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公开(公告)号：USD312646S
公开(公告)日：1990-12-04
申请号：US63635
申请日：1987-06-17
Applicant: Donald J. Spigarelli , William F. Drislane , H. Patrick Thornton , Bryan R. Hotaling
Designer： Donald J. Spigarelli , William F. Drislane , H. Patrick Thornton , Bryan R. Hotaling
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公开(公告)号：US4821393A
公开(公告)日：1989-04-18
申请号：US55031
申请日：1987-05-28
Applicant: Donald J. Spigarelli
Inventor： Donald J. Spigarelli
CPC classification number: H05K13/022 , B23Q3/183 , B25B5/06 , Y10T29/53183 , Y10T29/53261 , Y10T29/53991
Abstract: Apparatus especially useful for centering an electronic component on a surface for subsequent pickup and placement on a circuit board. The apparatus includes a pair of jaws which are driven in unison toward and away from each other by a lead screw or similar mechanism, each of the jaws having a part adapted to engage a respective side of a component to be positioned. The engagement part of each jaw is resiliently loaded such as by a spring or air cylinder and is in a normally outward position. The jaws are pre-aligned so that they drive in unison toward a predetermined center line. A component place between the jaws is contacted by the engagement parts of the jaws when the jaws move toward each other, and is moved into alignment on the center line. The jaws over-travel the aligned position against the spring pressure of the jaws, this spring pressure providing an intended over-travel force which prevents excessive force on the component by the engaged jaws. The over-travel also allows acceptance of a range of component sizes for the same jaw configuration.
Abstract translation: 装置特别适用于将电子元件对准在表面上，用于随后的拾取和放置在电路板上。 该装置包括通过导螺杆或类似机构一致地彼此驱动的一对夹爪，每个钳口具有适于接合要定位的部件的相应侧的部分。 每个钳口的接合部分例如通过弹簧或气缸弹性加载并处于正常向外的位置。 夹爪预先对准，以便它们一致地朝向预定的中心线驱动。 当夹爪相互移动时，夹爪之间的部件位置被夹爪的接合部分接触，并且在中心线上移动成对准。 钳口克服夹爪的弹簧压力超过对准位置，该弹簧压力提供预期的超行程力，其防止被接合的夹爪对部件产生过大的力。 超行程还允许接受相同钳口配置的一系列组件尺寸。
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公开(公告)号：US4348174A
公开(公告)日：1982-09-07
申请号：US228613
申请日：1981-01-22
Applicant: Donald J. Spigarelli
Inventor： Donald J. Spigarelli
Abstract: A method and apparatus for vapor conservation and control for use with vapor phase soldering, degreasing, or similar systems having a tank into which work is introduced and removed. The air present above the processing vapor zone is drawn from the processing tank and cooled to condense the vapor, and the remaining air is then returned to the tank above the area of withdrawal. A negative pressure is preferably created at the tank entrance such that air flow is into the tank to prevent emission of vapor and pollutants from the tank into the atmosphere.
Abstract translation: 用于气相保护和控制的方法和装置，用于气相焊接，脱脂或具有引入和去除工件的罐的类似系统。 处理蒸汽区上方的空气从处理槽中抽出并冷却以冷凝蒸汽，然后将剩余的空气返回到提取区域上方的罐中。 优选地，在罐入口处产生负压，使得空气流进入罐中，以防止蒸气和污染物从罐中排放到大气中。
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公开(公告)号：US5278938A
公开(公告)日：1994-01-11
申请号：US660657
申请日：1991-02-22
Applicant: Donald J. Spigarelli , John M. DeCarlo , Karl E. Bahr
Inventor： Donald J. Spigarelli , John M. DeCarlo , Karl E. Bahr
CPC classification number: H05K13/0465 , B23K1/0053 , H01L24/75 , H01L2924/14 , H05K3/3421 , H05K3/3494
Abstract: An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes an array of IR lamps and associated lamp envelopes and lenses, together with control apparatus for operating the IR lamps and aligning the focused IR radiation generated thereby. The radiation generated by the IR lamps is configured to provide a desired line pattern of energy which is directed onto the leads of a device being soldered. The perimeter of the energy pattern is programmably alterable to suit particular device lead sizes and configurations.
Abstract translation: 一种红外（IR）加热器阵列装置，其提供聚焦线的IR辐射用于焊接集成电路部件或装置，特别是精细间距集成电路装置（FPD），与印刷电路板对齐。 该装置被配置为与放置装置的放置头组合同心安装，其中，通过放置装置将装置固定在适当位置时，FPD和其它IC装置可以结合到电路板。 该装置的一个优选实施例包括一组IR灯和相关联的灯泡信封和透镜，以及用于操作IR灯并对准由此产生的聚焦IR辐射的控制装置。 由IR灯产生的辐射被配置为提供被引导到被焊接的设备的引线上的期望的能量线。 能量图案的周长可编程地可变，以适应特定的设备导线尺寸和配置。
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公开(公告)号：US5220147A
公开(公告)日：1993-06-15
申请号：US750097
申请日：1991-08-26
Applicant: Donald J. Spigarelli , Robert E. Cushman
Inventor： Donald J. Spigarelli , Robert E. Cushman
IPC: B23K3/03
CPC classification number: B23K3/0353
Abstract: A contact heater for soldering and desoldering electronic components that is heated by hot air supplied into a cavity of the contact heater. A thermally conductive heating blade is used to contact an area to be heated, while a heat shield protects adjacent electronic components from external heat generated by the contact heater.
Abstract translation: 用于焊接和拆焊电子部件的接触加热器，其被供应到接触加热器的空腔中的热空气加热。 导热加热刀片用于接触被加热区域，而隔热板可保护邻近的电子元件不受接触加热器产生的外部热量的影响。
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Patent Agency Ranking
公开(公告)号：US4394802A
公开(公告)日：1983-07-26
申请号：US257141
申请日：1981-04-24
Applicant: Donald J. Spigarelli
Inventor： Donald J. Spigarelli
CPC classification number: B23K1/015
Abstract: A method and apparatus for vapor conservation and control for use with vapor phase soldering, degreasing, or similar systems having an open tank containing the vapor into which work is introduced and removed. The present invention comprises apparatus associated with the tank and operative to create a counter-convection flow which opposes the outward convection flow of vapor from the open tank. The process vapor is substantially retained within the tank while maintaining an open central channel for work entry and removal. The counter-convection flow is produced by establishment of a temperature differential by cooling and/or heating means disposed to cause a convection flow in a downward direction which opposes the normal upward flow of vapor from the tank.
Abstract translation: 用于气相保护和控制的方法和装置，用于气相焊接，脱脂或类似系统，其具有包含引入和去除工件的蒸汽的开放罐。 本发明包括与罐相关联的装置，用于产生与来自敞开的罐的蒸汽的向外对流的反向对流。 过程蒸汽基本上保持在罐内，同时保持打开的中心通道用于工作进入和移除。 通过用冷却和/或加热装置建立温差来产生对流对流，以使得向下的方向上的对流流动，该向下方向与来自罐的正常向上的蒸气相反。
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公开(公告)号：US4389797A
公开(公告)日：1983-06-28
申请号：US276493
申请日：1981-06-23
Applicant: Donald J. Spigarelli , Paul C. Dustin
Inventor： Donald J. Spigarelli , Paul C. Dustin
CPC classification number: C23G5/04 , B01D3/00 , B01D5/0006 , B01D5/006 , B01D5/009 , B23K1/015 , B23K2201/42
Abstract: A continuous vapor processing system for vapor phase soldering, degreasing, or similar processes wherein a product is moved into and out of a vessel in a continuous manner via open conduits or channels while preventing escape of vapor from the processing tank and the conduits.
Abstract translation: 用于气相焊接，脱脂或类似工艺的连续蒸气处理系统，其中产品通过开放的管道或通道以连续的方式移入和流出容器，同时防止蒸气从处理槽和管道逸出。
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8.发明授权Placement system using a split imaging system coaxially coupled to a component pickup means 失效使用与部件拾取装置同轴耦合的分割成像系统的放置系统
公开(公告)号：US5627913A
公开(公告)日：1997-05-06
申请号：US592599
申请日：1996-01-26
Applicant: Donald J. Spigarelli , John M. DeCarlo , Ernest LaFleur , Bryan R. Pinette
Inventor： Donald J. Spigarelli , John M. DeCarlo , Ernest LaFleur , Bryan R. Pinette
CPC classification number: H05K13/08
Abstract: A placement apparatus for placing and mounting circuit components or devices in aligned combination with circuit boards. The apparatus includes an imaging system, a first stage moveable in first and second opposite directions between first and second predetermined positions, for positioning the circuit board onto which the component is to be placed within a field of view of the imaging system. A second stage, for holding the circuit component, is movably coupled to the first stage. The apparatus further includes a component pick-up system disposed about the first stage for picking up the circuit component from the second stage and placing the circuit component in a predetermined position on the first stage. The imaging system is coupled to a graphical user interface system for providing a position indicator on a monitor screen, wherein the position indicator identifies the location of a particular feature of the circuit board or the circuit component.
Abstract translation: 一种放置和安装与电路板对准的电路部件或装置的放置装置。 该装置包括成像系统，可在第一和第二预定位置之间的第一和第二相反方向上移动的第一阶段，用于将成像系统的视野内的组件放置在其上的电路板。 用于保持电路部件的第二级可移动地耦合到第一级。 该装置还包括一个组件拾取系统，该组件拾取系统设置在第一级周围，用于从第二级拾取电路部件，并将电路部件放置在第一级上的预定位置。 成像系统耦合到用于在监视器屏幕上提供位置指示器的图形用户界面系统，其中位置指示器识别电路板或电路部件的特定特征的位置。
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公开(公告)号：US5060288A
公开(公告)日：1991-10-22
申请号：US573500
申请日：1990-08-27
Applicant: Donald J. Spigarelli , John M. DeCarlo , Karl E. Bahr
Inventor： Donald J. Spigarelli , John M. DeCarlo , Karl E. Bahr
CPC classification number: H05K13/0465 , B23K1/0053 , H01L24/75 , H01L2924/14 , H05K3/3421 , H05K3/3494
Abstract: An infrared (IR) heater array apparatus that provides focused lines of IR radiation for soldering integrated circuit components or devices, especially fine pitch integrated circuit devices (FPD), in aligned combination with printed circuit boards. The apparatus is configured for concentric mounting in combination with the placement head of placement apparatus wherein FPDs and other IC devices may be bonded to the circuit board while the device is held in place by the placement apparatus. One preferred embodiment of the apparatus includes a rectangular frame member having four radiation slits, a rectangular array of four IR lamps and associated lamp envelopes mounted in combination outside the frame member, X and Y pairs of reflecting members rotatably mounted within the frame member, and control subsystems for operating the IR lamps and aligning the focused IR radiation generated thereby. The radiation generated by the IR lamps is convergingly reflected by the associated lamp envelopes to pass through the radiation slits toward the rotational axis of the X and Y pairs of reflecting members. The X and Y pairs of reflecting members are rotationally oriented to reflect IR radiation onto the bonding sites to effect bonding of the FPD to the circuit board.
Abstract translation: 一种红外（IR）加热器阵列装置，其提供聚焦线的IR辐射用于焊接集成电路部件或装置，特别是精细间距集成电路装置（FPD），与印刷电路板对齐。 该装置被配置为与放置装置的放置头组合同心安装，其中，通过放置装置将装置固定在适当位置时，FPD和其它IC装置可以结合到电路板。 该装置的一个优选实施例包括具有四个辐射狭缝的矩形框架构件，四个IR灯的矩形阵列和组合在框架构件外部安装的相关灯泡信封，可旋转地安装在框架构件内的X和Y对反射构件，以及 控制子系统用于操作IR灯并对准由此产生的聚焦IR辐射。 由IR灯产生的辐射由相关联的灯包络会聚地反射，以朝向X和Y对反射构件的旋转轴线穿过辐射狭缝。 X和Y对的反射构件被旋转地定向以将IR辐射反射到结合位置上，以实现FPD与电路板的接合。
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公开(公告)号：US4541358A
公开(公告)日：1985-09-17
申请号：US555715
申请日：1983-11-28
Applicant: Donald J. Spigarelli , Douglas J. Peck , Walter J. Hall , James L. Finney
Inventor： Donald J. Spigarelli , Douglas J. Peck , Walter J. Hall , James L. Finney
CPC classification number: H05K3/3468 , B23K1/015 , B23K1/018 , B23K1/085 , B23K2201/42 , H05K2203/044 , H05K2203/0746 , H05K2203/0776 , H05K2203/088 , H05K2203/1509
Abstract: A solder leveling system for use in vapor phase soldering of printed wiring boards. A transport system operating in a near-horizontal mode moves the board to be solder coated through a vapor zone in a chamber having a solder pot which has a throat in line with the plane of the transport system. The near-horizontal movement through the vapor and into and out of the solder pot prevents solder sag and permits control of the thickness of solder deposited on the opposing board surfaces. Leveling nozzles are positioned in a vapor-filled chamber astride the transport system between the solder pot and the chamber throat. Perpendicular nozzle offset distance from the board and nozzle angle are adjustable. Preferably one nozzle projects a stream normal to the board, with the other nozzle projecting a grazing stream for clearing through holes. A nozzle flow rate corresponding to a predetermined energy threshold provides reliable hole clearing. Preferably the chamber throat is cooled for vapor containment, forming one of three cooling zones for vapor containment, vapor leveling, and condensation. In the preferred solder pot, as the board enters the sloping throat, solders spills over a weir into a reservoir from whence it is pumped into a standpipe which charges the sloping throat. Preferably solder is added to the pot through a drop tube having a lower end immersed in the solder to provide a unique vapor seal and means for determining the level of solder. A preferred transport system utilizes a spring loaded carrier providing easy loading and unloading of the boards.
Abstract translation: 用于印刷线路板气相焊接的焊料平整系统。 以近水平模式操作的运输系统通过在具有与输送系统的平面一致的喉部的焊料罐的室中的蒸气区域将待焊接的板移动。 通过蒸汽进入和离开焊料罐的近水平运动防止焊料凹陷并且允许控制沉积在相对的板表面上的焊料的厚度。 调平喷嘴位于蒸汽填充室中，跨越焊料罐和腔室喉部之间的输送系统。 垂直喷嘴偏离板的距离和喷嘴角度可调。 优选地，一个喷嘴将垂直于板的流投射，另一个喷嘴突出放牧流以清除通孔。 对应于预定能量阈值的喷嘴流量提供可靠的孔清除。 优选地，腔室喉部被冷却以用于蒸气容纳，形成三个冷却区域中的一个，用于蒸汽容纳，蒸气平整和冷凝。 在优选的焊锡罐中，当板进入倾斜的喉部时，焊料从堰上溢出，进入储存器，从那里将其泵送到向倾斜喉咙充电的立管中。 优选地，通过具有浸入焊料中的下端的液滴管将焊料添加到锅中以提供独特的蒸气密封和用于确定焊料水平的装置。 优选的运输系统利用弹簧加载的载体，提供板的容易装载和卸载。
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