公开(公告)号：US20230382714A1

公开(公告)日：2023-11-30

申请号：US18201710

申请日：2023-05-24

Applicant: DB HITEK CO., LTD.

Inventor： Min Hyun JUNG ,  Joo Hyeon LEE

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81C1/00158 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/0307 ,  B81B2203/0315 ,  B81B2203/0338 ,  B81B2203/0353 ,  B81B2203/04 ,  B81C2201/0154 ,  B81C2201/014 ,  B81C2201/0133 ,  B81C2201/0166 ,  B81C2201/0164

Abstract: A MEMS microphone includes a substrate having a cavity, a diaphragm disposed above the cavity and having a ventilation path, and a back plate disposed above the diaphragm and having a plurality of air holes. The ventilation path includes a plurality of slits extending in a circumferential direction.