公开(公告)号：US08925793B2

公开(公告)日：2015-01-06

申请号：US13663698

申请日：2012-10-30

Applicant: DunAn Microstaq, Inc

Inventor： Parthiban Arunasalam ,  Siddharth Bhopte ,  Joe Albert Ojeda, Sr.

IPC: B23K1/20 ,  B23K35/14

CPC classification number: H01L24/29 ,  B23K1/0016 ,  B23K1/203 ,  B23K35/3612 ,  B23K2101/42 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/27332 ,  H01L2224/29011 ,  H01L2224/29015 ,  H01L2224/29076 ,  H01L2224/29082 ,  H01L2224/29116 ,  H01L2224/29294 ,  H01L2224/29309 ,  H01L2224/29311 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2924/1461 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2203/0415 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2924/01082 ,  H01L2924/00

Abstract: A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly.

Abstract translation: 将电气部件接合到基板的方法包括将焊膏施加到基板上。 焊料预制件具有穿过其中的孔，然后被迫与焊膏接触，使得焊膏通过孔被推动。 电气部件然后被推动与焊料预制件接触并与已经被推动通过孔的焊膏接触，从而将电气部件，焊料预成型件和衬底结合在一起以限定回流组件。

公开(公告)号：US09012255B1

公开(公告)日：2015-04-21

申请号：US14060716

申请日：2013-10-23

Applicant: DunAn Microstaq, Inc.

Inventor： Parthiban Arunasalam ,  Joe Albert Ojeda, Sr.

IPC: H01L21/00 ,  B81C1/00 ,  H01L29/00 ,  B01L3/00

CPC classification number: B81C1/00309 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/027 ,  B81B2201/058 ,  B81C2203/0163

Abstract: A method of manufacturing a MEMS package includes initially providing a substrate formed of a first material and defining a bore therein. The bore is substantially completely lined with a second material that is different from the first material. A micromachined component having a fluid passageway formed therein is affixed to the substrate such that the bore and the fluid passageway are in fluid communication.

Abstract translation: MEMS封装的制造方法包括：首先提供由第一材料形成并在其中限定孔的衬底。 孔基本上完全衬有与第一材料不同的第二材料。 具有形成在其中的流体通道的微加工部件固定到基底上，使得孔和流体通道流体连通。