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公开(公告)号：US20240129035A1
公开(公告)日：2024-04-18
申请号：US18379008
申请日：2023-10-11
Inventor： Soo Yong JUNG , Jong Jin LEE
IPC: H04B10/40
CPC classification number: H04B10/40 , G02B6/3807
Abstract: Provided is a detachable light source supply apparatus in which a light source element, which has a high probability of failure among components of an optical transceiver, is separately disposed on the outside, to supply a light source to the optical transceiver. This detachable light source supply apparatus includes a detachable coupling part to the optical transceiver, and an optical input/output unit. The detachable coupling part and the optical input/output unit may be implemented with MPO type connectors. Depending on various wavelength standards, an external light source element may be a multi-channel light source element that emits light sources having different wavelengths. For the multi-channel light source element, a plurality of light emitter of a single wavelength may be used, and in other embodiments, a multi-channel light emitter that emits light sources having a plurality of different wavelengths may be used.
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公开(公告)号：US20230069724A1
公开(公告)日：2023-03-02
申请号：US17862930
申请日：2022-07-12
Inventor： Won Bae KWON , Jong Jin LEE , Eun Kyu KANG , Soo Yong JUNG , Hae Chung KANG , Sang Jin KWON , Dae Seon KIM
Abstract: An optical receiver sub-assembly is provided, which includes a substrate, an optical waveguide device mounted on the substrate to transfer ray incident from a ray source, and a photodetector mounted on the substrate and disposed under a vertical cross-sectional surface of the optical waveguide device, wherein the ray is sequentially reflected and refracted by an upper slope surface and a lower slope surface provided in the vertical cross-sectional surface and is vertically incident on an active area of the photodetector.
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公开(公告)号：US20230067645A1
公开(公告)日：2023-03-02
申请号：US17851148
申请日：2022-06-28
Inventor： Hae Chung KANG , Eun Kyu KANG , Jong Jin LEE , Sang Jin KWON , Won Bae KWON , Dae Seon KIM , Dae Woong MOON , Soo Yong JUNG , Gye Sul CHO
Abstract: A highly integrated multi-channel optical module is provided. The optical module includes an optical source device mounted on a substrate by an optical source mount unit, a waveguide mounted on the substrate by a waveguide mount unit, a lens mount unit disposed between the optical source device and the waveguide and mounted on the substrate, and a lens unit fixed to the lens mount unit by an adhesive cured by ultraviolet (UV) parallel light, wherein a light path of the UV parallel light is formed in the lens mount unit by a reflector attached on a side surface of the lens mount unit, and the UV parallel light moves along the light path and cures the adhesive coated on an upper portion of the lens mount unit facing a lower end portion of the lens unit.
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公开(公告)号：US20220094138A1
公开(公告)日：2022-03-24
申请号：US17479496
申请日：2021-09-20
Inventor： Eun Kyu KANG , Jong Jin LEE , Dae Seon KIM , Eun Kyoung JEON , Sang Jin KWON , Won Bae KWON , Kwon Seob LIM , Soo Yong JUNG
IPC: H01S5/024 , G02B27/28 , H01S5/02257 , H01S5/02253 , H01S5/02255 , H04J14/02 , H04B10/40
Abstract: A structure and a manufacturing method of an optical transmission module, in which output light of each of a first optical transmission unit and a second optical transmission unit is combined into one and transmitted through an optical fiber. In order to manufacture the optical transmission module, the first optical transmission unit and the second optical transmission unit are separately manufactured using a wafer-level packaging process and then are stacked. As a result, emission of generated heat is divided into a first heat sink installed in the first optical transmission unit and a second heat sink installed in the second optical transmission unit so that better heat dissipation efficiency is achieved than a conventional optical transmission module. In addition, a mounting area may also be reduced to ½ of the conventional module.
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公开(公告)号：US20210125975A1
公开(公告)日：2021-04-29
申请号：US17081536
申请日：2020-10-27
Inventor： Eun Kyu KANG , Jong Jin LEE , Sang Jin KWON , Won Bae KWON , Dae Seon KIM , Soo Yong JUNG
Abstract: Provided is a cooled optical transmission module device including a silicon wafer having a plurality of platform mounting grooves, each of which serves as a space for mounting in which an optical transmission platform therein, a thermoelectric cooler bonded to the platform mounting groove to transfer heat to outside, the optical transmission platform provided on the thermoelectric cooler and configured to output an optical signal by generating and reflecting the optical signal, a dielectric sub-mount bonded to the platform mounting groove of the silicon wafer and electrically connected to the mounted optical transmission platform, and a cover configured to cover the platform mounting groove of the silicon wafer and seal the platform mounting groove while providing an electric path.
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Patent Agency Ranking
公开(公告)号：US20170126317A1
公开(公告)日：2017-05-04
申请号：US15209399
申请日：2016-07-13
Inventor： Soo Yong JUNG , Jong Jin LEE , Hyun Seo KANG , Sei Hyoung LEE , Hee Seung KIM
CPC classification number: H04B10/2503 , H04B10/40 , H04B10/43 , H04B10/503
Abstract: Provided herein is a single module bi-directional optical transmitting and receiving system including a transmitter transmitting an optical signal by converting a down-signal, and obtaining an up-signal by converting y the optical signal that is received, and a receiver transmitting the optical signal by converting the up-signal, and obtaining the down-signal by converting the optical signal that is received, wherein the transmitter and the receiver include a single optical transmitting module including a monitor receiving module, transmit the optical signal through the single optical transmitting module, and receive the optical signal through the monitor receiving module.
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公开(公告)号：US20250158349A1
公开(公告)日：2025-05-15
申请号：US18827421
申请日：2024-09-06
Inventor： Eun Kyu KANG , Haechung KANG , Jong Jin LEE , Won-Bae KWON , Soo Yong JUNG , Sangjin KWON , Myunghwan KIM
IPC: H01S5/02253 , H01S5/02251 , H01S5/02315 , H01S5/40
Abstract: Provided is a lens curing device for a multi-channel optical module, which cures a lens after arranging the lens on multiple axes between a laser diode and an optical waveguide of the optical module for each channel, the lens curing device including a vacuum collet that picks up the lens, a driver that moves the vacuum collet that picks up the lens and disposes the moved vacuum collet at an arrangement position of a submount, and an optical fiber that is embedded in at least a portion of the vacuum collet while connected to an ultraviolet (UV) light source in a preset wavelength band and transmits light radiated from the UV light source to a UV epoxy applied to a lower end of the lens.
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公开(公告)号：US20250093599A1
公开(公告)日：2025-03-20
申请号：US18883663
申请日：2024-09-12
Inventor： Won-Bae KWON , Eun Kyu KANG , Jong Jin LEE , Soo Yong JUNG , Haechung KANG , Sangjin KWON , Myunghwan KIM
IPC: G02B6/42
Abstract: An optical module assembly is provided. The optical module assembly includes an electric sub-assembly including a printed circuit board (PCB) and an electronic device mounted on the PCB and an optical module including an interposer including a transparent material, an optical sub-assembly accommodating optical components, and a cover covering an upper portion of the optical sub-assembly, wherein one end portion of the PCB is inserted into the optical sub-assembly through an inserting hole formed in a sidewall of the optical sub-assembly, and the optical components and a substrate electrode formed on a surface of the one end portion of the PCB are electrically connected to each other by the interposer.
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公开(公告)号：US20230061382A1
公开(公告)日：2023-03-02
申请号：US17879008
申请日：2022-08-02
Inventor： Eun Kyu KANG , Jong Jin LEE , Dae Seon KIM , Sang Jin KWON , Won Bae KWON , Soo Yong JUNG , Hae Chung KANG , Dae Woong MOON , Gye Sul CHO
IPC: G02B6/42
Abstract: A multi-channel optical sub-assembly includes a printed circuit board with a signal processor mounted thereon, a package window mounted on the printed circuit board, the package window including a transparent material, a package mounted on the package window, and an optical device accommodated into an inner space of the package and configured to convert an electrical signal, input from the signal processor, into an optical signal, wherein the electrical signal sequentially passes through a window through electrode buried in the package window and a package through electrode buried in the package and is input to the optical device.
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公开(公告)号：US20200158958A1
公开(公告)日：2020-05-21
申请号：US16687353
申请日：2019-11-18
Inventor： Dae Seon KIM , Jong Jin LEE , Eun Kyu KANG , Sang Jin KWON , Jeong Eun KIM , Kwon Seob LIM , Eun Kyoung JEON , Soo Yong JUNG
Abstract: An ultra-small multi-channel optical module according to one embodiment of the present invention includes a base board, a glass substrate, a heat sink, optical elements, parallel light lenses, a first rectangular reflector, a glass cover, a second rectangular reflector, horizontal reflectors, and a light collecting lens.
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