公开(公告)号：US20050020001A1

公开(公告)日：2005-01-27

申请号：US10927259

申请日：2004-08-25

申请人： Brian Aegerter ,  Curt Dundas ,  Michael Jolley ,  Tom Ritzdorf ,  Steven Peace ,  Gary Curtis ,  Raymon Thompson

发明人： Brian Aegerter ,  Curt Dundas ,  Michael Jolley ,  Tom Ritzdorf ,  Steven Peace ,  Gary Curtis ,  Raymon Thompson

IPC分类号： H01L21/00 ,  H01L21/3213 ,  H01L21/8238

CPC分类号： H01L21/67017 ,  H01L21/32134 ,  H01L21/6708

摘要： In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral-margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

摘要翻译： 在用于处理诸如半导体晶片的工件的处理中，处理流体被选择性地从工件的前侧或后侧中的至少一个的外周边缘施加或排除。 通过在工件和保持工件的反应器旋转的同时将一种或多种加工流体施加到工件来发生加工流体的排除和/或应用。 处理流体的流量，流体压力和/或旋转速率用于控制从外周边缘选择性地施加或排除处理流体的程度。

公开(公告)号：US20050032391A1

公开(公告)日：2005-02-10

申请号：US10941346

申请日：2004-09-14

申请人： Steven L. Peace ,  Gary Curtis ,  Raymon Thompson ,  Brian Aegerter ,  Curt Dundas

发明人： Steven L. Peace ,  Gary Curtis ,  Raymon Thompson ,  Brian Aegerter ,  Curt Dundas

IPC分类号： H01L21/306 ,  B08B3/04 ,  H01L21/00 ,  H01L21/3213 ,  H01L21/302 ,  H01L21/461

CPC分类号： H01L21/6715 ,  B08B3/04 ,  H01L21/32134 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S118/90 ,  Y10S438/906 ,  Y10S438/913

摘要： An apparatus for processing a semiconductor wafer or similar article includes a reactor having a processing chamber formed by upper and lower rotors. The wafer is supported between the rotors. The rotors are rotated by a spin motor. A processing fluid is introduced onto the top or bottom surface of the wafer, or onto both surfaces, at a central location. The fluid flows outwardly uniformly and in all directions. A wafer support automatically lifts the wafer, so that it can be removed from the reactor by a robot, when the rotors separate from each other after processing.

摘要翻译： 用于处理半导体晶片或类似物品的装置包括具有由上下转子形成的处理室的反应器。 晶片支撑在转子之间。 转子由旋转电机旋转。 处理流体在中心位置被引入到晶片的顶表面或底表面上，或在两个表面上。 流体向外均匀地向各个方向流动。 晶片支架自动提升晶片，从而当转子在加工后彼此分离时，它可以由机器人从反应器中移出。

公开(公告)号：US20060040111A1

公开(公告)日：2006-02-23

申请号：US10922762

申请日：2004-08-20

申请人： Kert Dolechek ,  Raymon Thompson

发明人： Kert Dolechek ,  Raymon Thompson

IPC分类号： B32B13/04 ,  B32B9/04

CPC分类号： H01L21/6708 ,  H01L21/67126 ,  H01L21/67313 ,  H01L21/67754

摘要： The present invention provides a system and method for processing batches of semiconductor wafers or workpieces. The system includes placing a batch of workpieces in a carrier that is loaded into a rotor assembly in a process chamber. The process chamber has a two spray manifolds with a dual inlet ports, and radially opposing vent and drain troughs extending from substantially a first end of a chamber body to substantially the second end of the chamber body. In the process chamber a variety of process fluids are sprayed on the workpieces to process the workpieces.

摘要翻译： 本发明提供一种用于处理半导体晶片或工件批次的系统和方法。 该系统包括将一批工件放置在载入到处理室中的转子组件中的载体中。 处理室具有两个具有双入口端口的喷射歧管，以及径向相对的排气槽和排水槽，其从室主体的基本上的第一端延伸到室主体的基本上的第二端。 在处理室中，各种工艺流体喷涂在工件上以处理工件。

公开(公告)号：US20070026772A1

公开(公告)日：2007-02-01

申请号：US11191385

申请日：2005-07-28

申请人： Kert Dolechek ,  Raymon Thompson

发明人： Kert Dolechek ,  Raymon Thompson

IPC分类号： B24B47/00

CPC分类号： B24B7/228 ,  B24B41/068 ,  H01L21/67126 ,  H01L21/6838

摘要： The present invention provides a chuck for receiving and supporting a semiconductor workpiece for processing. The chuck includes a body for supporting the workpiece. The body is porous or has a plurality of openings, apertures or channels. A compressible corrosion resistant member is disposed around the outer periphery of the supporting body. The chuck includes a means for evacuating air from the pores or plurality of openings, apertures or channels in the body to create a vacuum. In operation, a workpiece is placed onto the supporting body. The device side of the workpiece is preferably placed on the compressible corrosion resistant member. Upon evacuating the air (or other gas) from the pores or openings in the supporting body, a vacuum is created, drawing the workpiece toward the supporting body. A seal is created and maintained between the device side of the workpiece and the compressible corrosion resistant member. Consequently, the entire backside of the workpiece is exposed for processing while at the same time the device side of the workpiece is protected from any potentially damaging process fluids. By exposing the backside of the workpiece to a chemical etchant, semiconductor workpieces can be thinned to a desired thickness.

摘要翻译： 本发明提供一种用于接收和支撑用于处理的半导体工件的卡盘。 卡盘包括用于支撑工件的主体。 身体是多孔的或具有多个开口，孔或通道。 可压缩耐腐蚀构件设置在支撑体的外周周围。 卡盘包括用于从空气或多个开口，身体中的孔或通道排出空气以产生真空的装置。 在操作中，将工件放置在支撑体上。 工件的装置侧优选地放置在可压缩耐腐蚀构件上。 在将空气（或其他气体）从支撑体中的孔或开口抽出时，产生真空，将工件拉向支撑体。 在工件的装置侧和可压缩耐腐蚀构件之间形成并保持密封。 因此，工件的整个背面被暴露用于加工，同时工件的装置侧被保护以免任何潜在的破坏性的工艺流体。 通过将工件的背面暴露于化学蚀刻剂，半导体工件可以被薄化到所需的厚度。

公开(公告)号：US20060203418A1

公开(公告)日：2006-09-14

申请号：US11420512

申请日：2006-05-26

申请人： Kert Dolechek ,  Raymon Thompson

发明人： Kert Dolechek ,  Raymon Thompson

IPC分类号： H01L21/683

CPC分类号： H01L29/06 ,  H01L21/302 ,  H01L21/30604 ,  H01L21/3083 ,  H01L21/67126 ,  H01L21/68735 ,  Y10S438/959

摘要： The present invention provides system and apparatus for use in processing wafers. The new system and apparatus allows for the production of thinner wafers that at same time remain strong. As a result, the wafers produced by the present process are less susceptible to breaking. The unique system also offers an improved structure for handling thinned wafers and reduces the number of processing steps. This results in improved yields and improved process efficiency.

摘要翻译： 本发明提供了用于处理晶片的系统和装置。 新的系统和设备允许生产更薄的晶片，同时保持坚固。 结果，由本方法生产的晶片不易破裂。 独特的系统还提供了改进的处理薄化晶片的结构，并减少了处理步骤的数量。 这导致产量提高和工艺效率提高。

公开(公告)号：US20060203419A1

公开(公告)日：2006-09-14

申请号：US11420591

申请日：2006-05-26

申请人： Kert Dolechek ,  Raymon Thompson

发明人： Kert Dolechek ,  Raymon Thompson

IPC分类号： H01T23/00

CPC分类号： H01L29/06 ,  H01L21/302 ,  H01L21/30604 ,  H01L21/3083 ,  H01L21/67126 ,  H01L21/68735 ,  Y10S438/959

摘要： The present invention provides system and apparatus for use in processing wafers. The new system and apparatus allows for the production of thinner wafers that at same time remain strong. As a result, the wafers produced by the present process are less susceptible to breaking. The unique system also offers an improved structure for handling thinned wafers and reduces the number of processing steps. This results in improved yields and improved process efficiency.

公开(公告)号：US20060118515A1

公开(公告)日：2006-06-08

申请号：US10923363

申请日：2004-08-20

申请人： Kert Dolechek ,  Raymon Thompson

发明人： Kert Dolechek ,  Raymon Thompson

IPC分类号： B44C1/22 ,  H01L21/302

CPC分类号： H01L21/6835 ,  H01L2924/3025

摘要： Abstract of the DisclosureThe present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece. Semiconductor workpieces made according to the present invention offer an improved structure for handling thinned wafers in conventional automated equipment. This results in improved yields and improved process efficiency.

摘要翻译： 发明内容本发明提供一种用于处理半导体工件的装置和方法。 新的设备和方法允许生产更薄的工件，同时保持坚固。 特别地，提供一种卡盘，其包括主体，可移除地附接到主体的保持器和密封形成构件。 当将工件放置在卡盘主体上并且保持器与主体接合时，工件后侧的周边部分被保持器覆盖，同时工件后侧的内部区域被暴露。 然后将工件的暴露的背面进行湿化学蚀刻工艺以使工件变薄，并在工件的周边形成由半导体材料组成的相对较厚的边缘。 较厚的边缘或箍将其强度提升到其他脆弱的，变薄的半导体工件。 根据本发明制造的半导体工件提供了用于在常规自动化设备中处理薄化晶片的改进的结构。 这导致产量提高和工艺效率提高。

公开(公告)号：US20060040086A1

公开(公告)日：2006-02-23

申请号：US10923132

申请日：2004-08-20

申请人： Kert Dolechek ,  Raymon Thompson

发明人： Kert Dolechek ,  Raymon Thompson

IPC分类号： B32B3/02 ,  B32B13/04 ,  H01L29/12

CPC分类号： H01L21/68721 ,  H01L21/67126 ,  Y10T428/12528 ,  Y10T428/21 ,  Y10T428/219

摘要： The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece. Semiconductor workpieces made according to the present invention offer an improved structure for handling thinned wafers in conventional automated equipment. This results in improved yields and improved process efficiency.

摘要翻译： 本发明提供一种用于处理半导体工件的装置和方法。 新的设备和方法允许生产更薄的工件，同时保持坚固。 特别地，提供一种卡盘，其包括主体，可移除地附接到主体的保持器和密封形成构件。 当将工件放置在卡盘主体上并且保持器与主体接合时，工件后侧的周边部分被保持器覆盖，同时工件后侧的内部区域被暴露。 然后将工件的暴露的背面进行湿化学蚀刻工艺以使工件变薄，并在工件的周边形成由半导体材料组成的相对较厚的边缘。 较厚的边缘或箍将其强度提升到其他脆弱的，变薄的半导体工件。 根据本发明制造的半导体工件提供了用于在常规自动化设备中处理薄化晶片的改进的结构。 这导致产量提高和工艺效率提高。

公开(公告)号：US20060040467A1

公开(公告)日：2006-02-23

申请号：US10923131

申请日：2004-08-20

申请人： Kert Dolechek ,  Raymon Thompson

发明人： Kert Dolechek ,  Raymon Thompson

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L29/06 ,  H01L21/302 ,  H01L21/30604 ,  H01L21/3083 ,  H01L21/67126 ,  H01L21/68735 ,  Y10S438/959

摘要： The present invention provides system and apparatus for use in processing wafers. The new system and apparatus allows for the production of thinner wafers that at same time remain strong. As a result, the wafers produced by the present process are less susceptible to breaking. The unique system also offers an improved structure for handling thinned wafers and reduces the number of processing steps. This results in improved yields and improved process efficiency.

公开(公告)号：US20080063853A1

公开(公告)日：2008-03-13

申请号：US11977909

申请日：2007-10-26

申请人： Kert Dolechek ,  Raymon Thompson

发明人： Kert Dolechek ,  Raymon Thompson

IPC分类号： B32B27/32

CPC分类号： H01L21/6835 ,  H01L2924/3025

摘要： The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a body, a retainer removeably attached to the body and a seal forming member. When a workpiece is placed on the chuck body and the retainer is engaged to the body, a peripheral portion of the back side of the workpiece is covered by the retainer while an interior region of the back side of the workpiece is exposed. The exposed back side of the workpiece is then subjected to a wet chemical etching process to thin the workpiece and form a relatively thick rim comprised of semiconductor material at the periphery of the workpiece. The thick rim or hoop imparts strength to the otherwise fragile, thinned semiconductor workpiece. Semiconductor workpieces made according to the present invention offer an improved structure for handling thinned wafers in conventional automated equipment. This results in improved yields and improved process efficiency.