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1.发明授权公开(公告)号：US09511991B2
公开(公告)日：2016-12-06
申请号：US14331285
申请日：2014-07-15
CPC分类号： B81B7/0058 , B81B7/0038 , B81B7/0077 , B81B2201/0228 , B81B2207/096 , B81C1/00285 , B81C1/00301 , B81C1/00682 , B81C2201/053 , B81C2203/0136 , B81C2203/0163 , H01L2224/16145 , H01L2224/16225
摘要： A microdevice encapsulation structure arranged in at least one cavity formed between a substrate and a cap rigidly attached to the substrate is provided, the cap including one layer of a first material, one face of which forms an inner wall of the cavity, and mechanical reinforcement portions rigidly attached at least to and partly covering said face, having gas absorption and/or adsorption properties, in which the Young's modulus of a second material of the mechanical reinforcement portions is higher than that of the first material, wherein each of said portions includes at least one first layer of the second material, and at least one second layer of a third metallic getter material such that the first layer of the second material is arranged between the layer of the first material and the second layer of the third material and/or is covered by the second layer of the third material.
摘要翻译： 提供了一种微型装置封装结构，其设置在形成在基板和刚性地附接到基板的盖之间的至少一个空腔中，所述盖包括一层第一材料，其一个面形成所述空腔的内壁，并且机械加强 至少部分地覆盖所述表面的部分，具有气体吸收和/或吸附性能，其中机械加强部分的第二材料的杨氏模量高于第一材料的杨氏模量，其中每个部分包括 第二材料的至少一个第一层和第三金属吸气剂材料的至少一个第二层，使得第二材料的第一层布置在第一材料的层和第三材料的第二层之间和/ 或被第三材料的第二层覆盖。
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公开(公告)号：US20160176706A1
公开(公告)日：2016-06-23
申请号：US14943300
申请日：2015-11-17
发明人： Pezhman Monadgemi , Lei Wang
IPC分类号： B81C1/00
CPC分类号： B81C1/00277 , B81B7/0006 , B81B7/0038 , B81B7/007 , B81B2201/0235 , B81B2207/07 , B81B2207/095 , B81C1/00285 , B81C2203/0109 , B81C2203/0118 , B81C2203/0136 , B81C2203/0163
摘要： Systems and methods for forming MEMS assemblies incorporating getters are described. One such method for forming and bonding to a microelectromechanical systems (MEMS) assembly includes providing a first MEMS wafer including a metal layer on an inner surface and one or more cavities for forming a MEMS component, attaching a MEMS capping wafer, having at least one through hole via, to the inner surface of the first MEMS wafer thereby forming at least one encapsulated MEMs component within the first MEMS wafer, and bonding a wire to the metal layer through an open end of the at least one through hole via.
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公开(公告)号：US09126824B2
公开(公告)日：2015-09-08
申请号：US13962885
申请日：2013-08-08
发明人： Tomohiro Saito
CPC分类号： B81B7/0058 , B81B7/0035 , B81B7/0054 , B81C1/00277 , B81C2203/0136 , B81C2203/0145 , B81C2203/0163
摘要： According to one embodiment, an electrical component comprises a substrate, a functional element formed on the substrate, a first layer configured to form a cavity which stores the functional element on the substrate, the first layer having through holes, the first layer having a first recessed portion and a first projecting portion on an upper surface thereof, and the first layer having different film thicknesses in a direction perpendicular to a surface of the substrate, and a second layer formed on the first layer and configured to close the through holes.
摘要翻译： 根据一个实施例，电气部件包括衬底，形成在衬底上的功能元件，第一层，被配置为形成将功能元件存储在衬底上的空腔，第一层具有通孔，第一层具有第一层 凹部和在其上表面上的第一突出部分，并且所述第一层在垂直于所述基板的表面的方向上具有不同的膜厚度;以及第二层，形成在所述第一层上并且被构造成闭合所述通孔。
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4.发明授权公开(公告)号：US08338282B2
公开(公告)日：2012-12-25
申请号：US13019581
申请日：2011-02-02
IPC分类号： H01L21/3213 , H01L21/311
CPC分类号： B81B7/0058 , B81C2203/0136 , B81C2203/0145 , B81C2203/0163
摘要： A method for encapsulating a micro component positioned on and/or in a substrate, including: depositing at least one sacrificial material covering the micro component, making a cap covering the sacrificial material, removing the sacrificial material via at least one opening formed through the cap and forming a cavity in which the micro component is positioned, depositing, at least on the cap, at least one layer of plugging material that plugs the at least one opening, and performing a localized deposition of at least one portion of mechanically reinforcing material of the cap, covering at least the cap, wherein the mechanically reinforcing material is not subsequently etched.
摘要翻译： 一种用于封装位于衬底上和/或衬底中的微组件的方法，包括：沉积覆盖微组件的至少一种牺牲材料，制造覆盖牺牲材料的帽，通过形成于帽上的至少一个开口去除牺牲材料 以及形成其中定位所述微组件的空腔，至少在所述盖上沉积至少一层堵塞所述至少一个开口的堵塞材料，以及执行至少一部分机械增强材料的局部沉积 所述盖至少覆盖所述盖，其中所述机械增强材料未被蚀刻。
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公开(公告)号：US08309388B2
公开(公告)日：2012-11-13
申请号：US12337320
申请日：2008-12-17
IPC分类号： H01L23/10
CPC分类号： H01L23/10 , B81B7/0077 , B81C1/00333 , B81C2203/0127 , B81C2203/0163 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A hermetic MEMS device (100) comprising a carrier (110) having a surface (111) including a device (101) and an attachment stripe (122), the stripe spaced from the device and surrounding the device; a metallic foil (102) having a central bulge portion (103) and a peripheral rim portion (104) meeting the stripe, the bulge cross section parallel to the carrier monotonically decreasing from the rim (104) towards the bulge apex (105); and the foil positioned over the carrier surface so that the bulge arches over the device and the rim forms a seal with the stripe.
摘要翻译： 一种密封MEMS装置（100），包括具有包括装置（101）和附接条（122）的表面（111）的载体（110），所述条与所述装置间隔开并围绕所述装置; 具有中心凸起部分（103）的金属箔（102）和与所述条纹相遇的周边边缘部分（104），所述凸起横截面平行于所述载体从所述边缘（104）向凸起顶点（105）单调递减; 并且所述箔定位在所述载体表面上方，使得所述装置和所述边缘上的凸起拱形物与所述条纹形成密封。
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公开(公告)号：US20100172013A1
公开(公告)日：2010-07-08
申请号：US12727171
申请日：2010-03-18
申请人： Lauren Palmateer
发明人： Lauren Palmateer
IPC分类号： G02B26/00
CPC分类号： B81B3/007 , B81B7/0038 , B81B2201/047 , B81C2203/0163 , G02B26/001
摘要： A package structure and method of packaging an interferometric modulator with a reinforcing substance to help support the integrity of the package. In some embodiments the reinforcing substance is a desiccant integrated into the backplate or the transparent substrate.
摘要翻译： 一种封装结构和方法，用于将具有加强物质的干涉式调制器封装以帮助支持封装的完整性。 在一些实施方案中，增强物质是整合到背板或透明基底中的干燥剂。
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公开(公告)号：US20170183220A1
公开(公告)日：2017-06-29
申请号：US15379017
申请日：2016-12-14
申请人： Robert Bosch GmbH
CPC分类号： B81B7/0038 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81C1/00285 , B81C2203/0163
摘要： A getter device for a micromechanical component, having a metallic getter structure that is situated in a cavity of the micromechanical component. The getter structure is heatable using a defined electric current. It is possible to evaporate the material of the getter structure in a defined manner.
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公开(公告)号：US20150284242A1
公开(公告)日：2015-10-08
申请号：US14744327
申请日：2015-06-19
发明人： Tomohiro SAITO
IPC分类号： B81B7/00
CPC分类号： B81B7/0058 , B81B7/0035 , B81B7/0054 , B81C1/00277 , B81C2203/0136 , B81C2203/0145 , B81C2203/0163
摘要： According to one embodiment, an electrical component comprises a substrate, a functional element formed on the substrate, a first layer configured to form a cavity which stores the functional element on the substrate, the first layer having through holes, the first layer having a first recessed portion and a first projecting portion on an upper surface thereof, and the first layer having different film thicknesses in a direction perpendicular to a surface of the substrate, and a second layer formed on the first layer and configured to close the through holes.
摘要翻译： 根据一个实施例，电气部件包括衬底，形成在衬底上的功能元件，第一层，被配置为形成将功能元件存储在衬底上的空腔，第一层具有通孔，第一层具有第一层 凹部和在其上表面上的第一突出部分，并且所述第一层在垂直于所述基板的表面的方向上具有不同的膜厚度;以及第二层，形成在所述第一层上并且被构造成闭合所述通孔。
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公开(公告)号：US09089055B2
公开(公告)日：2015-07-21
申请号：US14018686
申请日：2013-09-05
发明人： Yoji Kitano , Norio Okuyama
IPC分类号： H01L23/053 , H05K5/02 , B81B7/00
CPC分类号： H05K5/0217 , B81B7/0041 , B81B2201/0285 , B81B2203/0118 , B81C2203/0136 , B81C2203/0145 , B81C2203/0163 , H01L23/053 , H01L2924/0002 , Y10T29/49002 , H01L2924/00
摘要： An electronic device includes a substrate, a cavity part formed above the substrate with a functional device placed therein, a coating structure that defines the cavity part, and the coating structure has a first surrounding wall formed around the cavity part above the substrate, a second surrounding wall formed around the cavity part above the first surrounding wall, a coating layer that defines an upper surface of the cavity part, wherein the second surrounding wall is located inside the first surrounding wall in a plan view.
摘要翻译： 一种电子设备，包括：衬底，形成在衬底上方的功能器件的空腔部分，其中限定空腔部分的涂层结构，并且涂层结构具有围绕衬底上方的空腔部分形成的第一环绕壁， 形成在第一周围壁上方的空腔部分周围的围绕壁，其形成限定空腔部分的上表面的涂层，其中第二周围壁在俯视图中位于第一周围壁的内部。
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公开(公告)号：US20140264955A1
公开(公告)日：2014-09-18
申请号：US14203012
申请日：2014-03-10
申请人： Robert Bosch GmbH
发明人： Ando Lars Feyh , Gary O'Brien , Andrew Graham
CPC分类号： H01L23/3142 , B81B7/0077 , B81C2203/0154 , B81C2203/0163 , H01L21/56 , H01L21/565 , H01L23/3121 , H01L2224/48091 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： An electronic device includes a mold package which encapsulates a portion of the electronic device and does not encapsulate another portion of the electronic device to enable a sensing portion of the electronic device to be exposed to a condition to be sensed. In an electronic sensing device having a sensor formed by a substrate such as silicon, a sensor area is not encapsulated, but areas surrounding the sensor area are encapsulated. The area surrounding the sensor area includes one or more trenches or interlock structures formed in the surrounding substrate which receives the mold material to provide an interlock feature. The interlock feature reduces or substantially prevents the mold from delaminating at an interface of the mold and the substrate.
摘要翻译： 电子设备包括：模具包装，其封装电子设备的一部分，并且不封装电子设备的另一部分，以使电子设备的感测部分能够暴露于待感测的状态。 在具有由诸如硅的基板形成的传感器的电子感测装置中，传感器区域不被封装，而是封装传感器区域周围的区域。 围绕传感器区域的区域包括形成在周围基底中的一个或多个沟槽或互锁结构，其接收模具材料以提供互锁特征。 互锁特征减少或基本上防止模具在模具和基底的界面处分层。
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