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    Method of manufacturing an encapsulated package for a magnetic device
    1.
    发明授权
    Method of manufacturing an encapsulated package for a magnetic device 失效
    制造用于磁性装置的封装包装的方法

    公开(公告)号：US07462317B2

    公开(公告)日：2008-12-09

    申请号：US10985825

    申请日：2004-11-10

    申请人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

    发明人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

    IPC分类号： B29C45/14 ,  H01F27/02

    CPC分类号： H01F41/005 ,  H05K3/284 ,  Y10T29/4902 ,  Y10T29/49146 ,  Y10T29/49155

    摘要： A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.

    摘要翻译： 一种制造用于衬底上的磁性器件的封装封装的方法。 在一个实施例中，该方法包括在衬底上提供磁芯并将屏蔽结构放置在磁芯上方以在其周围形成腔室。 该方法还包括在腔室内围绕磁芯的一部分沉积密封剂。 屏蔽结构限制了进入腔室的密封剂。

    System and method for empirically determining shrinkage stresses in a molded package and power module employing the same
    2.
    发明授权
    System and method for empirically determining shrinkage stresses in a molded package and power module employing the same 失效
    用于经验地确定模制包装中的收缩应力的系统和方法以及使用该收缩应力的功率模块

    公开(公告)号：US5925827A

    公开(公告)日：1999-07-20

    申请号：US938619

    申请日：1997-09-25

    申请人： Ashraf W. Lotfi ,  John D. Weld

    发明人： Ashraf W. Lotfi ,  John D. Weld

    IPC分类号： G01B7/24 ,  G01B7/16

    CPC分类号： G01B7/24

    摘要： A system for, and method of, empirically determining stress in a molded package and a power module embodying the system or the method. In one embodiment, the system includes: (1) a sensor, having a magnetic core exhibiting a known complex permeability in a control environment, that is embedded within the molded package and therefore subject to the stress and (2) a measurement circuit, coupled to the sensor, that applies a drive signal to the sensor, measures a response signal received from the sensor and uses the drive signal and the response signal to determine a complex permeability under stress of the core. The magnitude of the stress can then be determined from the core's complex permeability under stress.

    摘要翻译： 经验地确定模制包装中的应力的系统和方法以及体现该系统或方法的功率模块。 在一个实施例中，系统包括：（1）传感器，其具有在控制环境中呈现已知复合磁导率的磁芯，其嵌入在模制封装内并因此受到应力的影响，以及（2）测量电路 对传感器施加驱动信号给传感器，测量从传感器接收到的响应信号，并使用驱动信号和响应信号来确定芯的应力下的复数磁导率。 然后可以从应力下的核心复合渗透率确定应力的大小。

    Method of manufacturing a power module
    3.
    发明授权
    Method of manufacturing a power module 有权
    电源模块的制造方法

    公开(公告)号：US08528190B2

    公开(公告)日：2013-09-10

    申请号：US12196062

    申请日：2008-08-21

    申请人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

    发明人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

    IPC分类号： H01F7/128

    CPC分类号： H01F41/005 ,  H01F17/043 ,  H01F27/027 ,  H01F27/255 ,  H01F27/365 ,  H05K3/284 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49069 ,  Y10T29/49073 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49171

    摘要： A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure with a baffle over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber and the baffle directs the encapsulant away from the magnetic core thereby limiting an amount of the encapsulant that contacts the magnetic core within the chamber.

    摘要翻译： 一种在基板上制造功率模块的方法。 在一个实施例中，该方法包括提供功率转换电路，包括提供具有磁芯和至少一个开关的磁性装置。 该方法还包括将具有挡板的屏蔽结构放置在磁芯上以在其周围形成腔室。 该方法还包括在功率转换电路周围沉积密封剂。 屏蔽结构限制了进入腔室的密封剂，并且挡板将密封剂引导离开磁芯，从而限制了在腔室内接触磁芯的密封剂的量。

    Method of Manufacturing a Power Module
    7.
    发明申请
    Method of Manufacturing a Power Module 有权
    制造功率模块的方法

    公开(公告)号：US20080301929A1

    公开(公告)日：2008-12-11

    申请号：US12196062

    申请日：2008-08-21

    申请人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

    发明人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

    IPC分类号： H01F7/06

    CPC分类号： H01F41/005 ,  H01F17/043 ,  H01F27/027 ,  H01F27/255 ,  H01F27/365 ,  H05K3/284 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49069 ,  Y10T29/49073 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49171

    摘要： A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber thereby allowing the encapsulant to surround a portion of the magnetic core within the chamber.

    摘要翻译： 一种在基板上制造功率模块的方法。 在一个实施例中，该方法包括提供功率转换电路，包括提供具有磁芯和至少一个开关的磁性装置。 该方法还包括将屏蔽结构放置在磁芯上方以在其周围形成腔室。 该方法还包括在功率转换电路周围沉积密封剂。 屏蔽结构限制了进入腔室的密封剂，从而允许密封剂围绕室内的磁芯的一部分。

    Power module
    8.
    发明授权
    Power module 有权
    电源模块

    公开(公告)号：US07256674B2

    公开(公告)日：2007-08-14

    申请号：US10985826

    申请日：2004-11-10

    申请人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

    发明人： Ashraf W. Lotfi ,  Mathew Wilkowski ,  John D. Weld

    IPC分类号： H01F27/02

    CPC分类号： H01F27/027 ,  H01F27/022 ,  H01F27/365 ,  H02M3/10

    摘要： A power module located on a substrate. In one embodiment, the power module includes power conversion circuitry with a magnetic device and at least one switch. The magnetic device includes a magnetic core with a shielding structure located about the magnetic core configured to create a chamber thereabout. The power module also includes an encapsulant about the power conversion circuitry. The shielding structure is configured to limit the encapsulant entering the chamber thereby allowing the encapsulant to surround a portion of the magnetic core within the chamber.

    摘要翻译： 位于基板上的功率模块。 在一个实施例中，功率模块包括具有磁性装置和至少一个开关的功率转换电路。 磁性装置包括具有围绕磁芯定位的屏蔽结构的磁芯，该磁芯配置成在其周围产生室。 功率模块还包括关于功率转换电路的密封剂。 屏蔽结构被配置为限制进入腔室的密封剂，从而允许密封剂围绕室内的磁芯的一部分。

    Multifunction lead frame and integrated circuit package incorporating the same
    9.
    发明授权
    Multifunction lead frame and integrated circuit package incorporating the same 有权
    多功能引线框和集成电路封装结合在一起

    公开(公告)号：US06351033B1

    公开(公告)日：2002-02-26

    申请号：US09413605

    申请日：1999-10-06

    申请人： Ashraf W. Lotfi ,  John D. Weld

    发明人： Ashraf W. Lotfi ,  John D. Weld

    IPC分类号： H05K502

    CPC分类号： H01L23/49541 ,  H01F2021/125 ,  H01L23/642 ,  H01L23/645 ,  H01L2924/0002 ,  Y10S257/924 ,  H01L2924/00

    摘要： The present invention provides a lead frame for use in packaging a circuit having a discrete component, and a method of manufacture thereof. In one embodiment, the lead frame includes a lead support structure and a plurality of severable leads that are coupled to the lead support structure. The plurality of severable leads extend inward from the lead support structure to predetermined locations corresponding to terminals of the discrete component.

    摘要翻译： 本发明提供一种用于封装具有分立元件的电路的引线框及其制造方法。 在一个实施例中，引线框架包括引线支撑结构和耦合到引线支撑结构的多个可分离引线。 多个可分离引线从引线支撑结构向内延伸到对应于分立元件的端子的预定位置。