公开(公告)号：US08662812B2

公开(公告)日：2014-03-04

申请号：US13625704

申请日：2012-09-24

Applicant: Brooks Automation, Inc.

Inventor： Christopher Hofmeister ,  Martin R. Elliot ,  Alexander Krupyshev ,  Joseph Hallisey ,  Joseph A. Kraus ,  William Fosnight ,  Craig J. Carbone ,  Jeffrey C. Blahnik ,  Ho Yin Owen Fong

IPC: H01L21/67 ,  F16K25/00

CPC classification number: H01L21/67098 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67201

Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

Abstract translation: 公开了一种半导体加工工具，所述工具具有框架，所述框架形成具有开口的至少一个室，并且具有围绕所述开口的周边的密封表面;门构造成与所述密封表面相互作用以密封所述开口，所述门具有侧面 垂直于所述门密封表面并垂直于衬底的传输平面的至少一个驱动器，以及位于所述框架上的至少一个侧面的至少一个驱动器，所述驱动器基本上垂直于所述门密封表面并且基本上垂直于所述传送 所述驱动器具有至少部分地位于所述密封表面前面的致动器，并且所述致动器联接到所述门的一侧以将所述门从密封位置移动。 至少一个驱动器位于衬底转移区的外部。

公开(公告)号：US09478446B2

公开(公告)日：2016-10-25

申请号：US14195086

申请日：2014-03-03

Applicant: Brooks Automation, Inc.

Inventor： Christopher Hofmeister ,  Martin R. Elliot ,  Alexander Krupyshev ,  Joseph Hallisey ,  Joseph A. Kraus ,  William Fosnight ,  Craig J. Carbone ,  Jeffrey C. Blahnik ,  Ho Yin Owen Fong

IPC: H01L21/67

CPC classification number: H01L21/67098 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67201

Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

Abstract translation: 公开了一种半导体加工工具，所述工具具有框架，所述框架形成具有开口的至少一个室，并且具有围绕所述开口的周边的密封表面;门构造成与所述密封表面相互作用以密封所述开口，所述门具有侧面 垂直于所述门密封表面并垂直于衬底的传输平面的至少一个驱动器，以及位于所述框架上的至少一个侧面的至少一个驱动器，所述驱动器基本上垂直于所述门密封表面并且基本上垂直于所述传送 所述驱动器具有至少部分地位于所述密封表面前面的致动器，并且所述致动器联接到所述门的一侧以将所述门从密封位置移动。 至少一个驱动器位于衬底转移区的外部。

公开(公告)号：US20130078057A1

公开(公告)日：2013-03-28

申请号：US13625704

申请日：2012-09-24

Applicant: BROOKS AUTOMATION, INC.

Inventor： Christopher Hofmeister ,  Martin R. Elliot ,  Alexander Krupyshev ,  Joseph Hallisey ,  Joseph A. Kraus ,  William Fosnight ,  Craig J. Carbone ,  Jeffrey C. Blahnik ,  Ho Yin Owen Fong

IPC: H01L21/67

CPC classification number: H01L21/67098 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67201

Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

Abstract translation: 公开了一种半导体加工工具，所述工具具有框架，所述框架形成具有开口的至少一个室，并且具有围绕所述开口的周边的密封表面;门构造成与所述密封表面相互作用以密封所述开口，所述门具有侧面 垂直于所述门密封表面并垂直于衬底的传输平面的至少一个驱动器，以及位于所述框架上的至少一个侧面的至少一个驱动器，所述驱动器基本上垂直于所述门密封表面并且基本上垂直于所述传送 所述驱动器具有至少部分地位于所述密封表面前面的致动器，并且所述致动器联接到所述门的一侧以将所述门从密封位置移动。 至少一个驱动器位于衬底转移区的外部。

公开(公告)号：US11610787B2

公开(公告)日：2023-03-21

申请号：US17108473

申请日：2020-12-01

Applicant: Brooks Automation, Inc.

Inventor： Christopher Hofmeister ,  Martin R. Elliott ,  Alexander Krupyshev ,  Joseph Hallisey ,  Joseph A. Kraus ,  William Fosnight ,  Craig J. Carbone ,  Jeffrey C. Blahnik ,  Ho Yin Owen Fong

IPC: H01L21/67 ,  F27B17/00

Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

公开(公告)号：US11569111B2

公开(公告)日：2023-01-31

申请号：US17108530

申请日：2020-12-01

Applicant: Brooks Automation, Inc.

Inventor： Alexander Krupyshev ,  Joseph Hallisey ,  Kevin Bourbeau ,  Emilien Audebrand

IPC: H01L21/677

Abstract: A substrate transport apparatus having a drive section and at least one articulated multi-link arm having an upper arm joined at one end to the drive section and a forearm joined to the upper arm. The upper arm being a substantially rigid unarticulated link. Dual end effector links that are separate and distinct from each other are each rotatably and separately joined to a common end of the forearm about a common axis of rotation. Each end effector link has at least one holding station. The holding station of at least one end effector link includes one holding station at opposite ends of the at least one end effector link that is substantially rigid and unarticulated between the opposite ends, and the holding station at one of the opposite ends is substantially coplanar with the holding station of each other end effector link.

公开(公告)号：US20210183675A1

公开(公告)日：2021-06-17

申请号：US17108530

申请日：2020-12-01

Applicant: Brooks Automation, Inc.

Inventor： Alexander Krupyshev ,  Joseph Hallisey ,  Kevin Bourbeau ,  Emilien Audebrand

IPC: H01L21/677

Abstract: A substrate transport apparatus having a drive section and at least one articulated multi-link arm having an upper arm joined at one end to the drive section and a forearm joined to the upper arm. The upper arm being a substantially rigid unarticulated link. Dual end effector links that are separate and distinct from each other are each rotatably and separately joined to a common end of the forearm about a common axis of rotation. Each end effector link has at least one holding station. The holding station of at least one end effector link includes one holding station at opposite ends of the at least one end effector link that is substantially rigid and unarticulated between the opposite ends, and the holding station at one of the opposite ends is substantially coplanar with the holding station of each other end effector link.

公开(公告)号：US10854478B2

公开(公告)日：2020-12-01

申请号：US16722930

申请日：2019-12-20

Applicant: Brooks Automation, Inc.

Inventor： Christopher Hofmeister ,  Martin R. Elliott ,  Alexander Krupyshev ,  Joseph Hallisey ,  Joseph A. Kraus ,  William Fosnight ,  Craig J. Carbone ,  Jeffrey C. Blahnik ,  Ho Yin Owen Fong

IPC: H01L21/67

Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

公开(公告)号：US10541157B2

公开(公告)日：2020-01-21

申请号：US15333021

申请日：2016-10-24

Applicant: Brooks Automation, Inc.

Inventor： Christopher Hofmeister ,  Martin R. Elliott ,  Alexander Krupyshev ,  Joseph Hallisey ,  Joseph Kraus ,  William Fosnight ,  Craig J. Carbone ,  Jeffrey C. Blahnik ,  Ho Yin Owen Fong

IPC: H01L21/67

Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

公开(公告)号：US20140178157A1

公开(公告)日：2014-06-26

申请号：US14195086

申请日：2014-03-03

Applicant: Brooks Automation, Inc.

Inventor： Christopher Hofmeister ,  Martin R. Elliot ,  Alexander Krupyshev ,  Joseph Hallisey ,  Joseph A. Kraus ,  William Fosnight ,  Craig J. Carbone ,  Jeffrey C. Blahnik ,  Ho Yin Owen Fong

IPC: H01L21/67

CPC classification number: H01L21/67098 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67201

Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

Abstract translation: 公开了一种半导体加工工具，所述工具具有框架，所述框架形成具有开口的至少一个室，并且具有围绕所述开口的周边的密封表面;门构造成与所述密封表面相互作用以密封所述开口，所述门具有侧面 垂直于所述门密封表面并垂直于衬底的传输平面的至少一个驱动器，以及位于所述框架上的至少一个侧面的至少一个驱动器，所述驱动器基本上垂直于所述门密封表面并且基本上垂直于所述传送 所述驱动器具有至少部分地位于所述密封表面前面的致动器，并且所述致动器联接到所述门的一侧以将所述门从密封位置移动。 至少一个驱动器位于衬底转移区的外部。