MEMS package
    2.
    发明授权
    MEMS package 有权
    MEMS封装

    公开(公告)号:US09012255B1

    公开(公告)日:2015-04-21

    申请号:US14060716

    申请日:2013-10-23

    Abstract: A method of manufacturing a MEMS package includes initially providing a substrate formed of a first material and defining a bore therein. The bore is substantially completely lined with a second material that is different from the first material. A micromachined component having a fluid passageway formed therein is affixed to the substrate such that the bore and the fluid passageway are in fluid communication.

    Abstract translation: MEMS封装的制造方法包括:首先提供由第一材料形成并在其中限定孔的衬底。 孔基本上完全衬有与第一材料不同的第二材料。 具有形成在其中的流体通道的微加工部件固定到基底上,使得孔和流体通道流体连通。

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