Probe systems including imaging devices with objective lens isolators, and related methods

    公开(公告)号:US11874301B2

    公开(公告)日:2024-01-16

    申请号:US17078778

    申请日:2020-10-23

    CPC classification number: G01R1/07 G01R31/308 G01R31/31905

    Abstract: Probe systems including imaging devices with objective lens isolators and related methods are disclosed herein. A probe system includes an enclosure with an enclosure volume for enclosing a substrate that includes one or more devices under test (DUTs), a testing assembly, and an imaging device. The imaging device includes an imaging device objective lens, an imaging device body, and an objective lens isolator. In examples, the probe system includes an electrical grounding assembly configured to restrict electromagnetic noise from entering the enclosure volume. In examples, methods of preparing the imaging device include assembling the imaging device such that the imaging device objective lens is at least partially electrically isolated from the imaging device body. In some examples, utilizing the probe system includes testing the one or more DUTs while restricting electrical noise from propagating from the imaging device to the substrate.

    Probe systems and methods for testing a device under test

    公开(公告)号:US11346883B2

    公开(公告)日:2022-05-31

    申请号:US17076279

    申请日:2020-10-21

    Inventor: Kazuki Negishi

    Abstract: Probe systems and methods for testing a device under test are disclosed herein. The probe systems include an electrically conductive ground loop and a structure that is electrically connected to a ground potential via at least a region of the electrically conductive ground loop. The probe systems also include nonlinear circuitry. The nonlinear circuitry is configured to resist flow of electric current within the ground loop when a voltage differential across the nonlinear circuitry is less than a threshold voltage differential and permit flow of electric current within the ground loop when the voltage differential across the nonlinear circuitry is greater than the threshold voltage differential. The methods include positioning a device under test (DUT) within a probe system that includes an electrically conductive ground loop and nonlinear circuitry. The methods also include selectively resisting and permitting electric current flow within the ground loop and through the nonlinear circuitry.

    Probe systems and methods for characterizing optical coupling between an optical probe of a probe system and a calibration structure

    公开(公告)号:US11313936B2

    公开(公告)日:2022-04-26

    申请号:US17028102

    申请日:2020-09-22

    Abstract: Probe systems and methods of characterizing optical coupling between an optical probe of a probe system and a calibration structure. The probe systems include a probe assembly that includes an optical probe, a support surface configured to support a substrate, and a signal generation and analysis assembly configured to generate an optical signal and to provide the optical signal to the optical device via the optical probe. The probe systems also include an electrically actuated positioning assembly, a calibration structure configured to receive the optical signal, and an optical detector configured to detect a signal intensity of the optical signal. The probe systems further include a controller programmed to control the probe system to generate a representation of signal intensity as a function of the relative orientation between the optical probe and the calibration structure. The methods include methods of operating the probe systems.

    Probe systems and methods including electric contact detection

    公开(公告)号:US11181550B2

    公开(公告)日:2021-11-23

    申请号:US16421243

    申请日:2019-05-23

    Abstract: Probe systems and methods including electric contact detection. The probe systems include a probe assembly and a chuck. The probe systems also include a translation structure configured to operatively translate the probe assembly and/or the chuck and an instrumentation package configured to detect contact between the probe system and a device under test (DUT) and to test operation of the DUT. The instrumentation package includes a continuity detection circuit, a test circuit, and a translation structure control circuit. The continuity detection circuit is configured to detect electrical continuity between a first probe electrical conductor and a second probe electrical conductor. The test circuit is configured to electrically test the DUT. The translation structure control circuit is configured to control the operation of the translation structure. The methods include monitoring continuity between a first probe and a second probe and controlling the operation of a probe system based upon the monitoring.

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