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公开(公告)号：US09780669B2
公开(公告)日：2017-10-03
申请号：US14987789
申请日：2016-01-05
Applicant: Cisco Technology, Inc.
Inventor： Yang li , Kan Seto , Michael Grant , Matt Howard , Ruqi Li
IPC: H02M3/335
CPC classification number: H02M3/33507 , H02M1/36 , H02M3/158 , H02M3/33592 , H02M3/337 , H02M2001/008 , Y02B70/1475
Abstract: In one embodiment, a power apparatus includes a buck converter including a first capacitor, a first inductor and a first switch for connection with a direct current power supply, wherein when the first switch is closed and the buck converter is connected to the direct current power supply, the first capacitor and the first inductor are connected in series to the direct current power supply, a full-bridge inverter including at least four switches including the first switch, a second, third and fourth switch so that the first switch is shared by the inventor and buck converter, the inverter being operative to convert direct current to alternating current by alternating (a) closing the first and fourth switch with the second and third switch open, and (b) closing the second and third switch with the first and fourth switch open, and a transformer to step down an output of the inverter.
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公开(公告)号：US20210219426A1
公开(公告)日：2021-07-15
申请号：US17220033
申请日：2021-04-01
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Shobhana Punjabi , Kan Seto , Straty Argyrakis , Joel Richard Goergen , Paul Lachlan Mantiply , Richard Anthony O'Brien
Abstract: In one embodiment, an apparatus generally comprises a printed circuit board comprising a first side, a second side, and a plurality of power vias extending from the first side to the second side, the first side configured for receiving an application specific integrated circuit (ASIC), and a power delivery board mounted on the second side of the printed circuit board and comprising a power plane interconnected with power vias in the power delivery board to electrically couple voltage regulator modules and the ASIC. The voltage regulator modules are mounted on the second side of the printed circuit board.
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公开(公告)号：US10999930B2
公开(公告)日：2021-05-04
申请号：US16222913
申请日：2018-12-17
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Shobhana Punjabi , Kan Seto , Straty Argyrakis , Joel Richard Goergen , Paul Lachlan Mantiply , Richard Anthony O'Brien
Abstract: In one embodiment, an apparatus generally comprises a power delivery board for integration with a printed circuit board, the power delivery board comprising a power plane for delivering power from a voltage regulator module to an application specific integrated circuit (ASIC) mounted on a first side of the printed circuit board. The power plane in the power delivery board interconnects with power vias in the power delivery board for vertical alignment with the ASIC through power vias in the printed circuit board to electrically couple the voltage regulator module and the ASIC when the power delivery board is mounted on a second side of the printed circuit board.
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公开(公告)号：US11564317B2
公开(公告)日：2023-01-24
申请号：US17220033
申请日：2021-04-01
Applicant: CISCO TECHNOLOGY, INC.
Inventor： Shobhana Punjabi , Kan Seto , Straty Argyrakis , Joel Richard Goergen , Paul Lachlan Mantiply , Richard Anthony O'Brien
Abstract: In one embodiment, an apparatus generally comprises a printed circuit board comprising a first side, a second side, and a plurality of power vias extending from the first side to the second side, the first side configured for receiving an application specific integrated circuit (ASIC), and a power delivery board mounted on the second side of the printed circuit board and comprising a power plane interconnected with power vias in the power delivery board to electrically couple voltage regulator modules and the ASIC. The voltage regulator modules are mounted on the second side of the printed circuit board.
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