公开(公告)号：US20190315653A1

公开(公告)日：2019-10-17

申请号：US16343145

申请日：2017-10-20

Applicant: CORNING INCORPORATED

Inventor： David Mark Lance ,  Alexander Mikhailovich Streltsov

IPC: C03C23/00

Abstract: A glass article having a dimpled glass bump formed integrally thereon by laser-irradiation methods. The glass bump includes a lower region connected to an upper region by an inflection region. The lower region projects from a surface of the glass article and is defined by concavely rounded sides with a radius of curvature R1. The upper region includes a transition portion and a top surface. The transition portion is defined by convexly rounded sides with a radius of curvature R2. The transition portion connects to the lower portion via the inflection region. The upper portion connects to the transition portion and is defined by a concavely rounded top portion between convexly rounded top portions.

公开(公告)号：US20250162070A1

公开(公告)日：2025-05-22

申请号：US18946216

申请日：2024-11-13

Applicant: CORNING INCORPORATED

Inventor： David Francis Dawson-Elli ,  David Mark Lance ,  Alranzo Boh Ruffin ,  Alexander Mikhailovich Streltsov

IPC: B23K26/067 ,  C03C23/00 ,  G02B26/08 ,  G02B27/12

Abstract: The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium. A pulsed laser beam is generated and separated into a plurality of beamlets that are formed into a plurality of focus spots that have a fluence to induce multiphoton absorption in the transparent dielectric material. The plurality of focus spots are moved from an initial position in the liquid-assist medium through the substrate and simultaneously moved in one or more directions perpendicular to an optical axis so that each of the plurality of focus spots independently modifies the material along a separate modification path in a continuous volume of the transparent dielectric material. The continuous volume is removed from the substrate to form a feature in the substrate. Optical components formed using the processed substrate are also disclosed.

公开(公告)号：US11247932B2

公开(公告)日：2022-02-15

申请号：US16257853

申请日：2019-01-25

Applicant: CORNING INCORPORATED

Inventor： Jeffery Alan DeMeritt ,  Davide Domenico Fortusini ,  Andrey Kobyakov ,  David Mark Lance ,  Leonard Thomas Masters ,  Ulrich Wilhelm Heinz Neukirch ,  Alexander Mikhailovich Streltsov ,  James Scott Sutherland

IPC: B23K26/38 ,  C03B33/08 ,  C03B33/02 ,  G02B6/36 ,  C03B33/04 ,  B23K26/384 ,  B23K26/00 ,  B23K26/06 ,  B23K26/40 ,  B23K26/122

Abstract: The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.

公开(公告)号：US20210220947A1

公开(公告)日：2021-07-22

申请号：US16967568

申请日：2019-02-19

Applicant: CORNING INCORPORATED

Inventor： Michael Edward Badding ,  Leonard Charles Dabich, II ,  David Mark Lance ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: B23K26/211 ,  B23K26/57

Abstract: A laser-welded assembly of opposing sheets of ceramic and glass, ceramic, or glass-ceramic compositions comprises an intervening bonding layer having a thickness dimension that separates the opposing sheets by less than about 1000 nm. Each of the opposing sheets has a thickness dimension at least about 20 times the thickness dimension of the intervening bonding layer. The intervening bonding layer has a melting point greater than that of one or both of the opposing sheets. The ceramic sheet is a pass-through sheet with a composite T/R spectrum comprising a portion that lies below about 30% across a target irradiation band residing at or above about 1400 nm and at or below about 4500 nm wavelength. The intervening bonding layer has an absorption spectrum comprising a portion that lies above about 80% across the target irradiation band. The assembly comprises a weld bonding the opposing surfaces of the opposing sheets.

公开(公告)号：US20190232435A1

公开(公告)日：2019-08-01

申请号：US16257853

申请日：2019-01-25

Applicant: CORNING INCORPORATED

Inventor： Jeffery Alan DeMeritt ,  Davide Domenico Fortusini ,  Andrey Kobyakov ,  David Mark Lance ,  Leonard Thomas Masters ,  Ulrich Wilhelm Heinz Neukirch ,  Alexander Mikhailovich Streltsov ,  James Scott Sutherland

IPC: B23K26/384 ,  B23K26/40 ,  B23K26/00 ,  B23K26/06 ,  G02B6/36

CPC classification number: C03B33/082 ,  B23K26/009 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/384 ,  B23K26/40 ,  G02B6/3644

Abstract: The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.