摘要:
An optical transceiver module that includes an enclosure within which are disposed a transmitter module and a receiver module. A primary and secondary board are disposed as well in the enclosure, and the transmitter module and the receiver module are each connected with one of the boards. The primary and secondary boards each have a ground plane, and a third ground plane is provided by a ground signal plate that disposed within the enclosure and electrically coupled with the primary board and the secondary board.
摘要:
A transceiver module including a primary printed circuit board and a secondary printed circuit board in an enclosure is presented. The primary printed circuit board is coupled to the secondary printed circuit board by a connector pin that protrudes out of a critical surface of the enclosure. The printed circuit boards may be positioned substantially parallel to the critical surface of the enclosure. When a transmitter is electrically connected to the primary printed circuit board and a receiver is electrically connected to the secondary printed circuit board, the transmitter and the receiver may be positioned in a plane that is also substantially parallel to the plane of the critical surface.
摘要:
In an embodiment, a shell assembly for a communications module is described that includes a top shell, a bottom shell, and a thermal boss. The top shell has a top panel and opposing lateral side portions. The bottom shell has a bottom panel and opposing lateral side portions. The top shell and the bottom shell are configured to be assembled together to define a cavity therebetween. The cavity may be configured to receive a transceiver assembly. The thermal boss extends from the top panel and includes a thermal interface surface defining a thermal interface plane oriented at an angle relative to the top panel.
摘要:
One embodiment includes a connector comprising a connector housing, a ferrule, and a crimp ring. The connector housing has inner and outer surfaces extending between forward and rear ends of the connector housing. The inner surfaces defined a passageway extending lengthwise between the forward and rear ends. The connector housing includes at least one protrusion formed on one of the outer surfaces that is configured to engage a corresponding connector engaging structure of an alignment guide to secure the connector housing within the alignment guide. The ferrule is configured to mount upon end portions of a plurality of optical fibers of a multi-fiber communication cable. The ferrule is disposed partially within the passageway. The crimp ring encompasses the rear end of the connector housing and is configured to secure the connector to the multi-fiber communication cable.
摘要:
Electromagnetic radiation (EMR) containment assemblies for use in optoelectronic modules. In one example embodiment, an EMR containment assembly includes an EMR shield and a mounting spring plate attached to the EMR shield. The EMR shield includes a first substantially flat body defining at least one edge, a plurality of optical ports defined in the first body; and a plurality of fingers defined along at least one edge of the first body. The fingers are configured to bias against a housing of an optoelectronic module. The mounting spring plate includes a second substantially flat body defining at least one edge, an optical window defined in the second body, and a plurality of leaf springs defined along at least one edge of the second body. The leaf springs are configured to bias against an alignment guide positioned within the optoelectronic module.
摘要:
An electromagnetic radiation shield for an electronic module. In one example embodiment, an EMR shield for an electronic transceiver module includes a conductive carrier sized and configured to surround a shell of an electronic transceiver module. The conductive carrier defines a plurality of extended elements located on at least one edge of the conductive carrier and an orientation element. Each extended element is configured to bias against the shell in order to create a physical and electrical contact between the conductive carrier and the shell. The orientation element is configured to engage a corresponding structure in the shell in order to correctly orient the conductive carrier with respect to the shell.
摘要:
One embodiment includes communications module having a release slide and a boot. The release slide includes a main body, a plurality of arms, and a plurality of coupling structures. The arms extend from a first end of the main body. The coupling structures extend from a second end of the main body opposite the first end. The boot is disposed over the coupling structures of the release slide and defines a cavity configured to slidably receive a communications cable.
摘要:
Printed circuit board (PCB) positioning in an optoelectronic module. In one example embodiment, a spacer can be use to position top and bottom PCBs that are at least partially enclosed within top and bottom shells of an optoelectronic module. The spacer includes top and bottom surfaces and a plurality of top posts extending from the top surface. The top posts are configured to extend through openings in the top PCB to contact inside surfaces of the top shell.
摘要:
The embodiments disclosed herein relate an insertable shield clip for use in controlling electromagnetic interference in an optical transceiver module. The optical transceiver module may include a shell that houses first and second optical subassemblies and an enclosure that cooperates with the shell in defining a covering for the optical transceiver module. The shield clip may comprise a body composed of conductive material. The body may include first and second vertical side members. The body may also include first and second shield members that are each configured to receive a corresponding nosepiece of one of the first and second optical subassemblies. The body may further include a bottom member that interconnects the first and second vertical side members and the first and second shield members.
摘要:
Embodiments of the present invention are directed to dual stage modular optical devices with insert digital diagnostics components. A first portion of a leadframe couples a first fabricated package including a light source and/or light detector to a second fabricated package with first opening for receiving inserts. A second portion of the leadframe couples the second fabricated package to a third fabricated package with a second opening for receiving inserts. A first component insert is coupled to the second fabricated package such that components of the first component insert can electrically interoperate with the light source and/or light detector. A second component insert is coupled to the third fabricated package such that components of the second component insert can electrically interoperate with components of the first component insert to implement digital diagnostics functions.