the test PoI and segmentation configuration data; to associate the segmented structural elements comprised in the test PoI with the design structural elements comprised in the design PoI, thereby to obtain design association data; and to generate an inspection recipe comprising, at least, segmentation configuration data and design association data.

Abstract translation: 提供了一种生成可用于检查样本和食谱生成单元的检查区域的检查配方的方法。 配方生成单元被配置为：在获得包括在与至少一个PoI对应的设计PoI中的设计结构元素的设计数据时，提供由检查工具单元从检查区域捕获的测试图像的全局分割，并且包括 至少一个测试PoI与至少一个PoI基本上相同的设计，从而获得包含在测试PoI和分割配置数据中的分段结构元素; 将包含在测试PoI中的分段结构元素与设计PoI中包含的设计结构元素相关联，从而获得设计关联数据; 并且生成至少包括分割配置数据和设计关联数据的检查配方。

公开(公告)号：US20160282404A1

公开(公告)日：2016-09-29

申请号：US14668749

申请日：2015-03-25

Applicant: Applied Materials Israel Ltd.

Inventor： Zvi GOREN ,  Adi BOEHM ,  Amit BATIKOFF

IPC: G01R31/26

CPC classification number: G01R31/2601 ,  G01R31/2831 ,  G01R31/303 ,  H01L22/12

Abstract: There is provided an inspection system for inspecting a specimen, an inspection unit capable to operate in conjunction with an inspection machine unit, a die layout clipping unit, methods of inspecting a specimen, and a method of providing a die layout clip. The method of inspecting a specimen comprises: obtaining location information indicative of coordinates of a potential defect of interest revealed in the specimen and of one or more inspected layers corresponding to the potential defect of interest; sending to a die layout clipping unit a first data indicative of the location information and dimensions of an inspection area containing the potential defect of interest; receiving a die layout clip generated in accordance with the first data; specifying at least one inspection algorithm of the inspection area using information comprised in the die layout clip; and enabling inspection of the inspection area using the specified inspection algorithm.

Abstract translation: 提供了用于检查样本的检查系统，能够与检查机单元结合操作的检查单元，模具布局限制单元，检查样本的方法以及提供管芯布局夹的方法。 检查样本的方法包括：获得指示样本中显示的感兴趣的潜在缺陷的坐标的位置信息和对应于感兴趣的潜在缺陷的一个或多个被检查层; 向模具布局剪切单元发送指示包含感兴趣的潜在缺陷的检查区域的位置信息和尺寸的第一数据; 接收根据第一数据生成的管芯布局夹; 使用包含在所述管芯布局夹中的信息指定所述检查区域的至少一个检查算法; 并使用指定的检查算法实现对检查区域的检查。

公开(公告)号：US20220067523A1

公开(公告)日：2022-03-03

申请号：US17521499

申请日：2021-11-08

Applicant: Applied Materials Israel Ltd.

Inventor： Leonid KARLINSKY ,  Boaz COHEN ,  Idan KAIZERMAN ,  Efrat ROSENMAN ,  Amit BATIKOFF ,  Daniel RAVID ,  Moshe ROSENWEIG

IPC: G06N3/08 ,  G06N3/04 ,  G06K9/62 ,  G06K9/46 ,  G06K9/03

Abstract: A computerized system and method of training a deep neural network (DNN) is provided. The DNN is trained in a first training cycle using a first training set including first training samples. Each first training sample includes at least one first training image synthetically generated based on design data. Upon receiving a user feedback with respect to the DNN trained using the first training set, a second training cycle is adjusted based on the user feedback by obtaining a second training set including augmented training samples. The DNN is re-trained using the second training set. The augmented training samples are obtained by augmenting at least part of the first training samples using defect-related synthetic data. The trained DNN is usable for examination of a semiconductor specimen.