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公开(公告)号：US20110193669A1
公开(公告)日：2011-08-11
申请号：US13023041
申请日：2011-02-08
IPC分类号： H01F27/29
摘要： A low cost, low profile, small size and high performance electronic device for use in, e.g., electronic circuits where a transformer or inductor is required. In one exemplary embodiment, the device includes a self-leaded header made from a unitary construction. The header includes a vertically oriented winding post that obviates the need for e.g. a binocular aperture type configuration. Methods for manufacturing the device are also disclosed.
摘要翻译： 用于例如需要变压器或电感器的电子电路的低成本，低外形，小尺寸和高性能的电子设备。 在一个示例性实施例中，该装置包括由单一构造制成的自引导头。 头部包括垂直定向的缠绕柱，其不需要例如 双目孔型配置。 还公开了用于制造器件的方法。
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公开(公告)号：US07982572B2
公开(公告)日：2011-07-19
申请号：US12503682
申请日：2009-07-15
IPC分类号： H01F5/00
CPC分类号： H01F17/0033 , H01F17/062 , H01F27/40 , H01F41/046 , H05K1/165 , Y10T29/4902
摘要： Methods and Apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a plurality of vias having extended ends which replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a wired center core as well as a plurality of vias having extended ends which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices as well as the wired core centers is disclosed.
摘要翻译： 用于提供低成本和高精度感应装置的方法和装置。 在一个实施例中，感应装置包括具有延伸端的多个通孔，其替代设置在磁导芯周围的绕组。 在另一个实施例中，感应装置包括有线中心芯以及具有延伸端的多个通孔，其作为围绕磁导芯的绕组。 在本发明的第二方面，公开了一种制造上述感应装置以及有线核心中心的方法。
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3.发明授权公开(公告)号：US06912781B2
公开(公告)日：2005-07-05
申请号：US10242066
申请日：2002-09-11
CPC分类号： H01L23/32 , H01F27/292 , H01L2224/48091 , H01L2224/48247 , H05K3/301 , H05K3/3426 , Y10T29/49002 , Y10T29/4902 , Y10T29/49121 , Y10T29/49169 , Y10T29/49171 , Y10T29/49179 , H01L2924/00014
摘要： A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a set of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the conductors of the component are routed through the lead channels. A set of insertable lead terminals, adapted to cooperate with the specially shaped lead channels, are received and captured within the lead channels, thereby forming an electrical connection between the lead terminals and the conductors of the electronic component(s). A method of fabricating the device is also disclosed.
摘要翻译： 一种用于电气连接和封装电子部件的装置。 提供了一种具有部件凹部和形成在其中的一组特殊形状的引线通道的非导电底座部件。 至少一个电子部件设置在凹部内，并且部件的导体被引导通过引导通道。 一组可插入的引线端子，适于与特殊形状的引线通道配合，在引线通道内被接收并捕获，从而在引线端子和电子部件的导体之间形成电连接。 还公开了一种制造该器件的方法。
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公开(公告)号：US06769936B2
公开(公告)日：2004-08-03
申请号：US10139907
申请日：2002-05-06
IPC分类号： H01R2400
CPC分类号： H01R13/6641 , H01R13/6658 , H01R13/7175 , H01R24/64
摘要： An advanced modular plug connector assembly incorporating a substantially planar, low profile removable insert assembly with associated substrate disposed in the rear portion of the connector housing, the substrate adapted to optionally receive one or more electronic components. In one embodiment, the connector assembly comprises a single port with a single insert assembly. The conductors and terminals of the connector are retained within respective molded carriers which are received within the insert assembly. A plurality of light sources (e.g., LEDs) are also received within the housing, the conductors of the LEDs mated with conductive traces on the substrate of the insert assembly. In another embodiment, the connector assembly comprises a multi-port “1×N” device. Methods for manufacturing the aforementioned embodiments are also disclosed.
摘要翻译： 一种先进的模块化插头连接器组件，其包括基本上平面的低轮廓可移除插入组件，其具有设置在连接器壳体的后部中的相关联的衬底，该衬底适于可选地接收一个或多个电子部件。 在一个实施例中，连接器组件包括具有单个插入组件的单个端口。 连接器的导体和端子保持在相应的模制载体内，这些载体被接收在插入组件内。 多个光源（例如，LED）也被容纳在壳体内，LED的导体与插入组件的基板上的导电迹线配合。 在另一个实施例中，连接器组件包括多端口“1xN”设备。 还公开了用于制造上述实施例的方法。
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公开(公告)号：US5212345A
公开(公告)日：1993-05-18
申请号：US825148
申请日：1992-01-24
申请人： Aurelio J. Gutierrez
发明人： Aurelio J. Gutierrez
IPC分类号： H01F27/29
CPC分类号： H01F27/292
摘要： A self leaded header for surface mounting of a circuit element to a PC board comprises a generally box-like support body having a cavity for mounting a circuit element, the support body having a base and a plurality of feet extending downward from the base for supporting the same on a PC board, a plurality of lead support members having a generally spool configuration extending generally horizontally outward from the support body adjacent the base, an inductance coil mounted in the cavity, and a lead extending from the coil to and wound multiple turns around each of the lead support members and disposed for surface bonding to a PC board.
摘要翻译： 用于将电路元件表面安装到PC板的自引导头部包括具有用于安装电路元件的空腔的通常为盒状的支撑体，所述支撑体具有基部和从底部向下延伸的多个脚，用于支撑 在PC板上相同的多个引线支撑构件具有大体上的线轴构造，其大致水平地从邻近基座的支撑体向外延伸，安装在空腔中的电感线圈以及从线圈延伸并绕过多圈的引线 围绕每个引线支撑构件并且被布置用于表面结合到PC板。
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公开(公告)号：US08754734B2
公开(公告)日：2014-06-17
申请号：US13023041
申请日：2011-02-08
摘要： A low cost, low profile, small size and high performance electronic device for use in, e.g., electronic circuits where a transformer or inductor is required. In one exemplary embodiment, the device includes a self-leaded header made from a unitary construction. The header includes a vertically oriented winding post that obviates the need for e.g. a binocular aperture type configuration. Methods for manufacturing the device are also disclosed.
摘要翻译： 用于例如需要变压器或电感器的电子电路的低成本，低外形，小尺寸和高性能的电子设备。 在一个示例性实施例中，该装置包括由单一构造制成的自引导头。 头部包括垂直定向的缠绕柱，其不需要例如 双目孔型配置。 还公开了用于制造器件的方法。
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公开(公告)号：US08591262B2
公开(公告)日：2013-11-26
申请号：US12876003
申请日：2010-09-03
CPC分类号： H01F5/003 , H01F17/0013 , H01F2017/002
摘要： Methods and apparatus for providing a low-cost and high-precision inductive device. In one embodiment, the inductive device comprises a substrate based inductive device which utilizes inserted conductive pins in combination with plated substrates which replace windings disposed around a magnetically permeable core. In some variations this is accomplished without a header disposed between adjacent substrates while alternative variations utilize a header. In another embodiment, the substrate inductive devices are incorporated into integrated connector modules. Methods of manufacturing and utilizing the aforementioned substrate based inductive devices and integrated connector modules are also disclosed.
摘要翻译： 提供低成本，高精度感应装置的方法和装置。 在一个实施例中，感应装置包括基于基板的感应装置，其利用插入的导电针与电镀基板组合，该电镀基板替代设置在磁导芯周围的绕组。 在一些变型中，这是在不设置在相邻基板之间的头部的情况下实现的，而替代变型使用头部。 在另一个实施例中，衬底感应器件被并入集成的连接器模块中。 还公开了制造和利用上述基板的感应装置和集成连接器模块的方法。
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公开(公告)号：US20080233803A1
公开(公告)日：2008-09-25
申请号：US12074112
申请日：2008-02-28
申请人： Victor H. Renteria , Aurelio J. Gutierrez , William Mahlerbe , Gary L. Hurd , Russell L. Machado
发明人： Victor H. Renteria , Aurelio J. Gutierrez , William Mahlerbe , Gary L. Hurd , Russell L. Machado
IPC分类号： H01R13/66
CPC分类号： H01R13/66 , H01R12/70 , H01R13/6658 , H01R13/719 , H01R13/7193 , H01R24/64 , H05K1/0233 , H05K1/18 , H05K2201/1003 , H05K2201/1006 , H05K2201/10189 , H05K2201/10515 , H05K2201/10537 , H05K2201/10568 , H05K2201/2036
摘要： An electrical connector mountable on a printed circuit board. In one embodiment, the electrical connector comprises an insulative housing comprising one or more electronic components, a plurality of electrical conductors in signal communication with the electronic components and adapted to interface with a plug and a plurality of terminals in signal communication with the one or more electronic components. In one aspect, the plurality of terminals are adapted to interface with one or more externally mounted electronic components on the printed circuit board thereby filtering signals passing between the electrical conductors and the printed circuit board, with the externally mounted electronic components mounted within the footprint of the electrical connector. Methods of manufacture for the aforementioned electrical connector and business methods are also disclosed.
摘要翻译： 可安装在印刷电路板上的电连接器。 在一个实施例中，电连接器包括绝缘壳体，该绝缘壳体包括一个或多个电子部件，与电子部件信号通信的多个电导体，并且适于与插头和多个终端进行信号通信，该多个终端与一个或多个 电子元器件。 在一个方面，多个端子适于与印刷电路板上的一个或多个外部安装的电子部件接合，从而过滤在电导体和印刷电路板之间通过的信号，其中外部安装的电子部件安装在 电连接器。 还公开了上述电连接器的制造方法和业务方法。
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公开(公告)号：US06593840B2
公开(公告)日：2003-07-15
申请号：US09773134
申请日：2001-01-31
IPC分类号： H01F2729
CPC分类号： H01L23/32 , H01F27/292 , H01L2224/48091 , H01L2224/48247 , H05K3/301 , H05K3/3426 , Y10T29/49002 , Y10T29/4902 , Y10T29/49121 , Y10T29/49169 , Y10T29/49171 , Y10T29/49179 , H01L2924/00014
摘要： A device for electrically interconnecting and packaging electronic components. A non-conducting base member having a component recess and a set of specially shaped lead channels formed therein is provided. At least one electronic component is disposed within the recess, and the conductors of the component are routed through the lead channels. A set of insertable lead terminals, adapted to cooperate with the specially shaped lead channels, are received and captured within the lead channels, thereby forming an electrical connection between the lead terminals and the conductors of the electronic component(s). A method of fabricating the device is also disclosed.
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公开(公告)号：US08860543B2
公开(公告)日：2014-10-14
申请号：US11985156
申请日：2007-11-13
IPC分类号： H01F5/00
CPC分类号： H01F27/2895 , H01F17/0033
摘要： A wire-less inductive device and methods of manufacturing and use are disclosed. In one embodiment, the inductive device comprises a plurality of through-hole vias which act to replace windings disposed around a magnetically permeable core. In another embodiment, the inductive device comprises a plurality of connection elements disposed or formed within channels which act as windings disposed around a magnetically permeable core. In a second aspect of the invention, a method of manufacturing the aforementioned inductive devices is disclosed. In a third aspect of the invention, an electronics assembly and circuit comprising the wire-less inductive devices are disclosed.
摘要翻译： 公开了一种无线感应装置及其制造和使用方法。 在一个实施例中，感应装置包括多个通孔，其用于替代围绕磁导芯的绕组。 在另一个实施例中，感应装置包括设置或形成在通道内的多个连接元件，其作为围绕磁导芯的绕组。 在本发明的第二方面，公开了一种制造上述电感器件的方法。 在本发明的第三方面中，公开了一种包括无线感应装置的电子组件和电路。
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