公开(公告)号：US20190315653A1

公开(公告)日：2019-10-17

申请号：US16343145

申请日：2017-10-20

Applicant: CORNING INCORPORATED

Inventor： David Mark Lance ,  Alexander Mikhailovich Streltsov

IPC: C03C23/00

Abstract: A glass article having a dimpled glass bump formed integrally thereon by laser-irradiation methods. The glass bump includes a lower region connected to an upper region by an inflection region. The lower region projects from a surface of the glass article and is defined by concavely rounded sides with a radius of curvature R1. The upper region includes a transition portion and a top surface. The transition portion is defined by convexly rounded sides with a radius of curvature R2. The transition portion connects to the lower portion via the inflection region. The upper portion connects to the transition portion and is defined by a concavely rounded top portion between convexly rounded top portions.

公开(公告)号：US11247932B2

公开(公告)日：2022-02-15

申请号：US16257853

申请日：2019-01-25

Applicant: CORNING INCORPORATED

Inventor： Jeffery Alan DeMeritt ,  Davide Domenico Fortusini ,  Andrey Kobyakov ,  David Mark Lance ,  Leonard Thomas Masters ,  Ulrich Wilhelm Heinz Neukirch ,  Alexander Mikhailovich Streltsov ,  James Scott Sutherland

IPC: B23K26/38 ,  C03B33/08 ,  C03B33/02 ,  G02B6/36 ,  C03B33/04 ,  B23K26/384 ,  B23K26/00 ,  B23K26/06 ,  B23K26/40 ,  B23K26/122

Abstract: The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.

公开(公告)号：US20210220947A1

公开(公告)日：2021-07-22

申请号：US16967568

申请日：2019-02-19

Applicant: CORNING INCORPORATED

Inventor： Michael Edward Badding ,  Leonard Charles Dabich, II ,  David Mark Lance ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC: B23K26/211 ,  B23K26/57

Abstract: A laser-welded assembly of opposing sheets of ceramic and glass, ceramic, or glass-ceramic compositions comprises an intervening bonding layer having a thickness dimension that separates the opposing sheets by less than about 1000 nm. Each of the opposing sheets has a thickness dimension at least about 20 times the thickness dimension of the intervening bonding layer. The intervening bonding layer has a melting point greater than that of one or both of the opposing sheets. The ceramic sheet is a pass-through sheet with a composite T/R spectrum comprising a portion that lies below about 30% across a target irradiation band residing at or above about 1400 nm and at or below about 4500 nm wavelength. The intervening bonding layer has an absorption spectrum comprising a portion that lies above about 80% across the target irradiation band. The assembly comprises a weld bonding the opposing surfaces of the opposing sheets.

公开(公告)号：US20190232435A1

公开(公告)日：2019-08-01

申请号：US16257853

申请日：2019-01-25

Applicant: CORNING INCORPORATED

Inventor： Jeffery Alan DeMeritt ,  Davide Domenico Fortusini ,  Andrey Kobyakov ,  David Mark Lance ,  Leonard Thomas Masters ,  Ulrich Wilhelm Heinz Neukirch ,  Alexander Mikhailovich Streltsov ,  James Scott Sutherland

IPC: B23K26/384 ,  B23K26/40 ,  B23K26/00 ,  B23K26/06 ,  G02B6/36

CPC classification number: C03B33/082 ,  B23K26/009 ,  B23K26/0648 ,  B23K26/0665 ,  B23K26/384 ,  B23K26/40 ,  G02B6/3644

Abstract: The liquid-assisted micromachining methods include methods of processing a substrate made of a transparent dielectric material. A working surface of the substrate is placed in contact with a liquid-assist medium that comprises fluorine. A focused pulsed laser beam is directed through a first substrate surface and through the opposite working surface to form a focus spot in the liquid-assist medium. The focus spot is then moved over a motion path from its initial position in the liquid-assist medium through the substrate body in the general direction from the working surface to the first surface to create a modification of the transparent dielectric material that defines in the body a core portion. The core portion is removed to form the substrate feature, which can be a through or closed fiber hole that supports one or more optical fibers. Optical components formed using the processed substrate are also disclosed.