Component mounting system and adhesive inspection device

    公开(公告)号:US11039561B2

    公开(公告)日:2021-06-15

    申请号:US16574412

    申请日:2019-09-18

    Abstract: A component mounting system includes: a component mounting machine that mounts an electronic component having a predetermined electrode portion on a solder printed on a substrate, the electronic component being fixed to the substrate with a thermosetting adhesive; and an adhesive inspection device. The component mounting machine: sets, with regard to the electronic component to be fixed with the adhesive that cures at a temperature lower than a melting temperature of the solder, a target mounting height along a height direction perpendicular to a face of the substrate on which the adhesive is applied; and mounts the electronic component at the target mounting height. The target mounting height is: an ideal mounting height based on design data; or a height lower than the ideal mounting height by a value that corresponds to a sinking of the electronic component as a result of melting of the solder.

    APPARATUS FOR HAIR INSPECTION ON SUBSTRATE AND METHOD FOR HAIR INSPECTION ON SUBSTRATE

    公开(公告)号:US20240193751A1

    公开(公告)日:2024-06-13

    申请号:US18435627

    申请日:2024-02-07

    Abstract: An apparatus for hair inspection includes: an inspection unit that obtains, with a plurality of color lights, a color image of an inspection object board that is the printed circuit board as an inspection target; and a control device that: obtains a hue image of the inspection object board from the color image; obtains a saturation image of the inspection object board from the color image; detects first hair including at least one of brown hair and blond hair in at least the resist area of the hue image based on a hue difference of the first hair relative to the resist area; and detects second hair including at least one of black hair and grey hair in at least the resist area of the saturation image based on a saturation difference of the second hair relative to the resist area.

    SOLDER PRINTING INSPECTION DEVICE
    3.
    发明公开

    公开(公告)号:US20230232603A1

    公开(公告)日:2023-07-20

    申请号:US18190996

    申请日:2023-03-28

    CPC classification number: H05K13/0817 G06T7/001 G06T7/50 H05K13/0465

    Abstract: A solder printing inspection device includes: an illumination device that irradiates, with a predetermined light, a printed circuit board on which a solder paste is printed; an imaging device that takes an image of the printed circuit board irradiated with the predetermined light and obtains image data; and a control device that: based on the image data, obtain three-dimensional measurement data of the solder paste printed on the printed circuit board, based on the three-dimensional measurement data, extracts upper portion shape data of an upper portion of the solder paste, the upper portion having a height equal to or higher than a predetermined height, and compares the upper portion shape data with a predetermined criterion and determines whether a quality of a three-dimensional shape of the upper portion of the solder paste is good or poor.

    BOARD INSPECTION DEVICE AND BOARD INSPECTION METHOD

    公开(公告)号:US20240414905A1

    公开(公告)日:2024-12-12

    申请号:US18813583

    申请日:2024-08-23

    Abstract: Aboard inspection device includes: an imaging device that takes an image of an area on the board where the adhesive is applied; a CPU that specifies, by a first procedure, a center portion area of the adhesive in the image; specifies, by a second procedure, a foot portion area of the adhesive around the center portion area in the image; specifies an entire area of the adhesive based on the center portion area and the foot portion area; and based on the entire area of the adhesive, determines whether a quality of the adhesive is good or poor. The adhesive has a red color and is applied on a green resist area, and when specifying the foot portion area, the CPU extracts, an area of lower saturation than a predetermined saturation reference value from a saturation image based on the image.

    BOARD TESTING APPARATUS AND BOARD TESTING METHOD

    公开(公告)号:US20240201106A1

    公开(公告)日:2024-06-20

    申请号:US18595708

    申请日:2024-03-05

    Abstract: A board testing apparatus including: an image obtaining device that obtains an image of an inspection object area in a printed circuit board, the inspection object area including a component mounting area; and a control device that detects a foreign substance in the inspection object area based on the image, determines that the foreign substance is defective upon detecting that the foreign substance overlaps the component mounting area or is adjacent to the component mounting area when a lump part of the foreign substance has an area greater than an area threshold value or a length greater than a length threshold value, and determines that the foreign substance is non-defective upon detecting that the foreign substance neither overlaps the component mounting area nor is adjacent to the component mounting area even when the lump part has the area or the length.

Patent Agency Ranking