Abstract:
Provided is a method for fabrication of an anisotropic conductive member, the method including a residual stress relaxation step of obtaining an anisotropic conductive member that has been subjected to a treatment for relaxing residual stress, after fabricating an anisotropic conductive member having plural conductive paths, in which plural micropores of an insulating matrix formed from an anodic oxide film are filled with a conductive member.
Abstract:
An object of the present invention is to provide a lithographic printing plate precursor from which a lithographic printing plate with excellent oil-based cleaner printing durability is obtained, a method of producing a lithographic printing plate, a printing method, and a method of producing an aluminum support. The lithographic printing plate precursor of the present invention is a lithographic printing plate precursor including an aluminum support, and an image recording layer disposed on the aluminum support, in which the aluminum support includes an aluminum plate and an anodized aluminum film disposed on the aluminum plate, the image recording layer is disposed on the aluminum support on a side of the anodized film, and an area ratio of projections with a height of 0.80 μm or greater from an average level, which is obtained by measuring a surface of the aluminum support on a side of the image recording layer in an area of 400 μm×400 μm using a non-contact three-dimensional roughness meter, is 20% or less.
Abstract:
An object is to provide an aluminum plate which has favorable adhesiveness and coating properties to active materials and has a high strength and a method for manufacturing an aluminum plate. An average opening diameter of the plurality of through holes is 0.1 μm or more and 100 μm or less, an average opening ratio of the plurality of through holes is 2% or more and 40% or less, among the plurality of through holes, a percentage of through holes having an opening diameter of 5 μm or less is 40% or less, among the plurality of through holes, a percentage of through holes having an opening diameter of 40 μm or more is 40% or less, and, among the plurality of through holes, a percentage of through holes in which a ratio S1/S0 of an area S1 of the through holes to an area S0 of a circle having a long axis of the through hole as a diameter is 0.1 or more and 1 or less is 50% or more.