公开(公告)号：US20180022960A1

公开(公告)日：2018-01-25

申请号：US15551492

申请日：2016-02-12

Applicant: FUJIMI INCORPORATED

Inventor： Masayuki SERIKAWA ,  Kyousuke TENKOU ,  Tomomi AKIYAMA ,  Maiko ASAI

IPC: C09G1/02 ,  C09K3/14 ,  B24B37/04

CPC classification number: C09G1/02 ,  B24B37/044 ,  C09K3/1409 ,  C09K3/1463

Abstract: There is provided a polishing composition for use in polishing of a surface of a polishing object including at least one of an oxide of a metal or a semimetal or a composite material of oxides of one or more metals and/or semimetals, and the polishing composition includes at least water and silica. The silica includes small-particle diameter silica having a particle diameter of 20 nm or more to 70 nm or less and large-particle diameter silica having a particle diameter of 100 nm or more to 200 nm or less, 2 mass % or more of the small-particle diameter silica is included in the polishing composition, 2 mass % or more of the large-particle diameter silica is included in the polishing composition, and a value obtained by dividing an average particle diameter of the large-particle diameter silica by an average particle diameter of the small-particle diameter silica is 2 or more.