Fin-field effect transistors (Fin-FETs) having protection layers
    1.
    发明申请
    Fin-field effect transistors (Fin-FETs) having protection layers 有权
    具有保护层的鳍场效应晶体管(Fin-FET)

    公开(公告)号:US20070034925A1

    公开(公告)日:2007-02-15

    申请号:US11586225

    申请日:2006-10-25

    IPC分类号: H01L29/94

    CPC分类号: H01L29/7851 H01L29/66795

    摘要: Fin-Field Effect Transistors (Fin-FETs) are provided. A fin is provided on an integrated circuit substrate. The fin defines a trench on the integrated circuit substrate. A first insulation layer is provided in the trench such that a surface of the first insulation layer is recessed beneath a surface of the fin exposing sidewalls of the fin. A protection layer is provided on the first insulation layer and a second insulation layer is provided on the protection layer in the trench such that protection layer is between the second insulation layer and the sidewalls of the fin.

    摘要翻译: 提供了场效应晶体管(Fin-FET)。 翅片设置在集成电路基板上。 翅片限定集成电路基板上的沟槽。 第一绝缘层设置在沟槽中,使得第一绝缘层的表面在鳍片的暴露翅片侧壁的表面下方凹进。 保护层设置在第一绝缘层上,第二绝缘层设置在沟槽中的保护层上,使得保护层位于第二绝缘层和鳍的侧壁之间。

    Methods of fabricating Fin-field effect transistors (Fin-FETs) having protection layers
    2.
    发明授权
    Methods of fabricating Fin-field effect transistors (Fin-FETs) having protection layers 有权
    制造具有保护层的Fin场效应晶体管(Fin-FET)的方法

    公开(公告)号:US07141456B2

    公开(公告)日:2006-11-28

    申请号:US10871742

    申请日:2004-06-18

    IPC分类号: H01L21/84 H01L21/332

    CPC分类号: H01L29/7851 H01L29/66795

    摘要: Methods for fabricating Fin-Field Effect Transistors (Fin-FETs) are provided. A fin is formed on an integrated circuit substrate. The fin defines a trench on the integrated circuit substrate. A first insulation layer is formed in the trench such that a surface of the first insulation layer is recessed beneath a surface of the fin exposing sidewalls of the fin. A protection layer is formed on the first insulation layer and a second insulation layer is formed on the protection layer in the trench such that protection layer is between the second insulation layer and the sidewalls of the fin. Related Fin-FETs are also provided.

    摘要翻译: 提供制造鳍场效应晶体管(Fin-FET)的方法。 翅片形成在集成电路基板上。 翅片限定集成电路基板上的沟槽。 第一绝缘层形成在沟槽中,使得第一绝缘层的表面在鳍片的暴露在翅片的侧壁的表面下方凹进。 保护层形成在第一绝缘层上,并且第二绝缘层形成在沟槽中的保护层上,使得保护层位于第二绝缘层和鳍的侧壁之间。 还提供了相关的Fin-FET。

    Fin-field effect transistors (Fin-FETs) having protection layers
    3.
    发明授权
    Fin-field effect transistors (Fin-FETs) having protection layers 有权
    具有保护层的鳍场效应晶体管(Fin-FET)

    公开(公告)号:US07535061B2

    公开(公告)日:2009-05-19

    申请号:US11586225

    申请日:2006-10-25

    IPC分类号: H01L21/84

    CPC分类号: H01L29/7851 H01L29/66795

    摘要: Fin-Field Effect Transistors (Fin-FETs) are provided. A fin is provided on an integrated circuit substrate. The fin defines a trench on the integrated circuit substrate. A first insulation layer is provided in the trench such that a surface of the first insulation layer is recessed beneath a surface of the fin exposing sidewalls of the fin. A protection layer is provided on the first insulation layer and a second insulation layer is provided on the protection layer in the trench such that protection layer is between the second insulation layer and the sidewalls of the fin.

    摘要翻译: 提供了场效应晶体管(Fin-FET)。 翅片设置在集成电路基板上。 翅片限定集成电路基板上的沟槽。 第一绝缘层设置在沟槽中,使得第一绝缘层的表面在鳍片的暴露翅片侧壁的表面下方凹进。 保护层设置在第一绝缘层上,第二绝缘层设置在沟槽中的保护层上,使得保护层位于第二绝缘层和鳍的侧壁之间。

    Methods of fabricating MOS transistors having recesses with elevated source/drain regions
    4.
    发明授权
    Methods of fabricating MOS transistors having recesses with elevated source/drain regions 有权
    制造具有升高的源极/漏极区域的凹槽的MOS晶体管的方法

    公开(公告)号:US08304318B2

    公开(公告)日:2012-11-06

    申请号:US13241311

    申请日:2011-09-23

    IPC分类号: H01L21/336

    摘要: Methods of fabricating metal-oxide-semiconductor (MOS) transistors having elevated source/drain regions are provided. The MOS transistors formed by these methods may include a gate pattern formed to cross over a predetermined region of a substrate. Recessed regions are provided in the substrate adjacent to the gate pattern. Epitaxial layers are provided on bottom surfaces of the recessed regions. High concentration impurity regions are provided in the epitaxial layers. The recessed regions may be formed using a chemical dry etching techniques.

    摘要翻译: 提供了具有升高的源极/漏极区域的金属氧化物半导体(MOS)晶体管的制造方法。 通过这些方法形成的MOS晶体管可以包括形成为跨越衬底的预定区域的栅极图案。 凹陷区域设置在与栅极图案相邻的衬底中。 外凹层设置在凹陷区域的底表面上。 在外延层中设置高浓度杂质区。 凹陷区域可以使用化学干蚀刻技术形成。

    Methods for fabricating fin field effect transistors using a protective layer to reduce etching damage
    6.
    发明申请
    Methods for fabricating fin field effect transistors using a protective layer to reduce etching damage 失效
    使用保护层制造鳍状场效应晶体管以减少蚀刻损伤的方法

    公开(公告)号:US20050019993A1

    公开(公告)日:2005-01-27

    申请号:US10869764

    申请日:2004-06-16

    摘要: A method of forming a fin field effect transistor on a semiconductor substrate includes forming a vertical fin protruding from the substrate. A buffer oxide liner is formed on a top surface and on sidewalls of the fin. A trench is then formed on the substrate, where at least a portion of the fin protrudes from a bottom surface of the trench. The trench may be formed by forming a dummy gate on at least a portion of the fin, forming an insulation layer on the fin surrounding the dummy gate, and then removing the dummy gate to expose the at least a portion of the fin, such that the trench is surrounded by the insulation layer. The buffer oxide liner is then removed from the protruding portion of the fin, and a gate is formed in the trench on the protruding portion of the fin.

    摘要翻译: 在半导体衬底上形成鳍状场效应晶体管的方法包括形成从衬底突出的垂直翅片。 缓冲氧化物衬垫形成在翅片的顶表面和侧壁上。 然后在衬底上形成沟槽,其中鳍的至少一部分从沟槽的底表面突出。 可以通过在鳍片的至少一部分上形成伪栅极来形成沟槽,在围绕虚拟栅极的鳍片上形成绝缘层,然后去除伪栅极以暴露鳍片的至少一部分,使得 沟槽被绝缘层包围。 然后从鳍片的突出部分去除缓冲氧化物衬垫,并且在鳍片的突出部分上的沟槽中形成栅极。

    Methods of fabricating MOS transistors having recesses with elevated source/drain regions
    7.
    发明授权
    Methods of fabricating MOS transistors having recesses with elevated source/drain regions 有权
    制造具有升高的源极/漏极区域的凹槽的MOS晶体管的方法

    公开(公告)号:US08039350B2

    公开(公告)日:2011-10-18

    申请号:US12582073

    申请日:2009-10-20

    IPC分类号: H01L21/336

    摘要: Methods of fabricating metal-oxide-semiconductor (MOS) transistors having elevated source/drain regions are provided. The MOS transistors formed by these methods may include a gate pattern formed to cross over a predetermined region of a substrate. Recessed regions are provided in the substrate adjacent to the gate pattern. Epitaxial layers are provided on bottom surfaces of the recessed regions. High concentration impurity regions are provided in the epitaxial layers. The recessed regions may be formed using a chemical dry etching techniques.

    摘要翻译: 提供了具有升高的源极/漏极区域的金属氧化物半导体(MOS)晶体管的制造方法。 通过这些方法形成的MOS晶体管可以包括形成为跨越衬底的预定区域的栅极图案。 凹陷区域设置在与栅极图案相邻的衬底中。 外凹层设置在凹陷区域的底表面上。 在外延层中设置高浓度杂质区。 凹陷区域可以使用化学干蚀刻技术形成。

    Methods for fabricating fin field effect transistors using a protective layer to reduce etching damage
    8.
    发明授权
    Methods for fabricating fin field effect transistors using a protective layer to reduce etching damage 失效
    使用保护层制造鳍状场效应晶体管以减少蚀刻损伤的方法

    公开(公告)号:US07074662B2

    公开(公告)日:2006-07-11

    申请号:US10869764

    申请日:2004-06-16

    IPC分类号: H01L21/8238

    摘要: A method of forming a fin field effect transistor on a semiconductor substrate includes forming a vertical fin protruding from the substrate. A buffer oxide liner is formed on a top surface and on sidewalls of the fin. A trench is then formed on the substrate, where at least a portion of the fin protrudes from a bottom surface of the trench. The trench may be formed by forming a dummy gate on at least a portion of the fin, forming an insulation layer on the fin surrounding the dummy gate, and then removing the dummy gate to expose the at least a portion of the fin, such that the trench is surrounded by the insulation layer. The buffer oxide liner is then removed from the protruding portion of the fin, and a gate is formed in the trench on the protruding portion of the fin.

    摘要翻译: 在半导体衬底上形成鳍状场效应晶体管的方法包括形成从衬底突出的垂直翅片。 缓冲氧化物衬垫形成在翅片的顶表面和侧壁上。 然后在衬底上形成沟槽,其中鳍的至少一部分从沟槽的底表面突出。 可以通过在鳍片的至少一部分上形成伪栅极来形成沟槽,在围绕虚拟栅极的鳍片上形成绝缘层,然后去除伪栅极以暴露鳍片的至少一部分,使得 沟槽被绝缘层包围。 然后从鳍片的突出部分去除缓冲氧化物衬垫,并且在鳍片的突出部分上的沟槽中形成栅极。

    Methods of forming semiconductor devices including Fin structures
    9.
    发明授权
    Methods of forming semiconductor devices including Fin structures 有权
    形成包括鳍结构的半导体器件的方法

    公开(公告)号:US07494877B2

    公开(公告)日:2009-02-24

    申请号:US11691529

    申请日:2007-03-27

    IPC分类号: H01L21/8234

    摘要: A method of forming a semiconductor device may include forming a fin structure extending from a substrate. The fin structure may include first and second source/drain regions and a channel region therebetween, and the first and second source/drain regions may extend a greater distance from the substrate than the channel region. A gate insulating layer may be formed on the channel region, and a gate electrode may be formed on the gate insulating layer so that the gate insulating layer is between the gate electrode and the channel region. Related devices are also discussed.

    摘要翻译: 形成半导体器件的方法可以包括形成从衬底延伸的翅片结构。 翅片结构可以包括第一和第二源极/漏极区域和它们之间的沟道区域,并且第一和第二源极/漏极区域可以比沟道区域延伸比衬底更大的距离。 可以在沟道区上形成栅极绝缘层,并且可以在栅极绝缘层上形成栅电极,使得栅极绝缘层位于栅电极和沟道区之间。 还讨论了相关设备。

    METHODS OF FORMING SEMICONDUCTOR DEVICES INCLUDING FIN STRUCTURES
    10.
    发明申请
    METHODS OF FORMING SEMICONDUCTOR DEVICES INCLUDING FIN STRUCTURES 有权
    形成FIN结构的半导体器件的方法

    公开(公告)号:US20070190732A1

    公开(公告)日:2007-08-16

    申请号:US11691529

    申请日:2007-03-27

    IPC分类号: H01L21/336

    摘要: A method of forming a semiconductor device may include forming a fin structure extending from a substrate. The fin structure may include first and second source/drain regions and a channel region therebetween, and the first and second source/drain regions may extend a greater distance from the substrate than the channel region. A gate insulating layer may be formed on the channel region, and a gate electrode may be formed on the gate insulating layer so that the gate insulating layer is between the gate electrode and the channel region. Related devices are also discussed.

    摘要翻译: 形成半导体器件的方法可以包括形成从衬底延伸的翅片结构。 翅片结构可以包括第一和第二源极/漏极区域和它们之间的沟道区域,并且第一和第二源极/漏极区域可以比沟道区域延伸比衬底更大的距离。 可以在沟道区上形成栅极绝缘层,并且可以在栅极绝缘层上形成栅电极,使得栅极绝缘层位于栅电极和沟道区之间。 还讨论了相关设备。