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1.
公开(公告)号:US11131709B2
公开(公告)日:2021-09-28
申请号:US17021288
申请日:2020-09-15
Applicant: FormFactor, Inc.
Inventor: Joseph George Frankel , Kazuki Negishi , Michael E. Simmons , Eric Robert Christenson , Daniel Rishavy
Abstract: Probe systems for optically probing a device under test (DUT) and methods of operating the probe systems. The probe systems include a probing assembly that includes an optical probe that defines a probe tip and a distance sensor. The probe systems also include a support surface configured to support a substrate, which defines a substrate surface and includes an optical device positioned below the substrate surface. The probe systems further include a positioning assembly configured to selectively regulate a relative orientation between the probing assembly and the DUT. The probe systems also include a controller programmed to control the operation of the probe systems. The methods include methods of operating the probe systems.
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2.
公开(公告)号:US11874301B2
公开(公告)日:2024-01-16
申请号:US17078778
申请日:2020-10-23
Applicant: FormFactor, Inc.
Inventor: Kazuki Negishi , Yu-Wen Huang , Gerald Lee Gisler , Eric Robert Christenson , Michael E. Simmons
IPC: G01R1/07 , G01R31/308 , G01R31/319
CPC classification number: G01R1/07 , G01R31/308 , G01R31/31905
Abstract: Probe systems including imaging devices with objective lens isolators and related methods are disclosed herein. A probe system includes an enclosure with an enclosure volume for enclosing a substrate that includes one or more devices under test (DUTs), a testing assembly, and an imaging device. The imaging device includes an imaging device objective lens, an imaging device body, and an objective lens isolator. In examples, the probe system includes an electrical grounding assembly configured to restrict electromagnetic noise from entering the enclosure volume. In examples, methods of preparing the imaging device include assembling the imaging device such that the imaging device objective lens is at least partially electrically isolated from the imaging device body. In some examples, utilizing the probe system includes testing the one or more DUTs while restricting electrical noise from propagating from the imaging device to the substrate.
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公开(公告)号:US11047795B2
公开(公告)日:2021-06-29
申请号:US16884921
申请日:2020-05-27
Applicant: FormFactor, Inc.
Inventor: Kazuki Negishi , Michael E. Simmons , Christopher Anthony Storm , Joseph George Frankel , Eric Robert Christenson , Mario René Berg
Abstract: Calibration chucks for optical probe systems, optical probe systems including the calibration chucks, and methods of utilizing the optical probe systems. The calibration chucks include a calibration chuck body that defines a calibration chuck support surface. The calibration chucks also include at least one optical calibration structure that is supported by the calibration chuck body. The at least one optical calibration structure includes a horizontal viewing structure. The horizontal viewing structure is configured to facilitate viewing of a horizontally viewed region from a horizontal viewing direction that is at least substantially parallel to the calibration chuck support surface. The horizontal viewing structure also is configured to facilitate viewing of the horizontally viewed region via an imaging device of the optical probe system that is positioned vertically above the calibration chuck support surface.
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公开(公告)号:US11346883B2
公开(公告)日:2022-05-31
申请号:US17076279
申请日:2020-10-21
Applicant: FormFactor, Inc.
Inventor: Kazuki Negishi
Abstract: Probe systems and methods for testing a device under test are disclosed herein. The probe systems include an electrically conductive ground loop and a structure that is electrically connected to a ground potential via at least a region of the electrically conductive ground loop. The probe systems also include nonlinear circuitry. The nonlinear circuitry is configured to resist flow of electric current within the ground loop when a voltage differential across the nonlinear circuitry is less than a threshold voltage differential and permit flow of electric current within the ground loop when the voltage differential across the nonlinear circuitry is greater than the threshold voltage differential. The methods include positioning a device under test (DUT) within a probe system that includes an electrically conductive ground loop and nonlinear circuitry. The methods also include selectively resisting and permitting electric current flow within the ground loop and through the nonlinear circuitry.
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公开(公告)号:US11313936B2
公开(公告)日:2022-04-26
申请号:US17028102
申请日:2020-09-22
Applicant: FormFactor, Inc.
Inventor: Joseph George Frankel , Kazuki Negishi
IPC: G01R35/00 , G01R31/308 , G01R1/067 , G01R31/28
Abstract: Probe systems and methods of characterizing optical coupling between an optical probe of a probe system and a calibration structure. The probe systems include a probe assembly that includes an optical probe, a support surface configured to support a substrate, and a signal generation and analysis assembly configured to generate an optical signal and to provide the optical signal to the optical device via the optical probe. The probe systems also include an electrically actuated positioning assembly, a calibration structure configured to receive the optical signal, and an optical detector configured to detect a signal intensity of the optical signal. The probe systems further include a controller programmed to control the probe system to generate a representation of signal intensity as a function of the relative orientation between the optical probe and the calibration structure. The methods include methods of operating the probe systems.
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公开(公告)号:US11181550B2
公开(公告)日:2021-11-23
申请号:US16421243
申请日:2019-05-23
Applicant: FormFactor, Inc.
Inventor: Sia Choon Beng , Kazuki Negishi
Abstract: Probe systems and methods including electric contact detection. The probe systems include a probe assembly and a chuck. The probe systems also include a translation structure configured to operatively translate the probe assembly and/or the chuck and an instrumentation package configured to detect contact between the probe system and a device under test (DUT) and to test operation of the DUT. The instrumentation package includes a continuity detection circuit, a test circuit, and a translation structure control circuit. The continuity detection circuit is configured to detect electrical continuity between a first probe electrical conductor and a second probe electrical conductor. The test circuit is configured to electrically test the DUT. The translation structure control circuit is configured to control the operation of the translation structure. The methods include monitoring continuity between a first probe and a second probe and controlling the operation of a probe system based upon the monitoring.
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