公开(公告)号：US11114648B2

公开(公告)日：2021-09-07

申请号：US15109030

申请日：2015-01-20

申请人： Covestro Deutschland AG ,  OSRAM OLED GmbH

发明人： Heinz Pudleiner ,  Klaus Meyer ,  Benjamin Krummacher ,  Simon Schicktanz

IPC分类号： H01L51/52 ,  H01L51/56

摘要： The present invention relates to an organic radiation-emitting component with an active organic layer constituted to generate radiation and one or two radiation-output sides, characterised in that, on at least one radiation-output side of the component, a UV protective film is arranged and connected to the component, wherein the UV protective film contains at least one first layer (A) and a second layer (B), wherein the first layer (A) contains 0.01 to 20% by weight, with reference to the total weight of the first layer (A), of a UV absorber, and wherein the second layer (B) contains polycarbonate. Furthermore, the invention relates to the use of a component according to the invention as an organic light-emitting diode, and for lighting, especially for general lighting.

公开(公告)号：US10571092B2

公开(公告)日：2020-02-25

申请号：US15767348

申请日：2016-10-06

申请人： OSRAM OLED GmbH

发明人： Benjamin Claus Hoeflinger ,  Simon Schicktanz

IPC分类号： F21V21/00 ,  F21S43/145 ,  B60Q1/26 ,  F21S43/19 ,  B60Q3/74 ,  F21Y115/10

摘要： The invention relates to an optoelectronic module, comprising a housing (11) having a first housing part (11) having a first cover surface (11a) and an opening (4); a mechanically flexibly designed organic light source (2) having an illuminating surface (2a); and a cover element (3) which is mounted on the illuminating surface (2a) and has a light-transmissive surface (3a) facing away from the illuminating surface (2a), wherein the organic light source (2) is introduced at least at some points into the opening (14), the first cover surface (11a) is curved and/or bowed, the size of the illuminating surface (2a) is at least 1 cm2, preferably at least 5 cm2, and the distance between the illuminating surface (2a) and the first cover surface (11a) is at most 1 cm, preferably at most 5 mm.

公开(公告)号：US10177202B2

公开(公告)日：2019-01-08

申请号：US15060635

申请日：2016-03-04

申请人： OSRAM OLED GmbH

发明人： Arne Fleissner ,  Simon Schicktanz ,  Erwin Lang ,  Nina Riegel ,  Egbert Hoefling

IPC分类号： H01L27/32

摘要： A double-sided emissive organic display device includes a carrier, a control element layer structure above the carrier, a plurality of first organic light emitting components, which are formed above the carrier, which are electrically connected to the control element layer structure and which are driven by means of the control element layer structure during the operation of the double-sided emissive organic display device and emit first light substantially in a direction toward the carrier, and a plurality of second organic light emitting components, which are formed above the control element layer structure and which are electrically connected to the control element layer structure and which are driven by means of the control element layer structure during the operation of the double-sided emissive organic display device and emit second light substantially in a direction away from the carrier.

公开(公告)号：US09941473B2

公开(公告)日：2018-04-10

申请号：US14408962

申请日：2013-06-20

申请人： OSRAM OLED GmbH

发明人： Simon Schicktanz

IPC分类号： H01L51/00 ,  F21V19/00 ,  F16B2/02 ,  F16B17/00 ,  F16B19/00 ,  F16B19/04 ,  F16B33/00 ,  H01L51/52 ,  H01L51/56 ,  F21Y105/00 ,  F21Y115/15

CPC分类号： H01L51/0001 ,  F16B2/02 ,  F16B17/00 ,  F16B19/00 ,  F16B19/04 ,  F16B33/00 ,  F21V19/0025 ,  F21Y2105/00 ,  F21Y2115/15 ,  H01L51/52 ,  H01L51/524 ,  H01L51/56 ,  Y10T24/32 ,  Y10T24/42 ,  Y10T29/41 ,  Y10T403/7062 ,  Y10T403/7075

摘要： Various embodiments relate to a method for closely connecting an organic optoelectronic component to a connection piece, including forming a first cavity in the organic optoelectronic component, wherein the first cavity has at least a first opening, introducing a connecting structure through the first opening into the first cavity, wherein the connecting structure has a first fixing area, wherein the first fixing area is configured partially complementarily to the form of the first cavity, forming a second cavity in a connection piece, wherein the second cavity has at least a second opening, wherein the second cavity is configured partially complementarily to the form of the second fixing area, and introducing a second fixing area through the second opening into the second cavity, and forming a friction-fitting connection of the organic optoelectronic component with the connecting piece once the connecting structure has been introduced into the first and the second cavity.

公开(公告)号：US20170358747A1

公开(公告)日：2017-12-14

申请号：US15541720

申请日：2016-01-05

申请人： OSRAM OLED GmbH

发明人： Stefan Hartinger ,  Simon Schicktanz ,  Thorsten Vehoff

IPC分类号： H01L51/00 ,  H01L51/52

CPC分类号： H01L51/0023 ,  H01L51/5203 ,  H01L51/5209 ,  H01L51/5225

摘要： A method for producing an organic light-emitting component is disclosed with providing a carrier, forming a first electrode over the carrier, forming an organic functional layer structure over the first electrode, and forming a second electrode over the functional layer structure. The first and second electrodes and the functional layer structure overlap in an optically active region which extends in the lateral direction and is embodied to generate light. In an optically inactive region extending over the carrier in the lateral direction, an electrically conductive contact layer is formed over the carrier, so that it is in direct physical and electrical contact with the first electrode and/or the second electrode. A first contact section and at least one second contact section of the layer are separated from one another by a lithographic process, so that they are electrically insulated from one another. The layer is structured by a laser beam.

公开(公告)号：US09741965B2

公开(公告)日：2017-08-22

申请号：US14901110

申请日：2014-06-13

申请人： OSRAM OLED GmbH

发明人： Erwin Lang ,  Philipp Schwamb ,  Simon Schicktanz

IPC分类号： H01L51/52 ,  H01L51/00 ,  H01L51/56 ,  H01L27/32

CPC分类号： H01L51/5253 ,  H01L27/3272 ,  H01L51/0097 ,  H01L51/52 ,  H01L51/524 ,  H01L51/5243 ,  H01L51/5246 ,  H01L51/5284 ,  H01L51/529 ,  H01L51/56 ,  H01L2251/5338 ,  H01L2251/566

摘要： Various embodiments may relate to a method for processing an electronic component. The method includes applying a planar structure provided with predetermined separation locations to the electronic component, and removing a part of the applied planar structure, wherein removing includes separating the planar structure at the predetermined separation locations.

公开(公告)号：US09502316B2

公开(公告)日：2016-11-22

申请号：US14398474

申请日：2013-04-24

申请人： OSRAM OLED GmbH

发明人： Simon Schicktanz ,  Daniel Steffen Setz

IPC分类号： H01L21/66 ,  H01L29/06 ,  H01L51/00 ,  H01L51/52 ,  H01L51/56 ,  H01L29/16 ,  H01L29/41 ,  H01L51/50

CPC分类号： H01L22/20 ,  H01L29/0665 ,  H01L29/1606 ,  H01L29/413 ,  H01L51/0031 ,  H01L51/50 ,  H01L51/5262 ,  H01L51/56 ,  H01L2251/5361 ,  H01L2251/568

摘要： A method for producing a plurality of optoelectronic components may include measuring at least one measurement parameter for a first optoelectronic component and a second optoelectronic component, and processing the first optoelectronic component and the second optoelectronic component taking account of the measured measurement parameter value of the first optoelectronic component and the measured measurement parameter value of the second optoelectronic component, such that the optoelectronic properties of the first optoelectronic component and the optoelectronic properties of the second optoelectronic component are changed in a different way toward at least one common predefined optoelectronic target property. The processing of at least one value of a measurement parameter of the optoelectronic properties of the first optoelectronic component or of the optoelectronic properties of the second optoelectronic component toward the optoelectronic target property is formed by means of a compensation element. The compensation element is formed as a film.

摘要翻译： 用于制造多个光电子部件的方法可以包括测量第一光电子部件和第二光电部件的至少一个测量参数，以及考虑第一光电子部件和第二光电部件的测量测量参数值来处理第一光电子部件和第二光电部件 光电子部件和测量的第二光电子部件的测量参数值，使得第一光电子部件的光电子性质和第二光电子部件的光电子性质以不同的方式朝向至少一个共同的预定义光电目标特性改变。 通过补偿元件来形成第一光电子部件的光电子特性或第二光电子部件的光电子特性的测量参数的至少一个值朝向光电子目标特性的处理。 补偿元件形成为膜。

公开(公告)号：US20160233398A1

公开(公告)日：2016-08-11

申请号：US15029696

申请日：2014-10-16

申请人： OSRAM OLED GMBH

发明人： Joerg Farrnbacher ,  Simon Schicktanz

IPC分类号： H01L33/62 ,  H01L33/56

CPC分类号： H01L33/62 ,  H01L24/01 ,  H01L33/56 ,  H01L2251/5361 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2933/0066 ,  H01L2924/00

摘要： In various embodiments, an optoelectronic component is provided. The optoelectronic component includes a carrier body. An optoelectronic layer structure is formed above the carrier body and has at least one contact region for electrically contacting the optoelectronic layer structure. A covering body is arranged above the optoelectronic layer structure. At least one contact cutout in which at least one part of the contact region is exposed extends through the carrier body and/or the covering body. At least one plug element for electrically contacting the optoelectronic component is arranged at least partly in the contact cutout and tightly closes the contact cutout. A contact medium, via which the plug element is electrically coupled to the contact region, is arranged in the contact cutout.

摘要翻译： 在各种实施例中，提供了光电子部件。 光电子部件包括载体主体。 光电子层结构形成在载体主体上方，并具有至少一个用于电接触光电子层结构的接触区域。 覆盖体设置在光电子层结构的上方。 至少一个触点切口，其中接触区域的至少一部分被暴露延伸穿过载体主体和/或覆盖体。 用于电接触光电子部件的至少一个插塞元件至少部分地布置在触点切口中并且紧密地闭合触头切口。 接触介质，其中插塞元件电耦合到接触区域，布置在接触切口中。

公开(公告)号：US20160118622A1

公开(公告)日：2016-04-28

申请号：US14979624

申请日：2015-12-28

申请人： OSRAM OLED GmbH

发明人： Benjamin Krummacher ,  Joerg Farrnbacher ,  Simon Schicktanz ,  Kilian Regau

IPC分类号： H01L51/52 ,  H01L51/44 ,  H01L51/56

CPC分类号： H01L51/5253 ,  H01L51/441 ,  H01L51/448 ,  H01L51/5203 ,  H01L51/5206 ,  H01L51/5221 ,  H01L51/524 ,  H01L51/56 ,  H01L2251/5361 ,  H01L2251/558

摘要： Various embodiments may relate to an optoelectronic component, including an optically active region formed for taking up and/or for providing electromagnetic radiation, at least one first contact structure, wherein the optically active region is electrically conductively coupled to the first contact structure, and an encapsulation structure with a second contact structure, wherein the encapsulation structure is formed on or above the optically active region and the first contact structure, and an electrically conductive structure formed for electrically conductively connecting the first contact structure to the second contact structure, wherein the encapsulation structure is at least partly formed by an electrically insulating molding compound, wherein the electrically insulating molding compound at least partly surrounds the electrically conductive structure.

摘要翻译： 各种实施例可以涉及光电子部件，包括形成用于吸收和/或提供电磁辐射的光学有源区域，至少一个第一接触结构，其中光学有源区域电导耦合到第一接触结构，以及 具有第二接触结构的封装结构，其中所述封装结构形成在所述光学有源区域和所述第一接触结构上或上方，以及形成用于将所述第一接触结构导电连接到所述第二接触结构的导电结构，其中所述封装 结构至少部分地由电绝缘模塑料形成，其中电绝缘模塑料至少部分地围绕导电结构。

公开(公告)号：US20150171378A1

公开(公告)日：2015-06-18

申请号：US14419964

申请日：2013-08-07

申请人： OSRAM OLED GMBH

发明人： Michael Popp ,  Simon Schicktanz

IPC分类号： H01L51/56 ,  H01L51/44 ,  H01L51/52

CPC分类号： H01L51/56 ,  H01L51/0014 ,  H01L51/441 ,  H01L51/448 ,  H01L51/5206 ,  H01L51/5221 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5253 ,  H01L2924/0002 ,  H01L2924/00

摘要： Various embodiments may relate to a method for producing an organic optoelectronic component, including forming a first layer on or over a substrate, the substrate including at least one contact pad of the organic optoelectronic component, at least one electrode of the organic optoelectronic component being electrically connected to the at least one contact pad, forming a second layer on or over the first layer, and removing at least the second layer in at least one region of the substrate with the first layer and the contact pad. The adhesion of the substance or of the substance mixture of the first layer on the interface with the substrate is less than the adhesion of the substance or of the substance mixture of the second layer on the interface with the substrate.

摘要翻译： 各种实施方案可涉及用于生产有机光电子部件的方法，包括在衬底上或衬底上形成第一层，所述衬底包括有机光电子部件的至少一个接触焊盘，所述有机光电子部件的至少一个电极是电 连接到所述至少一个接触焊盘，在所述第一层之上或之上形成第二层，以及在所述第一层和所述接触焊盘的至少一个所述衬底的区域中移除至少所述第二层。 第一层物质或物质混合物与基材界面的粘附性小于物质或第二层物质混合物与基材界面的粘附性。