公开(公告)号：US10308758B2

公开(公告)日：2019-06-04

申请号：US15024910

申请日：2014-09-25

Applicant: DAICEL CORPORATION

Inventor： Hiroki Tanaka ,  Katsuhiro Nakaguchi

IPC: C08G59/24 ,  H01L23/538 ,  H01L23/00 ,  H01L25/065 ,  H01L21/56 ,  C08G59/22 ,  C08G59/40 ,  C08K3/36 ,  C08K5/5425 ,  H01L23/29 ,  H01L23/31 ,  C08G59/68 ,  C08L63/00 ,  H01L21/78

Abstract: Provided are a filling component useful for the production of a thin, low-profile three-dimensional integrated semiconductor device via a COW process, and a curable composition for the formation of the filling component. The filling component according to the present invention for three-dimensional mounting of semiconductor elements is used to fill gaps between laterally adjacent semiconductor elements in the production of a three-dimensional integrated semiconductor device by stacking and integrating semiconductor elements. The filling component is a component that is polished and/or ground flat from the front side of semiconductor elements while gaps between the semiconductor elements are filled with the filling component.

公开(公告)号：US10047257B2

公开(公告)日：2018-08-14

申请号：US15025143

申请日：2014-09-25

Applicant: DAICEL CORPORATION

Inventor： Hiroki Tanaka ,  Katsuhiro Nakaguchi ,  Kiyoharu Tsutsumi ,  Yousuke Ito ,  Naoko Tsuji

IPC: H01L21/00 ,  C09J163/00 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H01L23/00 ,  C08G59/68 ,  C09J7/35 ,  H01L23/29

Abstract: Provided is an adhesive composition for multilayer semiconductors. The adhesive composition gives, when applied and dried by heating, an adhesive layer that has approximately no adhesiveness at a temperature lower than 50° C., but, when heated at such a temperature as to less cause damage to semiconductor chips, offers adhesiveness and is rapidly cured thereafter. This adhesive composition for multilayer semiconductors includes a polymerizable compound (A), at least one of a cationic-polymerization initiator (B1) and an anionic-polymerization initiator (B2), and a solvent (C). The polymerizable compound (A) contains 80% by weight or more of an epoxide having a softening point or melting point of 50° C. or higher. The cationic-polymerization initiator (B1) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C., where the composition contains 1 part by weight of the cationic-polymerization initiator (B1) and 100 parts by weight of 3,4-epoxycyclohexylmethyl (3,4-epoxy)cyclohexanecarboxylate. The anionic-polymerization initiator (B2) gives a composition having a thermal curing time of 3.5 minutes or longer at 130° C., where the composition contains 1 part by weight of the anionic-polymerization initiator (B2) and 100 parts by weight of bisphenol-A diglycidyl ether.

公开(公告)号：US10118322B2

公开(公告)日：2018-11-06

申请号：US14764095

申请日：2014-01-27

Applicant: DAICEL CORPORATION

Inventor： Tomoya Mizuta ,  Takuya Osaka ,  Katsuhiro Nakaguchi ,  Arimichi Okumura ,  Hiroto Miyake ,  Masaya Omura ,  Naotaka Nishio

IPC: B29C43/36 ,  B29C33/00 ,  B81C99/00 ,  B29C43/02 ,  B29C59/02 ,  C08L83/04 ,  G03F7/00 ,  B29C33/40 ,  B29L31/00 ,  B29C33/42

Abstract: Provided is a sheet-shaped mold possessing a high strength and having a low breakage rate in demolding even in a case where the mold is thin and has a large-area. The sheet-shaped mold is prepared by combining a cured silicone rubber containing a polyorganosiloxane and a fiber for reinforcing the cured silicone rubber. The fiber may comprise a cellulose nanofiber. The sheet-shaped mold may have an uneven pattern on at least one surface (or side) thereof. The fiber may be surface-treated with a hydrophobizing agent. The fiber may forma nonwoven fabric, and the nonwoven fabric may be impregnated with the cured silicone rubber. The cured silicone rubber may comprise a two-component curable silicone rubber having a polydimethylsiloxane unit. The sheet-shaped mold may be a mold for nanoimprint lithography using a photo-curable resin.