摘要:
A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light. The enclosure (22) has a shape of a standard incandescent lamp.
摘要:
A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light. The enclosure (22) has a shape of a standard incandescent lamp.
摘要:
A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light The enclosure (22) has a shape of a standard incandescent lamp.
摘要:
Systems and methods are provided to mitigate excess die attachment material accrual, and parasitic conductive paths formed thereby. A die attachment material (e.g., solder) is melted using a combination of localized heat sources and ultrasonic energy. The heat sources bring the die attachment material close to its melting point, which reduces an amount of bonding force associated with purely ultrasonic bonding techniques. An ultrasonic transducer brings the die attachment material the rest of the way up to its melting point, which reduces the overall temperature that the die and/or sensitive components thereon endure during the bonding process.
摘要:
A light emitting apparatus includes a support having circuitry disposed thereon, at least one light emitting diode (LED) chip mounted on the support and in electrical communication with the circuitry and a reflective layer on the support adjacent the at least one chip.
摘要:
A directional lamp comprises a light source, a beam forming optical system configured to form light from the light source into a light beam, and a light mixing diffuser arranged to diffuse the light beam. The light source, beam forming optical system, and light mixing diffuser are secured together as a unitary lamp. The beam forming optical system includes: a collecting reflector having an entrance aperture receiving light from the light source and an exit aperture that is larger than the entrance aperture, and a lens disposed at the exit aperture of the collecting reflector, the light source being positioned along an optical axis of the beam forming optical system at a distance from the lens that is within plus or minus ten percent of a focal length of the lens.