公开(公告)号：US11454799B2

公开(公告)日：2022-09-27

申请号：US16752324

申请日：2020-01-24

Applicant: FormFactor, Inc.

Inventor： Gerald Lee Gisler ,  Sia Choon Beng ,  Anthony James Lord ,  Gavin Neil Fisher

IPC: G02B21/36 ,  G02B21/02 ,  G02B21/26

Abstract: Microscopes with objective assembly crash detection and methods of utilizing the same are disclosed herein. For example, a microscope comprises a microscope body, an objective assembly comprising an objective lens, an objective assembly mount configured to separably attach the objective assembly to the microscope body, and an orientation detection circuit configured to indicate when a relative orientation between the microscope body and the objective assembly differs from a predetermined relative orientation.

公开(公告)号：US11016121B2

公开(公告)日：2021-05-25

申请号：US16421173

申请日：2019-05-23

Applicant: FormFactor, Inc.

Inventor： Sia Choon Beng ,  David Randle Hess ,  Chunyi Yin Leong

IPC: G01R1/02 ,  G01R31/26 ,  G01R1/067 ,  G01R1/04

Abstract: Methods of controlling the operation of probe stations and probe stations that perform the methods. The methods including generating a test routine by constructing a substrate map, receiving a test subset input from a user, and updating the substrate map to incorporate information regarding which devices under test (DUTS) of a plurality of DUTs are in a test subset of a plurality of DUTs. The methods also include receiving a pre-test subset input from the user, wherein the pre-test subset is a subset of the test subset, and updating the substrate map to incorporate information which DUTs of the test subset are in the pre-test subset. The methods further include executing the test routine by moving a probe assembly to each DUT in the test subset, selectively performing a pre-test routine on each DUT that is in the pre-test subset, and electrically testing each DUT in the test subset.

公开(公告)号：US11181550B2

公开(公告)日：2021-11-23

申请号：US16421243

申请日：2019-05-23

Applicant: FormFactor, Inc.

Inventor： Sia Choon Beng ,  Kazuki Negishi

IPC: G01R1/073 ,  G01R1/067 ,  G01R31/28

Abstract: Probe systems and methods including electric contact detection. The probe systems include a probe assembly and a chuck. The probe systems also include a translation structure configured to operatively translate the probe assembly and/or the chuck and an instrumentation package configured to detect contact between the probe system and a device under test (DUT) and to test operation of the DUT. The instrumentation package includes a continuity detection circuit, a test circuit, and a translation structure control circuit. The continuity detection circuit is configured to detect electrical continuity between a first probe electrical conductor and a second probe electrical conductor. The test circuit is configured to electrically test the DUT. The translation structure control circuit is configured to control the operation of the translation structure. The methods include monitoring continuity between a first probe and a second probe and controlling the operation of a probe system based upon the monitoring.