公开(公告)号：US10453956B2

公开(公告)日：2019-10-22

申请号：US16436939

申请日：2019-06-11

Applicant: DELTA ELECTRONICS, INC.

Inventor： Chao-Feng Cai ,  Jian-Hong Zeng ,  Zeng Li ,  Xiao-Ni Xin

IPC: H01L29/78 ,  H01L23/50 ,  H01L23/00 ,  H01L29/10 ,  H01L29/40 ,  H01L29/417

Abstract: A semiconductor packaging structure includes a chip, a first pin, a second pin, and a third pin. The chip includes a first surface, a second surface, a first power switch, and a second switch, and both the first power switch and the second switch include a first terminal and a second terminal. The second surface of the chip is opposite to the first surface of the chip. The first pin does not contact to the second pin. The first terminal of the first power switch of the chip is coupled to the first pin, and the second terminal of the first power switch of the chip is coupled to the third pin. The first terminal of the second power switch of the chip is coupled to the third pin, and the second terminal of the second power switch of the chip is coupled to the second pin.

公开(公告)号：US11018596B2

公开(公告)日：2021-05-25

申请号：US15285473

申请日：2016-10-04

Applicant: DELTA ELECTRONICS, INC.

Inventor： Jian-Hong Zeng ,  Xiao-Ni Xin ,  Rui Wu ,  Min Zhou ,  Hao-Yi Ye

IPC: H01F17/04 ,  H02M7/00 ,  H02M3/00 ,  H01F38/14 ,  H02M3/158 ,  H02M5/293 ,  H02M7/537 ,  H01F17/06

Abstract: A power converter device includes a power element module, a conductor, and a magnetic-conductive assembly. The power element module includes at least two electrodes and a power semiconductor unit. Voltage among these electrodes is AC voltage. The power semiconductor unit includes at least one pure die, and the pure die includes plural surfaces. The surface which occupies the most area of the pure die is the pure die surface. The conductor is coupled to the power element module. A current loop forms between the power element module and the conductor. A magnetic loop forms in the magnetic-conductive assembly. The magnetic-conductive assembly includes a chamber. The current loop passes through the chamber and intersects the magnetic loop to form inductance which the current loop needs. A part of the power element module is disposed in the chamber.

公开(公告)号：US11646672B2

公开(公告)日：2023-05-09

申请号：US17226105

申请日：2021-04-09

Applicant: DELTA ELECTRONICS, INC.

Inventor： Jian-Hong Zeng ,  Xiao-Ni Xin ,  Rui Wu ,  Min Zhou ,  Hao-Yi Ye

IPC: H01F17/04 ,  H02M7/00 ,  H02M3/00 ,  H01F38/14 ,  H02M3/158 ,  H02M5/293 ,  H02M7/537 ,  H01F17/06

CPC classification number: H02M7/003 ,  H01F17/04 ,  H01F38/14 ,  H02M3/003 ,  H02M3/158 ,  H02M5/293 ,  H02M7/537 ,  H01F2017/065

Abstract: A power converter device includes a first current level, a second current level, a first magnetic layer and a second magnetic layer. The first current level and the second current level are used to load a current loop which has AC current component. The current loop includes a power element module and a conductor coupled to the power element module. The power element module includes at least two electrodes. Voltage among the at least two electrodes is AC voltage. AC current magnitudes of the at least two electrodes are substantially equal and in the opposite direction. The first magnetic layer and the second magnetic layer are used to load a magnetic loop which includes AC magnetic flux component. The first magnetic layer and the second magnetic layer are disposed along two opposite sides of the first current level.

公开(公告)号：US09819263B2

公开(公告)日：2017-11-14

申请号：US15286542

申请日：2016-10-05

Applicant: DELTA ELECTRONICS, INC.

Inventor： Jian-Hong Zeng ,  Shou-Yu Hong ,  Xiao-Ni Xin ,  Pei-Qing Hu

IPC: H02M3/156 ,  H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H01F27/24 ,  H05K3/30 ,  H05K1/11 ,  H01F27/28 ,  H05K3/40 ,  H05K1/14

CPC classification number: H02M3/156 ,  H01F27/24 ,  H01F27/28 ,  H01F27/292 ,  H01F41/02 ,  H05K1/028 ,  H05K1/111 ,  H05K1/145 ,  H05K1/147 ,  H05K1/18 ,  H05K1/181 ,  H05K3/22 ,  H05K3/305 ,  H05K3/4038 ,  H05K2201/1003 ,  H05K2201/10946 ,  H05K2203/02 ,  H05K2203/0228

Abstract: A power converter includes a carrier, a first electronic component, a second electronic component, and a connection part. The first electronic component is disposed on the bottom surface of the carrier. The second electronic component is disposed on the top surface of the carrier. A first terminal of the connection part is coupled to the top surface or the bottom surface of the carrier. A second terminal of the connection part is a bonding pad and attached to the first electronic component's surface apart from the carrier. The carrier is disposed at ⅓ to ⅔ of a height of the power-converter. The connection part is fabricated by mechanical support of the first electronic component.