公开(公告)号：US20240321711A1

公开(公告)日：2024-09-26

申请号：US18606035

申请日：2024-03-15

Applicant: Chengdu Monolithic Power Systems Co., Ltd.

Inventor： Yingjiang Pu ,  Hang Jiang

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/02 ,  H05K1/11 ,  H05K3/42

CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H05K1/0271 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/09609 ,  H05K2201/09636

Abstract: A substrate includes a first dielectric layer having a first surface and a second surface. The first dielectric layer includes a plurality of first conductive vias and a plurality of second conductive vias. These two kinds of conductive vias are formed to penetrate the first dielectric layer and have different orientations for reduce warpage of the substrate.