公开(公告)号：US20210261836A1

公开(公告)日：2021-08-26

申请号：US17232746

申请日：2021-04-16

Applicant: CORNING INCORPORATED

Inventor： Indrani Bhattacharyya ,  Jen-Chieh Lin ,  Prantik Mazumder

IPC: C09J165/00 ,  B32B17/10 ,  B32B7/06 ,  C03C17/32 ,  C09D165/00

Abstract: Articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a multilayered modification (coating) layer, for example an alternating cationic/anionic polymer coating layer, and associated deposition methods, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (≤400° C.) processing while also preventing formation of a permanent bond between the sheets during such processing.

公开(公告)号：US20200171799A1

公开(公告)日：2020-06-04

申请号：US16639664

申请日：2018-08-20

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Indrani Bhattacharyya ,  Pei-Chen Chiang ,  Hong-goo Choi ,  Dae youn Kim ,  Jen-Chieh Lin ,  Prantik Mazumder ,  Pei-Lien Tseng

IPC: B32B17/10

Abstract: Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example a cationic polymer coating layer, and associated deposition methods, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (≤600° C.) processing while also preventing formation of a permanent bond between the sheets during such processing.

公开(公告)号：US20190326557A1

公开(公告)日：2019-10-24

申请号：US16502995

申请日：2019-07-03

Applicant: CORNING INCORPORATED

Inventor： Kuan-Ting Kuo ,  Jen-Chieh Lin ,  Lu Zhang

IPC: H01L51/52 ,  H01L51/56 ,  H01L51/00

Abstract: A process includes providing a base substrate and disposing a precursor on the base substrate. The precursor includes powdered particles of a first material and an organic binder. The process includes photo-thermally treating the precursor to form a light extraction layer. The photo-thermal treatment includes exposing the precursor to a flash lamp that is energized in pulses. The process further includes disposing an organic light emitting diode adjacent to the light extraction layer.

公开(公告)号：US10367169B2

公开(公告)日：2019-07-30

申请号：US15784676

申请日：2017-10-16

Applicant: CORNING INCORPORATED

Inventor： Kuan-Ting Kuo ,  Jen-Chieh Lin ,  Lu Zhang

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56 ,  B05D3/06

Abstract: A process includes providing a base substrate and disposing a precursor on the base substrate. The precursor includes powdered particles of a first material and an organic binder. The process includes photo-thermally treating the precursor to form a light extraction layer. The photo-thermal treatment includes exposing the precursor to a flash lamp that is energized in pulses. The process further includes disposing an organic light emitting diode adjacent to the light extraction layer.

公开(公告)号：US11999135B2

公开(公告)日：2024-06-04

申请号：US16639664

申请日：2018-08-20

Applicant: CORNING INCORPORATED

Inventor： Kaveh Adib ,  Indrani Bhattacharyya ,  Pei-Chen Chiang ,  Hong-goo Choi ,  Dae youn Kim ,  Jen-Chieh Lin ,  Prantik Mazumder ,  Pei-Lien Tseng

IPC: B32B17/10

CPC classification number: B32B17/1055 ,  B32B17/10036 ,  B32B2307/728

Abstract: Described herein are articles and methods of making articles, for example glass articles, comprising a thin sheet and a carrier, wherein the thin sheet and carrier are bonded together using a modification (coating) layer, for example a cationic polymer coating layer, and associated deposition methods, the carrier, or both, to control van der Waals, hydrogen and covalent bonding between the thin sheet and the carrier. The modification layer bonds the thin sheet and carrier together with sufficient bond strength to prevent delamination of the thin sheet and the carrier during high temperature (≤600° C.) processing while also preventing formation of a permanent bond between the sheets during such processing.

公开(公告)号：US20230294382A1

公开(公告)日：2023-09-21

申请号：US18011256

申请日：2021-06-25

Applicant: CORNING INCORPORATED

Inventor： Li-Wei Chou ,  Sean Matthew Garner ,  Jen-Chieh Lin ,  Pei-Lien Tseng

IPC: B32B17/06 ,  B32B7/12 ,  B32B7/02 ,  B32B37/12

CPC classification number: B32B17/06 ,  B32B7/12 ,  B32B7/02 ,  B32B37/1284 ,  B32B2307/7376 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2315/08 ,  B32B2457/00

Abstract: A functional laminated glass article includes: a backer substrate; a flexible glass substrate comprising a thickness of no greater than 300 μm, and laminated to the backer substrate with an adhesive; a plurality of conductive traces disposed on one or both of the backer substrate and the flexible glass substrate; and a plurality of electronic device elements disposed between the backer substrate and the flexible glass substrate and in contact with the plurality of conductive traces. Further, the adhesive encapsulates the conductive traces and the electronic device elements between the backer substrate and the flexible glass substrate.

公开(公告)号：US10809766B2

公开(公告)日：2020-10-20

申请号：US15843346

申请日：2017-12-15

Applicant: CORNING INCORPORATED

Inventor： Polly Wanda Chu ,  Adam James Ellison ,  Timothy Michael Gross ,  Robert Bumju Lee ,  Jen-Chieh Lin ,  Chouhwan Moon ,  Pei-Lien Tseng

IPC: B32B15/04 ,  B32B17/06 ,  G06F1/16 ,  C03C21/00 ,  H05K1/02 ,  H05K1/03 ,  C03C17/32 ,  B32B27/36 ,  C03C15/00 ,  B32B17/10 ,  C03C3/091 ,  B32B7/12 ,  B32B37/12 ,  B32B37/16 ,  H05K3/46 ,  G02F1/1333 ,  H04M1/02

Abstract: A glass element having a thickness from 25 μm to 125 μm, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress σI of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

公开(公告)号：US20160324016A1

公开(公告)日：2016-11-03

申请号：US15141140

申请日：2016-04-28

Applicant: CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Jiangwei Feng ,  Shandon Dee Hart ,  Jen-Chieh Lin ,  Prantik Mazumder ,  Chandan Kumar Saha

IPC: H05K5/00 ,  B32B7/02 ,  B32B17/06 ,  H05K5/03 ,  C23C16/50

CPC classification number: H05K5/0017 ,  B32B7/02 ,  B32B17/06 ,  B32B2457/20 ,  C03C17/3417 ,  C03C17/3452 ,  C03C17/42 ,  C03C2217/734 ,  C23C16/50 ,  H05K5/03

Abstract: One or more aspects relate to an article that includes a glass substrate having a first average strain-to-failure; and a crack mitigating layer disposed on a first major surface of the substrate forming a first interface. The article also includes a film disposed on the crack mitigating layer forming a second interface and having a second average strain-to-failure that is less than the first average strain-to-failure. Further, at least one of the first and second interfaces exhibits a moderate adhesion such that at least a portion of the crack mitigating layer experiences one or more of a cohesive failure and an adhesive failure at the interfaces when the article is strained to a strain level between the first average strain-to-failure and the second average strain-to-failure. In addition, the refractive index of the crack mitigating layer is between or the same as the refractive indices of the substrate and the film.

Abstract translation: 一个或多个方面涉及包括具有第一平均应变失效的玻璃基板的制品; 以及设置在形成第一界面的基板的第一主表面上的裂纹缓解层。 该制品还包括设置在裂纹缓解层上的膜，其形成第二界面并且具有小于第一平均应变 - 破坏的第二平均应变 - 破坏。 此外，第一和第二界面中的至少一个表现出适度的粘合性，使得当制品应变到应变水平时，裂纹缓解层的至少一部分经历一个或多个界面处的内聚破坏和粘合剂失效 在第一平均应变 - 失效和第二平均应变 - 失效之间。 此外，裂纹缓解层的折射率在基板和膜的折射率之间或相同。

公开(公告)号：US11777067B2

公开(公告)日：2023-10-03

申请号：US17697196

申请日：2022-03-17

Applicant: CORNING INCORPORATED

Inventor： Jiangwei Feng ,  Sean Matthew Garner ,  Jen-Chieh Lin ,  Robert George Manley ,  Timothy James Orsley ,  Richard Curwood Peterson ,  Michael Lesley Sorensen ,  Pei-Lien Tseng ,  Rajesh Vaddi ,  Lu Zhang

IPC: H01L33/62 ,  H01L27/15

CPC classification number: H01L33/62 ,  H01L27/156 ,  H01L2933/0066

Abstract: Display tiles comprising pixel elements on a first surface of a substrate connected by an electrode, a driver located opposite the first surface, and a connector wrapped around an edge surface of the substrate connecting the driver to the pixel elements. Displays comprised of display tiles and methods of manufacturing display tiles and displays are also disclosed.

公开(公告)号：US20210257597A1

公开(公告)日：2021-08-19

申请号：US17251462

申请日：2019-06-11

Applicant: CORNING INCORPORATED

Inventor： Ssu-Wei Hu ,  Jen-Chieh Lin

IPC: H01L51/56 ,  H01L51/52

Abstract: A process for forming an article for improved light extraction includes: providing abase substrate; disposing a precursor on the base substrate, the precursor having: particles having an average diameter in a range of 10 nm to 1 μm and including an inorganic oxide and an organic binder; exposing the precursor to a first radiation having a peak emission wavelength in a range of 500 nm to 2000 nm for a time in a range of 1 second to 300 seconds to form a porous light extraction layer having an average pore diameter in a range of 10 nm to 1000 nm, such that the porous light extraction layer improves light output of the article by a factor of 1.7× or greater.