公开(公告)号：US09701871B2

公开(公告)日：2017-07-11

申请号：US14509081

申请日：2014-10-08

Applicant: Cabot Microelectronics Corporation

Inventor： Brian Reiss ,  John Clark ,  Lamon Jones ,  Jeffrey Gilliland ,  Michael White

IPC: C09K13/06 ,  C09G1/02 ,  C09K3/14 ,  H01L21/02

CPC classification number: C09G1/02 ,  C09K3/1463 ,  H01L21/02024

Abstract: The invention provides a polishing composition comprising (a) silica, (b) one or more compounds that increases the removal rate of silicon, (c) one or more tetraalkylammonium salts, and (d) water, wherein the polishing composition has a pH of about 7 to about 11. The invention further provides a method of polishing a substrate with the polishing composition.