公开(公告)号：US3926747A

公开(公告)日：1975-12-16

申请号：US44362474

申请日：1974-02-19

Applicant: BELL TELEPHONE LABOR INC

Inventor： NEWBY KENNETH RUSS ,  WINTERS EARL DALLAS

IPC: C25D3/48 ,  C25D5/02 ,  H01L21/288 ,  H01L23/485 ,  H05K3/24 ,  C25D5/10

CPC classification number: H01L21/2885 ,  C25D3/48 ,  C25D5/02 ,  H01L23/485 ,  H01L2924/0002 ,  H05K3/243 ,  Y10S204/07 ,  H01L2924/00

Abstract: In metallizing semiconductor devices of the beam-lead type, electrode and connector surfaces are fabricated by depositing a first layer of titanium on the semiconductor surface, followed by depositing a second layer of either platinum or palladium on the titanium. After a photoresist step in which the second layer is patterned to bare portions of the titanium layer, gold is then selectively electrodeposited on the second layer by limiting the maximum potential that may be attained during plating. Masking the titanium layer during gold electrodeposition is thereby avoided.

公开(公告)号：US3873428A

公开(公告)日：1975-03-25

申请号：US44362574

申请日：1974-02-19

Applicant: BELL TELEPHONE LABOR INC

Inventor： WINTERS EARL DALLAS

IPC: C25D3/48 ,  C25D5/02 ,  H01L21/288 ,  H01L23/485 ,  H05K3/24 ,  C23B5/48 ,  C23B5/24

CPC classification number: H01L21/2885 ,  C25D3/48 ,  C25D5/02 ,  H01L23/485 ,  H01L2924/0002 ,  H05K3/241 ,  H05K3/243 ,  H05K3/244 ,  H01L2924/00

Abstract: Selective soft gold electroplating of noble metal regions on composite surfaces, including exposed titanium regions, is expedited by small lead addition to the electroplating bath. Improvement in selectivity most evident subsequent to the onset of plating permits increasing plating voltage and corresponding increase in plating density. The procedure is applicable to the fabrication of silicon integrated circuits.

Abstract translation: 复合表面上的贵金属区域的选择性软金电镀，包括暴露的钛区域，通过电镀浴中的小铅加速。 电镀开始后最明显的选择性的提高允许增加电镀电压和电镀密度的相应增加。 该程序适用于硅集成电路的制造。