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公开(公告)号：US20100284160A1
公开(公告)日：2010-11-11
申请号：US12777186
申请日：2010-05-10
CPC分类号： H05K7/10 , H01F17/062 , H01F27/02 , H01F27/027 , H01F27/263 , H01F2038/006 , H02M1/126 , H05K3/303 , Y10T29/49002 , Y10T29/49004 , Y10T29/49144
摘要： A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non-conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.
摘要翻译： 一种用于电气连接和封装电子部件的装置。 在一个实施例中，提供了具有一个或多个部件凹部和形成在其中的多个引线通道的模块化非导电基座部件。 至少一个电子部件设置在凹部内，并且部件的引线引导通过引线通道到导电引线端子。 适于与非导电基底构件配合的多个引线端子被容纳在其中，并且适于将装置与外部印刷电路板信号通信。 模块化非导电基座构件被组装或堆叠以形成整体模块化组件。 还公开了用于制造该器件的方法。
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公开(公告)号：US07942700B2
公开(公告)日：2011-05-17
申请号：US12777186
申请日：2010-05-10
IPC分类号： H01R13/66
CPC分类号： H05K7/10 , H01F17/062 , H01F27/02 , H01F27/027 , H01F27/263 , H01F2038/006 , H02M1/126 , H05K3/303 , Y10T29/49002 , Y10T29/49004 , Y10T29/49144
摘要： A device for electrically interconnecting and packaging electronic components. In one embodiment, a modular non-conducting base member having one or more component recesses and a plurality of lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the wire leads of the component routed through the lead channels to a conductive lead terminal. A plurality of lead terminals, adapted to cooperate with the non-conducting base member, are received therein, and adapted to place the device in signal communication with an external printed circuit board. The modular non-conducting base members are assembled or stacked to form a unitary modular assembly. Methods for fabricating the device are also disclosed.
摘要翻译： 一种用于电气连接和封装电子部件的装置。 在一个实施例中，提供了具有一个或多个部件凹部和形成在其中的多个引线通道的模块化非导电基座部件。 至少一个电子元件设置在凹槽内，并且元件的引线引导通过引线通道到导电引线端子。 适于与非导电基底构件配合的多个引线端子被容纳在其中，并且适于将装置与外部印刷电路板信号通信。 模块化非导电基座构件被组装或堆叠以形成整体模块化组件。 还公开了用于制造该器件的方法。
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公开(公告)号：US08754734B2
公开(公告)日：2014-06-17
申请号：US13023041
申请日：2011-02-08
摘要： A low cost, low profile, small size and high performance electronic device for use in, e.g., electronic circuits where a transformer or inductor is required. In one exemplary embodiment, the device includes a self-leaded header made from a unitary construction. The header includes a vertically oriented winding post that obviates the need for e.g. a binocular aperture type configuration. Methods for manufacturing the device are also disclosed.
摘要翻译： 用于例如需要变压器或电感器的电子电路的低成本，低外形，小尺寸和高性能的电子设备。 在一个示例性实施例中，该装置包括由单一构造制成的自引导头。 头部包括垂直定向的缠绕柱，其不需要例如 双目孔型配置。 还公开了用于制造器件的方法。
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公开(公告)号：US08591262B2
公开(公告)日：2013-11-26
申请号：US12876003
申请日：2010-09-03
CPC分类号： H01F5/003 , H01F17/0013 , H01F2017/002
摘要： Methods and apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a substrate based inductive device which utilizes inserted conductive pins in combination with plated substrates which replace windings disposed around a magnetically permeable core. In some variations this is accomplished without a header disposed between adjacent substrates while alternative variations utilize a header. In another embodiment, the substrate inductive devices are incorporated into integrated connector modules. Methods of manufacturing and utilizing the aforementioned substrate based inductive devices and integrated connector modules are also disclosed.
摘要翻译： 提供低成本，高精度感应装置的方法和装置。 在一个实施例中，感应装置包括基于基板的感应装置，其利用插入的导电针与电镀基板组合，该电镀基板替代设置在磁导芯周围的绕组。 在一些变型中，这是在不设置在相邻基板之间的头部的情况下实现的，而替代变型使用头部。 在另一个实施例中，衬底感应器件被并入集成的连接器模块中。 还公开了制造和利用上述基板的感应装置和集成连接器模块的方法。
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公开(公告)号：US20110193669A1
公开(公告)日：2011-08-11
申请号：US13023041
申请日：2011-02-08
IPC分类号： H01F27/29
摘要： A low cost, low profile, small size and high performance electronic device for use in, e.g., electronic circuits where a transformer or inductor is required. In one exemplary embodiment, the device includes a self-leaded header made from a unitary construction. The header includes a vertically oriented winding post that obviates the need for e.g. a binocular aperture type configuration. Methods for manufacturing the device are also disclosed.
摘要翻译： 用于例如需要变压器或电感器的电子电路的低成本，低外形，小尺寸和高性能的电子设备。 在一个示例性实施例中，该装置包括由单一构造制成的自引导头。 头部包括垂直定向的缠绕柱，其不需要例如 双目孔型配置。 还公开了用于制造器件的方法。
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公开(公告)号：US07982572B2
公开(公告)日：2011-07-19
申请号：US12503682
申请日：2009-07-15
IPC分类号： H01F5/00
CPC分类号： H01F17/0033 , H01F17/062 , H01F27/40 , H01F41/046 , H05K1/165 , Y10T29/4902
摘要： Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.
摘要翻译： 用于提供低成本和高精度感应装置的方法和装置。 在一个实施例中，感应装置包括具有延伸端的多个通孔，其替代设置在磁导芯周围的绕组。 在另一个实施例中，感应装置包括有线中心芯以及具有延伸端的多个通孔，其作为围绕磁导芯的绕组。 在本发明的第二方面，公开了一种制造上述感应装置以及有线核心中心的方法。
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公开(公告)号：US20120058676A1
公开(公告)日：2012-03-08
申请号：US12876003
申请日：2010-09-03
CPC分类号： H01F5/003 , H01F17/0013 , H01F2017/002
摘要： Methods and apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a substrate based inductive device which utilizes inserted conductive pins in combination with plated substrates which replace windings disposed around a magnetically permeable core. In some variations this is accomplished without a header disposed between adjacent substrates while alternative variations utilize a header. In another embodiment, the substrate inductive devices are incorporated into integrated connector modules. Methods of manufacturing and utilizing the aforementioned substrate based inductive devices and integrated connector modules are also disclosed.
摘要翻译： 提供低成本，高精度感应装置的方法和装置。 在一个实施例中，感应装置包括基于基板的感应装置，其利用插入的导电针与电镀基板组合，该电镀基板替代设置在磁导芯周围的绕组。 在一些变型中，这是在不设置在相邻基板之间的头部的情况下实现的，而替代变型使用头部。 在另一个实施例中，衬底感应器件被并入集成的连接器模块中。 还公开了制造和利用上述基板的感应装置和集成连接器模块的方法。
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公开(公告)号：US20100013589A1
公开(公告)日：2010-01-21
申请号：US12503682
申请日：2009-07-15
CPC分类号： H01F17/0033 , H01F17/062 , H01F27/40 , H01F41/046 , H05K1/165 , Y10T29/4902
摘要： Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.
摘要翻译： 用于提供低成本和高精度感应装置的方法和装置。 在一个实施例中，感应装置包括具有延伸端的多个通孔，其替代设置在磁导芯周围的绕组。 在另一个实施例中，感应装置包括有线中心芯以及具有延伸端的多个通孔，其作为围绕磁导芯的绕组。 在本发明的第二方面，公开了一种制造上述感应装置以及有线核心中心的方法。
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公开(公告)号：US20130033353A1
公开(公告)日：2013-02-07
申请号：US13567834
申请日：2012-08-06
IPC分类号： H01F17/04
CPC分类号： H01F17/0033 , H01F17/062 , H01F27/40 , H01F41/046 , H05K1/165 , Y10T29/4902
摘要： Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.
摘要翻译： 用于提供低成本和高精度感应装置的方法和装置。 在一个实施例中，感应装置包括具有延伸端的多个通孔，其替代设置在磁导芯周围的绕组。 在另一个实施例中，感应装置包括有线中心芯以及具有延伸端的多个通孔，其作为围绕磁导芯的绕组。 在本发明的第二方面，公开了一种制造上述感应装置以及有线核心中心的方法。
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公开(公告)号：US08860543B2
公开(公告)日：2014-10-14
申请号：US11985156
申请日：2007-11-13
IPC分类号： H01F5/00
CPC分类号： H01F27/2895 , H01F17/0033
摘要： A wire-less inductive device and methods of manufacturing and use are disclosed. In one embodiment, the inductive device comprises a plurality of through-hole vias which act to replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a plurality of connection elements disposed or formed within channels which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices is disclosed. In a third aspect of the invention, an electronics assembly and circuit comprising the wire-less inductive devices are disclosed.
摘要翻译： 公开了一种无线感应装置及其制造和使用方法。 在一个实施例中，感应装置包括多个通孔，其用于替代围绕磁导芯的绕组。 在另一个实施例中，感应装置包括设置或形成在通道内的多个连接元件，其作为围绕磁导芯的绕组。 在本发明的第二方面，公开了一种制造上述电感器件的方法。 在本发明的第三方面中，公开了一种包括无线感应装置的电子组件和电路。
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