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    POLISHING PAD AND POLISHING METHOD
    1.
    发明申请
    POLISHING PAD AND POLISHING METHOD 审中-公开

    公开(公告)号：US20190084121A1

    公开(公告)日：2019-03-21

    申请号：US16088441

    申请日：2017-01-27

    Applicant: FUJIMI INCORPORATED

    Inventor： Maiko ASAI ,  Yuuichi ITO ,  Kazusei TAMAI ,  Muneaki TAHARA

    IPC: B24B37/24 ,  B24B3/32 ,  B24B3/28

    Abstract: There is provided a polishing pad that ensures sufficiently performing polishing up to a part near a projection portion and an inner surface of a recessed portion in a surface of an object to be polished in polishing the object to be polished having a surface with at least one of the projection portion and the recessed portion. The polishing pad includes a napped part (1) where a plurality of fibers (12) with a length of 3 mm or more are napped on a surface of a base portion (11). A count of the fibers (12) is 10000 pieces/cm2 or more.

    POLISHING COMPOSITION
    2.
    发明申请
    POLISHING COMPOSITION 审中-公开
    抛光组合物

    公开(公告)号：US20150291851A1

    公开(公告)日：2015-10-15

    申请号：US14686285

    申请日：2015-04-14

    Applicant: FUJIMI INCORPORATED

    Inventor： Hiroshi ASANO ,  Maiko ASAI ,  Hitoshi MORINAGA ,  Kazusei TAMAI

    IPC: C09G1/02 ,  B24B1/00

    CPC classification number: C09G1/02 ,  B24B1/00

    Abstract: A polishing composition which is able to decrease a difference in polishing rate between the alloy material and the resin, and to polish both the alloy material and the resin at a high polishing rate when polishing a substrate which contains an alloy material and a resin on the surface and has a ratio of the alloy material area to the total polishing area in a specific range is provided. To provide the polishing composition used to polish a substrate which contains an alloy material and a resin on a surface thereof and has a ratio of an alloy material area to a total polishing area of from 60 to 95%, the polishing composition containing crystalline abrasive grains having a cumulative 50% particle size (D50) based on a volume-based particle size distribution of 5.0 μm or more, an acid or a salt thereof and a water-soluble polymer.

    Abstract translation: 一种抛光组合物，其能够降低合金材料和树脂之间的抛光速度差异，并且在研磨含有合金材料和树脂的基材时，以高抛光速率对合金材料和树脂进行抛光 并且具有在特定范围内的合金材料面积与总抛光面积的比率。 为了提供用于研磨在其表面上含有合金材料和树脂的基材的抛光组合物，并且其合金材料面积与总抛光面积的比例为60-95％，所述抛光组合物含有结晶磨料颗粒 基于体积基于5.0μm以上的粒径分布的累积50％粒径（D50），酸或其盐和水溶性聚合物。

    METHOD FOR POLISHING ALLOY MATERIAL AND METHOD FOR MANUFACTURING ALLOY MATERIAL
    4.
    发明申请
    METHOD FOR POLISHING ALLOY MATERIAL AND METHOD FOR MANUFACTURING ALLOY MATERIAL 审中-公开
    用于抛光合金材料的方法和制造合金材料的方法

    公开(公告)号：US20150360340A1

    公开(公告)日：2015-12-17

    申请号：US14758411

    申请日：2013-12-26

    Applicant: FUJIMI INCORPORATED

    Inventor： Kazusei TAMAI ,  Maiko ASAI ,  Hitoshi MORINAGA

    IPC: B24B37/04 ,  C22C21/08 ,  C09G1/02 ,  C23F1/20

    CPC classification number: B24B37/044 ,  C09G1/02 ,  C09K3/1463 ,  C22C21/08 ,  C23F1/20

    Abstract: An alloy material polishing method of the present invention is a method for polishing an alloy material containing a main component and 0.5% by mass or more of an accessory component element having a Vickers hardness (HV) different from that of the main component by 5 or more. The polishing method is characterized by polishing a surface of the alloy material using a polishing composition containing abrasive grains and an oxoacid-based oxidizing agent. The main component of the alloy material is preferably at least one selected from aluminum, titanium, iron, nickel, and copper. The main component of the alloy material is preferably aluminum, and the accessory component element is preferably at least one selected from silicon, magnesium, iron, copper, and zinc. The polishing method preferably includes preliminarily polishing the alloy material using a preliminary polishing composition before the polishing of the alloy material using the polishing composition.

    Abstract translation: 本发明的合金材料研磨方法是将含有主要成分的合金材料和0.5质量％以上的维氏硬度（HV）与主成分的维氏硬度（HV）不同的附加成分元素研磨5以上的方法， 更多。 抛光方法的特征在于使用包含磨料颗粒和含氧酸的氧化剂的抛光组合物来研磨合金材料的表面。 合金材料的主要成分优选为选自铝，钛，铁，镍，铜中的至少一种。 合金材料的主要成分优选为铝，辅助成分元素优选为选自硅，镁，铁，铜，锌中的至少一种。 抛光方法优选包括在使用抛光组合物研磨合金材料之前，使用预备抛光组合物预先研磨合金材料。

    POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURING HARD BRITTLE MATERIAL SUBSTRATE
    5.
    发明申请
    POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR MANUFACTURING HARD BRITTLE MATERIAL SUBSTRATE 审中-公开

    公开(公告)号：US20180022960A1

    公开(公告)日：2018-01-25

    申请号：US15551492

    申请日：2016-02-12

    Applicant: FUJIMI INCORPORATED

    Inventor： Masayuki SERIKAWA ,  Kyousuke TENKOU ,  Tomomi AKIYAMA ,  Maiko ASAI

    IPC: C09G1/02 ,  C09K3/14 ,  B24B37/04

    CPC classification number: C09G1/02 ,  B24B37/044 ,  C09K3/1409 ,  C09K3/1463

    Abstract: There is provided a polishing composition for use in polishing of a surface of a polishing object including at least one of an oxide of a metal or a semimetal or a composite material of oxides of one or more metals and/or semimetals, and the polishing composition includes at least water and silica. The silica includes small-particle diameter silica having a particle diameter of 20 nm or more to 70 nm or less and large-particle diameter silica having a particle diameter of 100 nm or more to 200 nm or less, 2 mass % or more of the small-particle diameter silica is included in the polishing composition, 2 mass % or more of the large-particle diameter silica is included in the polishing composition, and a value obtained by dividing an average particle diameter of the large-particle diameter silica by an average particle diameter of the small-particle diameter silica is 2 or more.

    COMPOSITION FOR POLISHING TITANIUM ALLOY MATERIAL
    6.
    发明申请
    COMPOSITION FOR POLISHING TITANIUM ALLOY MATERIAL 审中-公开

    公开(公告)号：US20170216993A1

    公开(公告)日：2017-08-03

    申请号：US15501530

    申请日：2015-05-01

    Applicant: FUJIMI INCORPORATED

    Inventor： Maiko ASAI ,  Kazusei TAMAI ,  Hitoshi MORINAGA ,  Hiroshi ASANO

    IPC: B24B37/24 ,  C09G1/02

    CPC classification number: B24B37/24 ,  B24B37/00 ,  B24B37/044 ,  C09G1/02 ,  C09K3/1463

    Abstract: Provided is a composition for polishing a titanium alloy material, which enables polishing of a titanium alloy material at a high polishing speed and can provide a polished titanium alloy material having excellent surface smoothness and having a highly glossy surface after polishing.The composition for polishing a titanium alloy material is a composition that is intended for polishing a titanium alloy material and comprises a compound having a function of dissolving at least one metal element other than titanium, which exists at a content of more than 0.5% by mass with respect to the total mass of the titanium alloy material, at a higher degree of solubility than that of titanium; and abrasive grains.

    ABRASIVE, POLISHING COMPOSITION, AND POLISHING METHOD
    8.
    发明申请
    ABRASIVE, POLISHING COMPOSITION, AND POLISHING METHOD 审中-公开

    公开(公告)号：US20190153263A1

    公开(公告)日：2019-05-23

    申请号：US16096290

    申请日：2017-01-27

    Applicant: FUJIMI INCORPORATED

    Inventor： Hitoshi MORINAGA ,  Kazusei TAMAI ,  Maiko ASAI ,  Yuuichi ITO ,  Kyosuke TENKO ,  Toru KAMADA

    IPC: C09G1/02 ,  C09K3/14

    Abstract: Provided are an abrasive, a polishing composition, and a polishing method capable of polishing the surface of an alloy or metal oxide at a sufficient polishing removal rate and providing a high-quality mirror surface. The abrasive contains alumina having an α-conversion rate of 80% or more and having a 50% particle diameter, in a volume-based cumulative particle diameter distribution, of 0.15 μm or more to 0.35 μm or less. The polishing composition contains this abrasive and has a pH of 7 or less. These abrasive and polishing composition are used for polishing polishing objects containing at least one of an alloy and a metal oxide.

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