摘要:
The mechanical characterization system includes three main parts: A sub-millinewton resolution capacitive force sensor, at least one micromanipulator with position measurement capabilities, and a microscope. The sensitive axis of the force sensor is adjustably connected via adaptor pieces to the micromanipulator at any angular orientation relative to the sample holder.
摘要:
The mechanical characterization system includes three main parts: A sub-millinewton resolution capacitive force sensor, at least one micromanipulator with position measurement capabilities, and a microscope. The sensitive axis of the force sensor is adjustably connected via adaptor pieces to the micromanipulator at any angular orientation relative to the sample holder.
摘要:
A capacitive transducer a first part containing a first set of capacitor plates and a second part relatively movable in a plane to the first part. The second part contains a second set of capacitor plates. Both sets of capacitor plates are built on a substrate, wherein the capacitor plates form a plurality of capacitors. The second part is relatively movable in all six degrees of freedom. One set of the plurality of capacitors measures displacements in a plane and a second set of the plurality capacitors measures displacements perpendicular to the plane.
摘要:
A capacitive transducer a first part containing a first set of capacitor plates and a second part relatively movable in a plane to the first part. The second part contains a second set of capacitor plates. Both sets of capacitor plates are built on a substrate, wherein the capacitor plates form a plurality of capacitors. The second part is relatively movable in all six degrees of freedom. One set of the plurality of capacitors measures displacements in a plane and a second set of the plurality capacitors measures displacements perpendicular to the plane.
摘要:
A force sensor package includes the following main parts: a MEMS force sensor, an interface circuit converting a change of capacitance into an analog or digital sensor output signal, and a substrate on which the MEMS force sensor and the IC are attached. The interface circuit is a die in order to minimize the size of the force sensor. The MEMS force sensor and the interface circuit are attached to the substrate by an adhesive, e.g. glue. Electrical contacts are then realized by wire-bonding. Alternatively, the two parts may also be attached to the substrate by a flip-chip process using solder. A protective cover may be placed over the assembly.