摘要:
Provided is a method of manufacturing a thin film transistor panel that may reduce manufacturing costs. The method includes forming gate wires including a gate line and a gate electrode on an insulating substrate and forming data wires including source and drain electrodes, the data wires being insulated from the gate wires. The method further includes forming a passivation layer covering the gate and data wires, forming contact holes exposing the drain electrodes by etching the passivation layer, and forming a pixel electrode by depositing an indium-free transparent conductive film on the exposed drain electrode and the passivation layer and then dry etching the transparent conductive film.
摘要:
A display substrate includes a base substrate, a first metal pattern, a gate insulating layer, a second metal pattern, a channel layer and a pixel electrode. The first metal pattern is formed on the base substrate, and includes a gate line and a gate electrode of a switching element. The gate insulating layer is formed on the base substrate including the first metal pattern. The second metal pattern is formed on the gate insulating layer, and includes a source electrode, a drain electrode and a source line. The channel layer is formed under the second metal pattern, and is patterned to have substantially a same side surface as a side surface of the second metal pattern. The pixel electrode is electrically connected to the drain electrode. Therefore, an afterimage on a display panel, thus improving display quality.
摘要:
A display substrate includes a base substrate, a switching element, a protecting layer, an organic layer, a first pixel electrode and a second pixel electrode. The switching element is on the base substrate, and includes a gate electrode, a source electrode and a drain electrode. The protecting layer is on the switching element, and includes a first hole exposing the drain electrode. The organic layer is on the protecting layer, and includes a second hole which exposes a side surface of the protecting layer which defines the first hole and exposes a top surface of the protecting layer which is adjacent to the side surface of the protecting layer. The first pixel electrode is on the organic layer. The second pixel electrode overlaps the first pixel electrode, and is electrically connected to the drain electrode via the first and second holes.
摘要:
After forming a signal line including aluminum, an upper layer of an oxide layer including aluminum that covers the signal line is formed in the same chamber and by using the same sputtering target as the signal line, or a buffer layer of an oxide layer including aluminum is formed in a contact hole exposing the signal line during the formation of the contact hole. Accordingly, the contact characteristic between an upper layer including indium tin oxide (“ITO”) or indium zinc oxide (“IZO”) and the signal line may be improved to enhance the adhesion therebetween while not increasing the production cost of the thin film transistor (“TFT”) array panel.
摘要:
A thin film transistor array panel includes a gate line formed on a substrate and including a gate electrode, a semiconductor layer formed on a surface of the substrate having the gate line, a data line formed on the semiconductor layer, insulatedly intersecting the gate line, and including a source electrode disposed on the gate electrode, a drain electrode separated from the source electrode by a channel, disposed on the gate electrode, and formed from the same layer as the data line, a passivation layer formed on the data line and the drain electrode and having a first contact hole exposing the drain electrode, and a pixel electrode formed on the passivation layer and contacting the drain electrode through the first contact hole. The data line and the drain electrode may include a first layer and a second layer formed on the first layer, a planar edge of the first layer protrudes from a planar edge of the second layer, and the first layer is formed by dry-etching and the second layer is formed by wet-etching.
摘要:
In a display apparatus and a method of manufacturing the display apparatus, a first insulating layer having a trench and a second insulating layer having a via hole corresponding to the trench are formed on an array substrate. After forming a seed layer in the trench, a conductive layer is formed on the seed layer through a plating process, thereby forming the gate line, the gate electrode and the storage line accommodated in the trench and the via hole.
摘要:
A method of fabricating a thin film transistor array substrate is presented. The method entails forming a gate interconnection line on an insulating substrate, forming a gate insulating layer on the gate interconnection line, forming a semiconductor layer and a data interconnection line on the semiconductor layer, sequentially forming multiple passivation layers, etching the passivation layers down to a drain electrode that is an extension of the data interconnection line. The portion of the drain electrode that is exposed at this stage is a part of the drain electrode-pixel electrode contact portion. A pixel electrode is formed connected to the drain electrode. Two of the passivation layers have the same composition but are processed at different temperatures. A thin film transistor prepared in the above manner is also presented.
摘要:
Provided is a method of manufacturing a thin film transistor substrate and a manufacturing system using the same, wherein the production of corrosive substances is reduced during the process of manufacturing the thin film transistor substrate. The method includes providing an etching unit with an insulation substrate on which a thin metal film has been deposited, and dry-etching the insulation substrate so as to form a predetermined circuit pattern; providing a waiting unit with the insulation substrate waiting to be cleaned; performing a preliminary cleaning operation by a cleaning unit having a plurality of nozzles while the insulation substrate waits and checking the preliminary cleaning operation; and performing a main cleaning operation with regard to the insulation substrate based on the result of the check.
摘要:
A method for manufacturing a semiconductor device including forming a first wire on a substrate, forming a lower film on the first wire, forming a photosensitive pattern on the lower film using a photosensitive material, forming contact holes for exposing the first wire by etching the lower film using the photosensitive film as an etching mas, removing part of the photosensitive film pattern by an ashing process to expose a borderline of the lower film defining the contact holes and forming second wire connected to the firs wire via the contact holes.
摘要:
A thin film transistor (TFT) substrate is provided in which a sufficiently large contact area between conductive materials is provided in a contact portion and a method of fabricating the TFT substrate. The TFT substrate includes a gate interconnection line formed on an insulating substrate, a gate insulating layer covering the gate interconnection line, a semiconductor layer arranged on the gate insulating layer, a data interconnection line including a data line, a source electrode and a drain electrode formed on the semiconductor layer, a first passivation layer formed on the data interconnection line and exposing the drain electrode, a second passivation layer formed on the first passivation film and a pixel electrode electrically connected to the drain electrode. An outer sidewall of the second passivation layer is positioned inside an outer sidewall of the first passivation layer.