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    Reduced capacity carrier, transport, load port, buffer system
    1.
    发明授权
    Reduced capacity carrier, transport, load port, buffer system 有权

    公开(公告)号：US10679882B2

    公开(公告)日：2020-06-09

    申请号：US14976952

    申请日：2015-12-21

    Applicant: Brooks Automation, Inc.

    Inventor： Michael L. Bufano ,  Ulysses Gilchrist ,  William Fosnight ,  Christopher Hofmeister ,  Daniel Babbs ,  Robert C. May

    IPC: H01L21/677

    Abstract: In accordance with an exemplary embodiment a semiconductor workpiece processing system having at least one processing tool for processing semiconductor workpieces, a container for holding at least one semiconductor workpiece therein for transport to and from the at least one processing tool and a first transport section elongated and defining a travel direction. The first transport section has parts, that interface the container, supporting and transporting the container along the travel direction to and from the at least one processing tool. The container is in substantially continuous transport at a substantially constant rate in the travel direction, when supported by the first transport section. A second transport section is connected to the at least one process tool for transporting the container to and from the at least one processing tool.

    Load lock fast pump vent
    2.
    发明授权
    Load lock fast pump vent 有权
    加载锁快泵通风口

    公开(公告)号：US08662812B2

    公开(公告)日：2014-03-04

    申请号：US13625704

    申请日：2012-09-24

    Applicant: Brooks Automation, Inc.

    Inventor： Christopher Hofmeister ,  Martin R. Elliot ,  Alexander Krupyshev ,  Joseph Hallisey ,  Joseph A. Kraus ,  William Fosnight ,  Craig J. Carbone ,  Jeffrey C. Blahnik ,  Ho Yin Owen Fong

    IPC: H01L21/67 ,  F16K25/00

    CPC classification number: H01L21/67098 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67201

    Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

    Abstract translation: 公开了一种半导体加工工具，所述工具具有框架，所述框架形成具有开口的至少一个室，并且具有围绕所述开口的周边的密封表面;门构造成与所述密封表面相互作用以密封所述开口，所述门具有侧面 垂直于所述门密封表面并垂直于衬底的传输平面的至少一个驱动器，以及位于所述框架上的至少一个侧面的至少一个驱动器，所述驱动器基本上垂直于所述门密封表面并且基本上垂直于所述传送 所述驱动器具有至少部分地位于所述密封表面前面的致动器，并且所述致动器联接到所述门的一侧以将所述门从密封位置移动。 至少一个驱动器位于衬底转移区的外部。

    Elevator-based tool loading and buffering system
    4.
    发明授权
    Elevator-based tool loading and buffering system 有权
    电梯工具装载和缓冲系统

    公开(公告)号：US09368382B2

    公开(公告)日：2016-06-14

    申请号：US14223553

    申请日：2014-03-24

    Applicant: Brooks Automation, Inc.

    Inventor： Gerald M. Friedman ,  Michael L. Bufano ,  Christopher Hofmeister ,  Ulysses Gilchrist ,  William Fosnight

    IPC: B65G47/10 ,  H01L21/677 ,  B65G47/50 ,  H01L21/67

    CPC classification number: H01L21/677 ,  B65G47/50 ,  H01L21/67276 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775 ,  Y10S414/14

    Abstract: A substrate processing apparatus is provided. The apparatus has a casing, a low port interface and a carrier holding station. The casing has processing devices within for processing substrates. The load port interface is connected to the casing for loading substrates into the processing device. The carrier holding station is connected to the casing. The carrier holding station is adapted for holding at least one substrate transport carrier so the at least one substrate transport carrier is capable of being coupled to the load port interface without lifting the at least one substrate transport carrier off the carrier holding station. The carrier holding station is arranged to provide a substantially simultaneous swap section for substantially simultaneous replacement of the substrate transport carrier from the carrier holding station.

    Abstract translation: 提供了一种基板处理装置。 该装置具有壳体，低端口接口和载体保持站。 壳体具有用于处理基板的处理装置。 负载端口接口连接到外壳，用于将基板装载到处理设备中。 托架保持站连接到外壳。 载体保持站用于保持至少一个基板输送载体，使得至少一个基板输送载体能够耦合到负载端口接口，而不将至少一个基板传输载体从载体保持站提起。 载体保持站布置成提供基本上同时的交换部分，用于基本上同时从载体保持站更换基板传输载体。

    REDUCED CAPACITY CARRIER, TRANSPORT, LOAD PORT, BUFFER SYSTEM
    5.
    发明申请
    REDUCED CAPACITY CARRIER, TRANSPORT, LOAD PORT, BUFFER SYSTEM 审中-公开

    公开(公告)号：US20160111308A1

    公开(公告)日：2016-04-21

    申请号：US14976952

    申请日：2015-12-21

    Applicant: Brooks Automation, Inc.

    Inventor： Michael L. Bufano ,  Ulysses Gilchrist ,  William Fosnight ,  Christopher Hofmeister ,  Daniel Babbs ,  Robert C. May

    IPC: H01L21/677

    Abstract: In accordance with an exemplary embodiment a semiconductor workpiece processing system having at least one processing tool for processing semiconductor workpieces, a container for holding at least one semiconductor workpiece therein for transport to and from the at least one processing tool and a first transport section elongated and defining a travel direction. The first transport section has parts, that interface the container, supporting and transporting the container along the travel direction to and from the at least one processing tool. The container is in substantially continuous transport at a substantially constant rate in the travel direction, when supported by the first transport section. A second transport section is connected to the at least one process tool for transporting the container to and from the at least one processing tool.

    REDUCED CAPACITY CARRIER AND METHOD OF USE
    7.
    发明申请
    REDUCED CAPACITY CARRIER AND METHOD OF USE 有权
    减少能力载体和使用方法

    公开(公告)号：US20150155192A1

    公开(公告)日：2015-06-04

    申请号：US14541934

    申请日：2014-11-14

    Applicant: Brooks Automation, Inc.

    Inventor： Ulysses Gilchrist ,  Michael L. Bufano ,  William Fosnight ,  Christopher Hofmeister ,  Gerarld M. Friedman

    IPC: H01L21/677 ,  H01L21/673

    CPC classification number: H01L21/67763 ,  H01L21/67326 ,  H01L21/67353 ,  H01L21/67369 ,  H01L21/67373 ,  H01L21/67376 ,  H01L21/67383 ,  H01L21/67389 ,  H01L21/67393 ,  H01L21/67772 ,  H01L21/67778 ,  H01L21/6779 ,  Y10S414/139

    Abstract: A substrate transport apparatus is provided. The apparatus has a casing and a door. The casing is adapted to form a controlled environment therein. The casing has supports therein for holding at least one substrate in the casing. The casing defines a substrate transfer opening through which a substrate transport system accesses the substrate in the casing. The door is connected to the casing for closing the substrate transfer opening in the casing. The casing has structure forming a fast swap element allowing replacement of the substrate from the apparatus with another substrate without retraction of the substrate transport system and independent of substrate loading in the casing.

    Abstract translation: 提供了一种基板输送装置。 该装置具有外壳和门。 壳体适于在其中形成受控的环境。 壳体具有用于在壳体中保持至少一个基板的支撑。 壳体限定衬底传送开口，衬底传送系统通过该衬底传送系统访问壳体中的衬底。 门连接到壳体以封闭壳体中的基板传送开口。 壳体具有形成快速互换元件的结构，其允许用另一个基板从设备更换基板，而不会退回基板输送系统，而与壳体中的基板负载无关。

    REDUCED CAPACITY CARRIER, TRANSPORT, LOAD PORT, BUFFER SYSTEM
    8.
    发明申请
    REDUCED CAPACITY CARRIER, TRANSPORT, LOAD PORT, BUFFER SYSTEM 有权
    减少能力承运人，运输，装卸港，缓冲系统

    公开(公告)号：US20130089396A1

    公开(公告)日：2013-04-11

    申请号：US13625442

    申请日：2012-09-24

    Applicant: Brooks Automation, Inc.

    Inventor： Michael L. Bufano ,  Ulysses Gilchrist ,  William Fosnight ,  Christopher Hofmeister ,  Daniel Babbs ,  Robert C. May

    IPC: H01L21/677

    CPC classification number: H01L21/67733 ,  H01L21/67017 ,  H01L21/67126 ,  H01L21/67201 ,  H01L21/67276 ,  H01L21/67376 ,  H01L21/67379 ,  H01L21/67386 ,  H01L21/677 ,  H01L21/67706 ,  H01L21/67715 ,  H01L21/67724 ,  H01L21/67727 ,  H01L21/6773 ,  H01L21/67736 ,  H01L21/67757 ,  H01L21/67766 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67775

    Abstract: In accordance with an exemplary embodiment a semiconductor workpiece processing system having at least one processing tool for processing semiconductor workpieces, a container for holding at least one semiconductor workpiece therein for transport to and from the at least one processing tool and a first transport section elongated and defining a travel direction. The first transport section has parts, that interface the container, supporting and transporting the container along the travel direction to and from the at least one processing tool. The container is in substantially continuous transport at a substantially constant rate in the travel direction, when supported by the first transport section. A second transport section is connected to the at least one process tool for transporting the container to and from the at least one processing tool.

    Abstract translation: 根据示例性实施例，半导体工件处理系统具有至少一个用于处理半导体工件的处理工具，用于将至少一个半导体工件保持在其中以用于传送至至少一个处理工具和从该至少一个处理工具传送的容器和第一传送部分 定义旅行方向。 第一运输部分具有与集装箱接合的部件，沿着行进方向将容器支撑和运输到至少一个加工工具和从该至少一个加工工具运送。 当由第一输送部支撑时，容器以行进方向以基本上恒定的速度基本上连续输送。 第二传送部分连接到至少一个处理工具，用于将容器运送到至少一个处理工具和从该至少一个处理工具传送。

    Load lock chamber
    10.
    发明授权
    Load lock chamber 有权
    加载锁定室

    公开(公告)号：US09478446B2

    公开(公告)日：2016-10-25

    申请号：US14195086

    申请日：2014-03-03

    Applicant: Brooks Automation, Inc.

    Inventor： Christopher Hofmeister ,  Martin R. Elliot ,  Alexander Krupyshev ,  Joseph Hallisey ,  Joseph A. Kraus ,  William Fosnight ,  Craig J. Carbone ,  Jeffrey C. Blahnik ,  Ho Yin Owen Fong

    IPC: H01L21/67

    CPC classification number: H01L21/67098 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67201

    Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.

    Abstract translation: 公开了一种半导体加工工具，所述工具具有框架，所述框架形成具有开口的至少一个室，并且具有围绕所述开口的周边的密封表面;门构造成与所述密封表面相互作用以密封所述开口，所述门具有侧面 垂直于所述门密封表面并垂直于衬底的传输平面的至少一个驱动器，以及位于所述框架上的至少一个侧面的至少一个驱动器，所述驱动器基本上垂直于所述门密封表面并且基本上垂直于所述传送 所述驱动器具有至少部分地位于所述密封表面前面的致动器，并且所述致动器联接到所述门的一侧以将所述门从密封位置移动。 至少一个驱动器位于衬底转移区的外部。

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