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公开(公告)号：US11613002B2
公开(公告)日：2023-03-28
申请号：US16990775
申请日：2020-08-11
Applicant: BROOKS AUTOMATION, INC.
IPC: B25J9/04
Abstract: A substrate processing apparatus including a frame, a first arm coupled to the frame at a shoulder axis having a first upper arm, a first forearm and at least one substrate holder serially and rotatably coupled to each other, a second arm coupled to the frame at the shoulder axis where shoulder axes of rotation of the arms are substantially coincident, the second arm having a second upper arm, a second forearm and at least one substrate holder serially and rotatably coupled to each other, and a drive section connected to the frame and coupled to the arms, the drive section being configured to independently extend and rotate each arm where an axis of extension of the first arm is angled relative to an axis of extension of the second arm substantially at each angular position of at least one of the first arm or the second arm.
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Patent Agency Ranking
公开(公告)号：US20140178157A1
公开(公告)日：2014-06-26
申请号：US14195086
申请日：2014-03-03
Applicant: Brooks Automation, Inc.
Inventor： Christopher Hofmeister , Martin R. Elliot , Alexander Krupyshev , Joseph Hallisey , Joseph A. Kraus , William Fosnight , Craig J. Carbone , Jeffrey C. Blahnik , Ho Yin Owen Fong
IPC: H01L21/67
CPC classification number: H01L21/67098 , H01L21/67126 , H01L21/6719 , H01L21/67201
Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.
Abstract translation: 公开了一种半导体加工工具，所述工具具有框架，所述框架形成具有开口的至少一个室，并且具有围绕所述开口的周边的密封表面;门构造成与所述密封表面相互作用以密封所述开口，所述门具有侧面 垂直于所述门密封表面并垂直于衬底的传输平面的至少一个驱动器，以及位于所述框架上的至少一个侧面的至少一个驱动器，所述驱动器基本上垂直于所述门密封表面并且基本上垂直于所述传送 所述驱动器具有至少部分地位于所述密封表面前面的致动器，并且所述致动器联接到所述门的一侧以将所述门从密封位置移动。 至少一个驱动器位于衬底转移区的外部。
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公开(公告)号：US08662812B2
公开(公告)日：2014-03-04
申请号：US13625704
申请日：2012-09-24
Applicant: Brooks Automation, Inc.
Inventor： Christopher Hofmeister , Martin R. Elliot , Alexander Krupyshev , Joseph Hallisey , Joseph A. Kraus , William Fosnight , Craig J. Carbone , Jeffrey C. Blahnik , Ho Yin Owen Fong
CPC classification number: H01L21/67098 , H01L21/67126 , H01L21/6719 , H01L21/67201
Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.
Abstract translation: 公开了一种半导体加工工具，所述工具具有框架，所述框架形成具有开口的至少一个室，并且具有围绕所述开口的周边的密封表面;门构造成与所述密封表面相互作用以密封所述开口，所述门具有侧面 垂直于所述门密封表面并垂直于衬底的传输平面的至少一个驱动器，以及位于所述框架上的至少一个侧面的至少一个驱动器，所述驱动器基本上垂直于所述门密封表面并且基本上垂直于所述传送 所述驱动器具有至少部分地位于所述密封表面前面的致动器，并且所述致动器联接到所述门的一侧以将所述门从密封位置移动。 至少一个驱动器位于衬底转移区的外部。
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公开(公告)号：US10737381B2
公开(公告)日：2020-08-11
申请号：US15489449
申请日：2017-04-17
Applicant: BROOKS AUTOMATION, INC.
IPC: B25J9/04
Abstract: A substrate processing apparatus including a frame, a first arm coupled to the frame at a shoulder axis having a first upper arm, a first forearm and at least one substrate holder serially and rotatably coupled to each other, a second arm coupled to the frame at the shoulder axis where shoulder axes of rotation of the arms are substantially coincident, the second arm having a second upper arm, a second forearm and at least one substrate holder serially and rotatably coupled to each other, and a drive section connected to the frame and coupled to the arms, the drive section being configured to independently extend and rotate each arm where an axis of extension of the first arm is angled relative to an axis of extension of the second arm substantially at each angular position of at least one of the first arm or the second arm.
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公开(公告)号：US09478446B2
公开(公告)日：2016-10-25
申请号：US14195086
申请日：2014-03-03
Applicant: Brooks Automation, Inc.
Inventor： Christopher Hofmeister , Martin R. Elliot , Alexander Krupyshev , Joseph Hallisey , Joseph A. Kraus , William Fosnight , Craig J. Carbone , Jeffrey C. Blahnik , Ho Yin Owen Fong
IPC: H01L21/67
CPC classification number: H01L21/67098 , H01L21/67126 , H01L21/6719 , H01L21/67201
Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.
Abstract translation: 公开了一种半导体加工工具，所述工具具有框架，所述框架形成具有开口的至少一个室，并且具有围绕所述开口的周边的密封表面;门构造成与所述密封表面相互作用以密封所述开口，所述门具有侧面 垂直于所述门密封表面并垂直于衬底的传输平面的至少一个驱动器，以及位于所述框架上的至少一个侧面的至少一个驱动器，所述驱动器基本上垂直于所述门密封表面并且基本上垂直于所述传送 所述驱动器具有至少部分地位于所述密封表面前面的致动器，并且所述致动器联接到所述门的一侧以将所述门从密封位置移动。 至少一个驱动器位于衬底转移区的外部。
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公开(公告)号：US20130078057A1
公开(公告)日：2013-03-28
申请号：US13625704
申请日：2012-09-24
Applicant: BROOKS AUTOMATION, INC.
Inventor： Christopher Hofmeister , Martin R. Elliot , Alexander Krupyshev , Joseph Hallisey , Joseph A. Kraus , William Fosnight , Craig J. Carbone , Jeffrey C. Blahnik , Ho Yin Owen Fong
IPC: H01L21/67
CPC classification number: H01L21/67098 , H01L21/67126 , H01L21/6719 , H01L21/67201
Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.
Abstract translation: 公开了一种半导体加工工具，所述工具具有框架，所述框架形成具有开口的至少一个室，并且具有围绕所述开口的周边的密封表面;门构造成与所述密封表面相互作用以密封所述开口，所述门具有侧面 垂直于所述门密封表面并垂直于衬底的传输平面的至少一个驱动器，以及位于所述框架上的至少一个侧面的至少一个驱动器，所述驱动器基本上垂直于所述门密封表面并且基本上垂直于所述传送 所述驱动器具有至少部分地位于所述密封表面前面的致动器，并且所述致动器联接到所述门的一侧以将所述门从密封位置移动。 至少一个驱动器位于衬底转移区的外部。
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