摘要:
The present invention reports a defect that has not been reported, and discloses a defect-controlled silicon ingot, a defect-controlled wafer, and a process and apparatus for manufacturing the same. The new defect is a crystal defect generated when a screw dislocation caused by a HMCZ (Horizontal Magnetic Czochralski) method applying a strong horizontal magnetic field develops into a jogged screw dislocation and propagates to form a cross slip during thermal process wherein a crystal is cooled. The present invention changes the shape and structure of an upper heat shield structure arranged between a heater and an ingot above a silicon melt, and controls initial conditions or operation conditions of a silicon single crystalline ingot growth process to reduce a screw dislocation caused by a strong horizontal magnetic field and prevent the screw dislocation from propagating into a cross slip.
摘要:
The present invention reports a defect that has not been reported, and discloses a defect-controlled silicon ingot, a defect-controlled wafer, and a process and apparatus for manufacturing the same. The new defect is a crystal defect generated when a screw dislocation caused by a HMCZ (Horizontal Magnetic Czochralski) method applying a strong horizontal magnetic field develops into a jogged screw dislocation and propagates to form a cross slip during thermal process wherein a crystal is cooled. The present invention changes the shape and structure of an upper heat shield structure arranged between a heater and an ingot above a silicon melt, and controls initial conditions or operation conditions of a silicon single crystalline ingot growth process to reduce a screw dislocation caused by a strong horizontal magnetic field and prevent the screw dislocation from propagating into a cross slip.
摘要翻译:本发明报道了未报道的缺陷,并公开了缺陷控制硅锭,缺陷控制晶片及其制造方法和装置。 新的缺陷是当由施加强水平磁场的HMCZ(Horizontal Magnetic Czochralski)方法引起的螺旋位错产生于慢跑螺钉位错时产生的晶体缺陷,并且在冷却晶体的热处理期间传播以形成交叉滑移。 本发明改变了布置在硅熔体上方的加热器和锭之间的上部隔热结构的形状和结构,并且控制了硅单晶锭生长过程的初始条件或操作条件以减少由强的 水平磁场,防止螺丝错位传播到十字滑移。
摘要:
The present invention reports a defect that has not been reported, and discloses a defect-controlled silicon ingot, a defect-controlled wafer, and a process and apparatus for manufacturing the same. The new defect is a crystal defect generated when a screw dislocation caused by a HMCZ (Horizontal Magnetic Czochralski) method applying a strong horizontal magnetic field develops into a jogged screw dislocation and propagates to form a cross slip during thermal process wherein a crystal is cooled. The present invention changes the shape and structure of an upper heat shield structure arranged between a heater and an ingot above a silicon melt, and controls initial conditions or operation conditions of a silicon single crystalline ingot growth process to reduce a screw dislocation caused by a strong horizontal magnetic field and prevent the screw dislocation from propagating into a cross slip.
摘要翻译:本发明报道了未报道的缺陷,并公开了缺陷控制硅锭,缺陷控制晶片及其制造方法和装置。 新的缺陷是当由施加强水平磁场的HMCZ(Horizontal Magnetic Czochralski)方法引起的螺旋位错产生于慢跑螺钉位错时产生的晶体缺陷,并且在冷却晶体的热处理期间传播以形成交叉滑移。 本发明改变了布置在硅熔体上方的加热器和锭之间的上部隔热结构的形状和结构,并且控制了硅单晶锭生长过程的初始条件或操作条件以减少由强的 水平磁场,防止螺丝错位传播到十字滑移。
摘要:
The present invention reports a defect that has not been reported, and discloses a defect-controlled silicon ingot, a defect-controlled wafer, and a process and apparatus for manufacturing the same. The new defect is a crystal defect generated when a screw dislocation caused by a HMCZ (Horizontal Magnetic Czochralski) method applying a strong horizontal magnetic field develops into a jogged screw dislocation and propagates to form a cross slip during thermal process wherein a crystal is cooled. The present invention changes the shape and structure of an upper heat shield structure arranged between a heater and an ingot above a silicon melt, and controls initial conditions or operation conditions of a silicon single crystalline ingot growth process to reduce a screw dislocation caused by a strong horizontal magnetic field and prevent the screw dislocation from propagating into a cross slip.
摘要翻译:本发明报道了未报道的缺陷,并公开了缺陷控制硅锭,缺陷控制晶片及其制造方法和装置。 新的缺陷是当由施加强水平磁场的HMCZ(Horizontal Magnetic Czochralski)方法引起的螺旋位错产生于慢跑螺钉位错时产生的晶体缺陷,并且在冷却晶体的热处理期间传播以形成交叉滑移。 本发明改变了布置在硅熔体上方的加热器和锭之间的上部隔热结构的形状和结构,并且控制了硅单晶锭生长过程的初始条件或操作条件以减少由强的 水平磁场,防止螺丝错位传播到十字滑移。
摘要:
The present invention reports a defect that has not been reported, and discloses a defect-controlled silicon ingot, a defect-controlled wafer, and a process and apparatus for manufacturing the same. The new defect is a crystal defect generated when a screw dislocation caused by a HMCZ (Horizontal Magnetic Czochralski) method applying a strong horizontal magnetic field develops into a jogged screw dislocation and propagates to form a cross slip during thermal process wherein a crystal is cooled. The present invention changes the shape and structure of an upper heat shield structure arranged between a heater and an ingot above a silicon melt, and controls initial conditions or operation conditions of a silicon single crystalline ingot growth process to reduce a screw dislocation caused by a strong horizontal magnetic field and prevent the screw dislocation from propagating into a cross slip.
摘要翻译:本发明报道了未报道的缺陷,并公开了缺陷控制硅锭,缺陷控制晶片及其制造方法和装置。 新的缺陷是当由施加强水平磁场的HMCZ(Horizontal Magnetic Czochralski)方法引起的螺旋位错产生于慢跑螺钉位错时产生的晶体缺陷,并且在冷却晶体的热处理期间传播以形成交叉滑移。 本发明改变了布置在硅熔体上方的加热器和锭之间的上部隔热结构的形状和结构,并且控制了硅单晶锭生长过程的初始条件或操作条件以减少由强的 水平磁场,防止螺丝错位传播到十字滑移。
摘要:
An apparatus for processing an eyeglass lens which is capable of forming a hole or various shapes on an eyeglass lens is disclosed. The apparatus includes a pair of lens fixing shafts for clamping a lens; a carriage which supports and moves the lens fixing shafts; a lens rotation motor for rotating the lens fixing shafts; and a drilling part for forming a hole on the lens, wherein the drilling part includes: a drill head having a drill to which a drill bit is fixed; a drill head mover which is connected with the drill head and moves the drill head straightly; and a fixing block which supports and fixes the drill head mover on the apparatus for processing an eyeglass lens.
摘要:
The present invention relates to an etching solution for evaluating crystal defects of silicon wafers, and more particularly to an etching solution comprising KMnO4 and HF. The etching solution for crystal defect evaluation of a silicon wafer in accordance with the present invention can accurately and quickly evaluate the crystal defects in silicon wafers having specific resistance values of 0.01 Ω·cm or smaller, which previously could only be evaluated by physical methods. Also, the etching solution of the present invention can quickly evaluate a D-defects in silicon wafers having specific resistance values exceeding 0.01 Ω·cm.
摘要:
A method of changing a serving Base Station (BS) in a mobile communication system, and a mobile communication system for implementing the method, are provided. The method includes setting a minimum UpLink (UL) quality value, receiving DownLink (DL) quality values for a current serving BS of a User Equipment (UE) and respective BSs included in an active set of the UE from the UE periodically based on a predefined first period, receiving UL quality values for the serving BS and the respective BSs included in the active set from the serving BS and the respective BSs included in the active set periodically based on a predefined second period, determining if the UL quality value for the serving BS is less than the minimum UL quality value, when, as a result of the determination, the UL quality value for the serving BS is less than the minimum UL quality value, selecting BSs, which have UL quality values equal to or greater than the minimum UL quality value among the BSs included in the active set, as candidate BSs, and determining a BS, which has a maximum DL quality value among the candidate BSs, as a new serving BS of the UE, wherein the active set represents a set of BSs that can provide DL/UL service to the UE.
摘要:
The object of this invention is to provide a temperature-sensitive state-changing hydrogel composition and a method of producing the same. The hydrogel composition includes 1-10 wt % of branched gelation polymer, 0.5 5 wt % of electrolyte gelation polymer, 0.5-5 wt % of skin-communication enhancer, 1-10 wt % of natural biomaterial, 3-30 wt % of polyhydric alcohol, 1-10 wt % of functional additive, and 30-93 wt % of water based on a total weight of the composition. Hydrogel is transformed into a fluid state at 10-50° C. The hydrogel composition is transformed into a fluid state due to body temperature when it comes into contact with the skin to be fluidized, so that cosmetics or drugs contained in hydrogel are uniformly and quickly delivered into the skin.
摘要:
The object of this invention is to provide a temperature-sensitive state-changing hydrogel composition and a method of producing the same. The hydrogel composition includes 1-10 wt % of branched gelation polymer, 0.5 5 wt % of electrolyte gelation polymer, 0.5-5 wt % of skin-communication enhancer, 1-10 wt % of natural biomaterial, 3-30 wt % of polyhydric alcohol, 1-10 wt % of functional additive, and 30-93 wt % of water based on a total weight of the composition. Hydrogel is transformed into a fluid state at 10-50° C. The hydrogel composition is transformed into a fluid state due to body temperature when it comes into contact with the skin to be fluidized, so that cosmetics or drugs contained in hydrogel are uniformly and quickly delivered into the skin.