公开(公告)号：US11275211B2

公开(公告)日：2022-03-15

申请号：US16445038

申请日：2019-06-18

Applicant: Cisco Technology, Inc.

Inventor： Anthony D. Kopinetz ,  Ashley J. Maker ,  Jarrett S. Neiman

IPC: G02B6/30

Abstract: A method of manufacturing an optical apparatus comprises forming an unfinished endface of a fiber array unit (FAU) that provides an arrangement of one or more optical fibers. The one or more optical fibers terminate at the unfinished endface. The method further comprises optically aligning the FAU with an external light-carrying medium. The one or more optical fibers are optically coupled with the external light-carrying medium through the unfinished endface.

公开(公告)号：US11215775B2

公开(公告)日：2022-01-04

申请号：US16544699

申请日：2019-08-19

Applicant: Cisco Technology, Inc.

Inventor： Ashley J. Maker ,  Joyce J. M. Peternel ,  Sandeep Razdan ,  Matthew J. Traverso ,  Aparna R. Prasad

IPC: G02B6/42

Abstract: An optical connection assembly joining optical components is described. The optical connection assembly is manufactured using a fan out wafer level packaging to produce dies/frames which include mechanical connection features. A fastener is joined to a connection component and affixed to the mechanical connection features, to provide structural support to the connection between the connected component and the die/frame structure.

公开(公告)号：US11378751B2

公开(公告)日：2022-07-05

申请号：US16923852

申请日：2020-07-08

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar Patel ,  Matthew J. Traverso ,  Ashley J. Maker ,  Jock T. Bovington

IPC: G02B6/30 ,  G02B6/26 ,  G02B6/42

Abstract: By determining an alignment point for a photonic element in a substrate of a given material; applying, via a laser aligned with the photonic element according to the alignment point, an etching pattern to the photonic element to produce a patterned region and an un-patterned region in the photonic element, wherein applying the etching pattern alters a chemical bond in the given material for the patterned region of the photonic element that increases a reactivity of the given material to an etchant relative to a reactivity of the un-patterned region, and wherein the patterned region defines an engagement feature in the un-patterned region that is configured to engage with a mating feature on a Photonic Integrated Circuit (PIC); and removing the patterned region from the photonic element via the etchant, various systems and methods may make use of laser patterning in optical components to enable alignment of optics to chips.

公开(公告)号：US10527790B2

公开(公告)日：2020-01-07

申请号：US15841005

申请日：2017-12-13

Applicant: Cisco Technology, Inc.

Inventor： Kumar Satya Harinadh Potluri ,  Ashley J. Maker ,  Vipulkumar Patel

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/32 ,  G02B6/38 ,  G02B6/42 ,  G02B6/36 ,  G02B6/30

Abstract: Embodiments herein describe a fiber array unit (FAU) configured to couple a photonic chip with a plurality of optical fibers. Epoxy can be used to bond the FAU to the photonic chip. However, curing the epoxy between the FAU and the photonic chip is difficult. As such, the FAU can include one or more optical windows etched into a non-transparent layer that overlap with epoxy wells in the photonic chip. Moreover, the FAU may include a transparent substrate on which the non-transparent layer is disposed that permits UV light to pass therethrough. As such, during curing, UV light can be pass through the transparent substrate and through the optical windows in the non-transparent layer to cure the epoxy disposed between the FAU and the photonic chip.

公开(公告)号：US11226450B2

公开(公告)日：2022-01-18

申请号：US17103735

申请日：2020-11-24

Applicant: Cisco Technology, Inc.

Inventor： Matthew J. Traverso ,  Ashley J. Maker ,  Sandeep Razdan

IPC: G02B6/26 ,  G02B23/08

Abstract: The present disclosure provides for periscope optical assemblies within interposers that include a bulk material having a first side and a second side opposite to the first side; a first optic defined in the bulk material at a first height in the bulk material along an axis extending between the first second sides; a second optic defined in the bulk material at a second height in the bulk material, different than the first height, along the axis; a first waveguide defined in the bulk material, extending from the first side to the first optic; a second waveguide defined in the bulk material, extending from the second optic to the second side; and a third waveguide defined in the bulk material, extending from the first optic to the second optic.

公开(公告)号：US10564352B1

公开(公告)日：2020-02-18

申请号：US16543441

申请日：2019-08-16

Applicant: Cisco Technology, Inc.

Inventor： Sandeep Razdan ,  Ashley J. Maker ,  Matthew J. Traverso ,  Mark A. Webster ,  Jock T. Bovington

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/42 ,  G02B6/30 ,  G02B6/43 ,  H01L23/538 ,  H01L23/00

Abstract: Aspects described herein include a method comprising forming an insulator layer above a silicon layer of a silicon-on-insulator (SOI) substrate. A first optical device is formed partly in the silicon layer and partly in the insulator layer. A first optical waveguide is formed in the insulator layer and optically coupled with the first optical device. The method further comprises forming conductive contacts extending partly through the insulator layer to the first optical device, bonding a first surface of an interposer with a top surface of the insulator layer, and forming, from a second surface of the interposer opposite the first surface, a plurality of first conductive vias extending at least partly through the interposer. The plurality of first conductive vias are coupled with the conductive contacts.

公开(公告)号：US10393959B1

公开(公告)日：2019-08-27

申请号：US16172702

申请日：2018-10-26

Applicant: Cisco Technology, Inc.

Inventor： Sandeep Razdan ,  Ashley J. Maker ,  Matthew J. Traverso ,  Mark A. Webster ,  Jock T. Bovington

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/42 ,  G02B6/30 ,  G02B6/43 ,  H01L23/538 ,  H01L23/00

Abstract: A method comprises bonding a first surface of an interposer wafer with a first exterior surface of a photonic wafer assembly. The photonic wafer assembly comprises one or more optical devices coupled with one or more metal layers and with one or more first optical waveguides. The method further comprises forming, from a second surface opposite the first surface, a plurality of first conductive vias extending at least partway through the interposer wafer and coupled with the one or more metal layers. The method further comprises forming, at the second surface, a plurality of first conductive pads coupled with the plurality of first conductive vias. The method further comprises forming one or more second conductive pads coupled with the one or more metal layers. The one or more second conductive pads are accessible at a second exterior surface of the photonic wafer assembly opposite the first exterior surface.

公开(公告)号：US11784175B2

公开(公告)日：2023-10-10

申请号：US17302853

申请日：2021-05-13

Applicant: Cisco Technology, Inc.

Inventor： Matthew J. Traverso ,  Sandeep Razdan ,  Ashley J. Maker

IPC: H01L23/00 ,  H01L25/16 ,  H01L31/02 ,  H01L23/498 ,  H01L21/48

CPC classification number: H01L25/167 ,  H01L21/4846 ,  H01L23/49827 ,  H01L23/49838 ,  H01L31/02005 ,  H01L23/49816 ,  H01L24/16 ,  H01L2224/16145 ,  H01L2224/16225

Abstract: An optoelectronic assembly and methods of fabrication thereof are provided. The assembly includes a mold compound; a photonic integrated circuit (PIC) embedded in the mold compound, that has a face exposed from the mold compound in a first plane; an interposer embedded in the mold compound, that has a face exposed from the mold compound in the first plane (i.e., co-planar with the exposed face of the PIC); and an electrical integrated circuit (EIC) coupled to the exposed face of the PIC and the exposed face of the interposer, that establishes bridging electrical connections between the PIC and the interposer.

公开(公告)号：US10996405B2

公开(公告)日：2021-05-04

申请号：US15946930

申请日：2018-04-06

Applicant: Cisco Technology, Inc.

Inventor： Vipulkumar Patel ,  Kumar Satya Harinadh Potluri ,  Jock T. Bovington ,  Ashley J. Maker

IPC: G02B6/38 ,  G02B6/28 ,  G02B6/26 ,  H04B10/25 ,  B23K1/005 ,  B23K103/00

Abstract: Embodiments herein describe a fiber array unit (FAU) configured to optically couple a photonic chip with a plurality of optical fibers. Epoxy can be used to bond the FAU to the photonic chip. However, curing the epoxy between the FAU and the photonic chip is difficult. As such, the FAU can include one or more optical windows etched into or completely through a non-transparent layer that overlap the epoxy disposed on the photonic chip. UV radiation can be emitted through the optical windows to cure the underlying epoxy. In one example, the windows can also be used for dispensing epoxy. In addition to the optical windows, the FAU can include alignment protrusions (e.g., frustums) which mate or interlock with respective alignment receivers in the photonic chip. Doing so may facilitate passive alignment of the optical fibers in the FAU to an optical interface in the photonic chip.

公开(公告)号：US10962719B2

公开(公告)日：2021-03-30

申请号：US16260622

申请日：2019-01-29

Applicant: Cisco Technology, Inc.

Inventor： Sandeep Razdan ,  Ashley J. Maker ,  Jock T. Bovington ,  Matthew J. Traverso

IPC: G02B6/30

Abstract: Using laser patterning for an optical assembly, optical features are written into photonic elements at the end of a manufacturing sequence in order to prevent errors and damages to the optical features. The optical assembly is manufactured by affixing a photonic element to a substrate which includes one or more optical features and mapping one or more optical features for the photonic element. The optical features are then written into the fixed photonic element using laser patterning and the optical assembly is completed by connecting components, such as optical fibers, to the photonic element.