Electronic component and method for the production thereof

    公开(公告)号:US10204722B2

    公开(公告)日:2019-02-12

    申请号:US15312503

    申请日:2015-05-18

    Applicant: EPCOS AG

    Abstract: An electronic component and a method for producing an electrical component are disclosed. In an embodiment, the electronic component includes a functional body having a first surface and a second surface, wherein the second surface faces away from the first surface, and a contact electrically linked to the first surface, the contact having an edge region and a central region, wherein the functional body has a first electrical resistance between the first surface and the second surface in a first functional body portion, which overlaps the edge region of the contact as viewed in a plan view of the electronic component, that is greater than a second electrical resistance between the first surface and the second surface in a second functional body portion, which overlaps the central region of the contact as viewed in a plan view of the electronic component.

    Electronic Component and Method for the Production Thereof

    公开(公告)号:US20170092394A1

    公开(公告)日:2017-03-30

    申请号:US15312503

    申请日:2015-05-18

    Applicant: EPCOS AG

    Abstract: An electronic component and a method for producing an electrical component are disclosed. In an embodiment, the electronic component includes a functional body having a first surface and a second surface, wherein the second surface faces away from the first surface, and a contact electrically linked to the first surface, the contact having an edge region and a central region, wherein the functional body has a first electrical resistance between the first surface and the second surface in a first functional body portion, which overlaps the edge region of the contact as viewed in a plan view of the electronic component, that is greater than a second electrical resistance between the first surface and the second surface in a second functional body portion, which overlaps the central region of the contact as viewed in a plan view of the electronic component.

Patent Agency Ranking