公开(公告)号：US20220270911A1

公开(公告)日：2022-08-25

申请号：US17651114

申请日：2022-02-15

Applicant: DISCO CORPORATION

Inventor： Yoshinori KAKINUMA ,  Takashi MORI ,  Yoshinobu SAITO

IPC: H01L21/683 ,  H01L21/677 ,  B25J11/00 ,  B23K26/364 ,  B23K26/402

Abstract: A processing apparatus includes a wafer carrying-out unit, a wafer table that supports a wafer carried out, a frame carrying-out unit, a frame table that supports an annular frame carried out, a tape sticking unit that sticks a tape to the frame, a tape-attached frame conveying unit, a tape pressure bonding unit that executes pressure bonding of the tape of a tape-attached frame to a back surface of the wafer, a frame unit carrying-out unit, and a beveled part removing unit that cuts and removes, in a ring manner, a beveled part formed in an outer circumferential surplus region from the wafer of a frame unit.

公开(公告)号：US20210090954A1

公开(公告)日：2021-03-25

申请号：US17024210

申请日：2020-09-17

Applicant: DISCO CORPORATION

Inventor： Takashi MORI ,  Makoto KOBAYASHI ,  Kazunari TAMURA ,  Okito UMEHARA

IPC: H01L21/78 ,  H01L21/66 ,  H01L21/67

Abstract: There is provided a method of processing a wafer having devices formed in respective areas on a face side thereof that are demarcated by a plurality of crossing projected dicing lines on the face side. The method of processing a wafer includes a wafer unit forming step of forming a wafer unit having a wafer, a tape, and an annular frame, a dividing step of dividing the wafer along the projected dicing lines into a plurality of device chips, a pick-up step of picking up one at a time of the device chips from the wafer unit, and a measuring step of measuring the device chip picked up in the pick-up step. The method also includes a distinguishing step, before the pick-up step, of inspecting properties of the devices to distinguish acceptable devices and defective devices among the devices and storing distinguished results.

公开(公告)号：US20230268220A1

公开(公告)日：2023-08-24

申请号：US18169282

申请日：2023-02-15

Applicant: DISCO CORPORATION

Inventor： Kazuki SUGIURA ,  Takashi MORI ,  Yoshinori KAKINUMA ,  Tetsuya HOSONO ,  Kaoru AMANO

IPC: H01L21/683 ,  H01L21/02 ,  H01L21/67 ,  H01L21/77

CPC classification number: H01L21/6836 ,  H01L21/0206 ,  H01L21/67132 ,  H01L21/67023 ,  H01L21/77 ,  H01L2221/68318 ,  H01L2221/68386

Abstract: A wafer transfer method for forming a second work unit by transferring a wafer of a first work unit including a first ring frame, a first adhesive tape, and the wafer to a second adhesive tape includes sandwiching a claw body between the first ring frame and a second ring frame, affixing the second adhesive tape to a surface of the wafer which surface is not affixed to the first adhesive tape, holding the wafer by the second ring frame via the second adhesive tape, and peeling off the first adhesive tape from the wafer.

公开(公告)号：US20230121008A1

公开(公告)日：2023-04-20

申请号：US18047445

申请日：2022-10-18

Applicant: DISCO CORPORATION

Inventor： Takashi MORI ,  Yoshinori KAKINUMA ,  Jonghyun RYU ,  Mitsuru IKUSHIMA ,  Makoto SAITO ,  Yohei MASUDA ,  Takashi UCHIHO ,  Yoshinobu SAITO

IPC: H01L21/683 ,  H01L21/67 ,  B23K26/364

Abstract: A processing apparatus includes a wafer table that supports a wafer, a frame table that supports an annular frame, a first tape pressure bonding unit that includes a first pressure bonding roller for executing pressure bonding of a tape to the annular frame, and a second tape pressure bonding unit that includes a second pressure bonding roller for executing pressure bonding of the tape of the tape-attached annular frame to a front surface or a back surface of the wafer. A first heating unit is disposed in one of or both the frame table and the first pressure bonding roller, while a second heating unit is disposed in one of or both the wafer table and the second pressure bonding roller.

公开(公告)号：US20230223303A1

公开(公告)日：2023-07-13

申请号：US18184181

申请日：2023-03-15

Applicant: DISCO CORPORATION

Inventor： Takashi MORI ,  Makoto KOBAYASHI ,  Kazunari TAMURA ,  Okito UMEHARA

IPC: H01L21/78 ,  H01L21/67 ,  H01L21/66

CPC classification number: H01L21/78 ,  H01L21/67271 ,  H01L22/12

Abstract: There is provided a method of processing a wafer having devices formed in respective areas on a face side thereof that are demarcated by a plurality of crossing projected dicing lines on the face side. The method of processing a wafer includes a wafer unit forming step of forming a wafer unit having a wafer, a tape, and an annular frame, a dividing step of dividing the wafer along the projected dicing lines into a plurality of device chips, a pick-up step of picking up one at a time of the device chips from the wafer unit, and a measuring step of measuring the device chip picked up in the pick-up step. The method also includes a distinguishing step, before the pick-up step, of inspecting properties of the devices to distinguish acceptable devices and defective devices among the devices and storing distinguished results.

公开(公告)号：US20220108910A1

公开(公告)日：2022-04-07

申请号：US17448070

申请日：2021-09-20

Applicant: DISCO CORPORATION

Inventor： Yoshinobu SAITO ,  Yoshinori KAKINUMA ,  Takashi MORI

IPC: H01L21/683

Abstract: A holding mechanism includes a wafer holding section that holds a wafer under suction, and a frame support section that is disposed on the outer circumference of the wafer holding section and that supports a frame. The frame support section includes a permanent magnet.

公开(公告)号：US20220020614A1

公开(公告)日：2022-01-20

申请号：US17371720

申请日：2021-07-09

Applicant: DISCO CORPORATION

Inventor： Yukiyasu MASUDA ,  Yoshikuni MIGIYAMA ,  Takashi UCHIHO ,  Ryosuke KUROSAWA ,  Toshiyuki YOSHIKAWA ,  Toshio TSUCHIYA ,  Masanobu TAKENAKA ,  Tomoyuki HONGO ,  Takashi MORI ,  Yoshinori KAKINUMA ,  Yoshinobu SAITO ,  Jonghyun RYU

IPC: H01L21/67 ,  H01L21/683

Abstract: A processing apparatus includes a wafer conveying-out mechanism; a wafer table; a frame conveying-out mechanism; a frame table; a tape attaching mechanism that attaches a tape to a frame; a tape-attached frame conveying mechanism that conveys the tape-attached frame; a tape pressure bonding mechanism that pressure bonds the tape of the tape-attached frame to a back surface of a wafer; a frame unit conveying-out mechanism that conveys out a frame unit in which the tape of the tape-attached frame and the back surface of the wafer are pressure bonded; a reinforcement section removing mechanism that cuts and removes a ring-shaped reinforcement section from the wafer; a ringless unit conveying-out mechanism that conveys out a ringless unit from which the reinforcement section has been removed; and a frame cassette table on which a frame cassette accommodating the ringless unit is to be placed.

公开(公告)号：US20190308399A1

公开(公告)日：2019-10-10

申请号：US16375041

申请日：2019-04-04

Applicant: DISCO CORPORATION

Inventor： Takashi MORI ,  Yoshikuni MIGIYAMA ,  Yuta TANIYAMA ,  Mitsuru IKUSHIMA ,  Shinichi NAMIOKA ,  Makoto SAITO ,  Emiko KAWAMURA ,  Yoshinori KAKINUMA ,  Kazuki SUGIURA

IPC: B32B37/02 ,  H01L23/00 ,  B32B37/12 ,  B32B38/00 ,  C09J5/00

Abstract: A protective sheet disposing method of disposing a protective sheet on a top surface of a wafer in which a device region having a plurality of devices formed thereon and a peripheral surplus region surrounding the device region are formed, the protective sheet disposing method including: a first protective sheet preparing step of preparing a first protective sheet having a non-adhesive portion corresponding to the device region and an adhesive portion having an adhesive layer laid on a periphery of the non-adhesive portion; a protective sheet affixing step of affixing the first protective sheet to the peripheral surplus region; a liquid resin dropping step of dropping a liquid resin onto a region of a second protective sheet; an integrating step of integrating the first protective sheet and the second protective sheet with each other; and a cutting step of cutting the first protective sheet and the second protective sheet.