公开(公告)号：US07681991B2

公开(公告)日：2010-03-23

申请号：US11757573

申请日：2007-06-04

申请人： Frank Edward Anderson ,  Michael John Dixon ,  Eric Spencer Hall ,  Elios Klemo ,  Bryan Dale McKinley ,  Jeanne Marie Saldanha Singh

发明人： Frank Edward Anderson ,  Michael John Dixon ,  Eric Spencer Hall ,  Elios Klemo ,  Bryan Dale McKinley ,  Jeanne Marie Saldanha Singh

IPC分类号： B41J2/05

CPC分类号： B41J2/14129 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2202/03 ,  Y10T29/435 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49401 ,  Y10T428/24926

摘要： A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTTC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors.

摘要翻译： 一种用于接收用于微流体喷射头的喷射头芯片的复合陶瓷基板和用于制造复合陶瓷基板的方法。 衬底包括具有基本平坦化的第一表面的高温预先烧制的陶瓷基底和穿过其中的至少一个流体供给槽。 具有至少两个LTCC带层的低温共烧陶瓷（LTCC）带层束在LTCC带层束和陶瓷基底的第一表面之间的界面附着在陶瓷基底上。 LTTC带层束在其中具有至少一个芯片袋，并且LTCC带层中的至少一个包括多个导体。

公开(公告)号：US20100132874A1

公开(公告)日：2010-06-03

申请号：US12697308

申请日：2010-02-01

申请人： Frank Edward Anderson ,  Michael John Dixon ,  Eric Spencer Hall ,  Elios Klemo ,  Bryan Dale McKinley ,  Jeanne Marie Saldanha Singh

发明人： Frank Edward Anderson ,  Michael John Dixon ,  Eric Spencer Hall ,  Elios Klemo ,  Bryan Dale McKinley ,  Jeanne Marie Saldanha Singh

IPC分类号： B29C65/02

CPC分类号： B41J2/14129 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2202/03 ,  Y10T29/435 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49401 ,  Y10T428/24926

摘要： A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTCC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors.

摘要翻译： 一种用于接收用于微流体喷射头的喷射头芯片的复合陶瓷基板和用于制造复合陶瓷基板的方法。 衬底包括具有基本平坦化的第一表面的高温预先烧制的陶瓷基底和穿过其中的至少一个流体供给槽。 具有至少两个LTCC带层的低温共烧陶瓷（LTCC）带层束在LTCC带层束和陶瓷基底的第一表面之间的界面附着在陶瓷基底上。 LTCC带层束在其中具有至少一个芯片袋，并且LTCC带层中的至少一个包括多个导体。

公开(公告)号：US07937835B2

公开(公告)日：2011-05-10

申请号：US12697308

申请日：2010-02-01

申请人： Frank Edward Anderson ,  Michael John Dixon ,  Eric Spencer Hall ,  Elios Klemo ,  Bryan Dale McKinley ,  Jeanne Marie Saldanha Singh

发明人： Frank Edward Anderson ,  Michael John Dixon ,  Eric Spencer Hall ,  Elios Klemo ,  Bryan Dale McKinley ,  Jeanne Marie Saldanha Singh

IPC分类号： B21H1/08 ,  B41J2/05

CPC分类号： B41J2/14129 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2202/03 ,  Y10T29/435 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49401 ,  Y10T428/24926

摘要： A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTTC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors.

摘要翻译： 一种用于接收用于微流体喷射头的喷射头芯片的复合陶瓷基板和用于制造复合陶瓷基板的方法。 衬底包括具有基本平坦化的第一表面的高温预先烧制的陶瓷基底和穿过其中的至少一个流体供给槽。 具有至少两个LTCC带层的低温共烧陶瓷（LTCC）带层束在LTCC带层束和陶瓷基底的第一表面之间的界面附着在陶瓷基底上。 LTTC带层束在其中具有至少一个芯片袋，并且LTCC带层中的至少一个包括多个导体。

公开(公告)号：US20080299361A1

公开(公告)日：2008-12-04

申请号：US11757573

申请日：2007-06-04

申请人： Frank Edward Anderson ,  Michael John Dixon ,  Eric Spencer Hall ,  Elios Klemo ,  Bryan Dale McKinley ,  Jeanne Marie Saldanha Singh

发明人： Frank Edward Anderson ,  Michael John Dixon ,  Eric Spencer Hall ,  Elios Klemo ,  Bryan Dale McKinley ,  Jeanne Marie Saldanha Singh

IPC分类号： B41J2/01

CPC分类号： B41J2/14129 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2202/03 ,  Y10T29/435 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49401 ,  Y10T428/24926

摘要： A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTTC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors.

摘要翻译： 一种用于接收用于微流体喷射头的喷射头芯片的复合陶瓷基板和用于制造复合陶瓷基板的方法。 衬底包括具有基本平坦化的第一表面的高温预先烧制的陶瓷基底和穿过其中的至少一个流体供给槽。 具有至少两个LTCC带层的低温共烧陶瓷（LTCC）带层束在LTCC带层束和陶瓷基底的第一表面之间的界面附着在陶瓷基底上。 LTTC带层束在其中具有至少一个芯片袋，并且LTCC带层中的至少一个包括多个导体。

公开(公告)号：US07484823B2

公开(公告)日：2009-02-03

申请号：US11324167

申请日：2005-12-30

申请人： Lucas David Barkley ,  Bruce David Gibson ,  Eric Spencer Hall ,  David G. King ,  George K Parish

发明人： Lucas David Barkley ,  Bruce David Gibson ,  Eric Spencer Hall ,  David G. King ,  George K Parish

IPC分类号： B41J29/38

CPC分类号： B41J2/195 ,  B41J2/04563 ,  B41J2/0458

摘要： Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. Additionally, the first heater array and the second heater array are operable to receive heating responsive to the temperature of the region sensed by the temperature sensing element to regulate the temperature of the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor and the heating may occur via non-nucleating heating.

摘要翻译： 用于与打印装置一起使用的加热器芯片，例如包括基本上邻近第一通孔定位的第一加热器阵列的加热器芯片和基本上邻近第二通孔定位的第二加热器阵列。 加热器芯片还可以包括位于第一加热器阵列和第二加热器阵列之间的区域，以及温度感测元件，其可操作以感测区域的温度，其中温度感测元件相对于该区域基本上居中设置。 另外，第一加热器阵列和第二加热器阵列可操作以响应于由温度感测元件感测的区域的温度接收加热，以调节该区域的温度。 根据本发明的一个实施例，温度感测元件包括温度感测电阻器，并且加热可以通过非成核加热发生。

公开(公告)号：US06902867B2

公开(公告)日：2005-06-07

申请号：US10262827

申请日：2002-10-02

申请人： Eric Spencer Hall ,  Shauna Marie Leis ,  Andrew Lee McNees ,  James Michael Mrvos ,  James Harold Powers ,  Carl Edmond Sullivan

发明人： Eric Spencer Hall ,  Shauna Marie Leis ,  Andrew Lee McNees ,  James Michael Mrvos ,  James Harold Powers ,  Carl Edmond Sullivan

IPC分类号： B41J2/16 ,  B41J2/05

CPC分类号： B41J2/1623 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1635 ,  B41J2/1645

摘要： The invention provides a method for making ink feed vias in semiconductor silicon substrate chips for an ink jet printhead and ink jet printheads containing silicon chips made by the method. The method includes applying a first photoresist material to a first surface side of the chip. The first photoresist material is patterned and developed to define at least one ink via location therein. An etch stop material is applied to a second surface side of the chip. At least one ink via is anisotropically etched with a dry etch process through the thickness of the silicon chip up to the etch stop layer from the first surface side of the chip. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.

摘要翻译： 本发明提供了一种在用于喷墨打印头的半导体硅衬底芯片中制造墨水供给通孔的方法，以及通过该方法制造的含有硅芯片的喷墨打印头。 该方法包括将第一光致抗蚀剂材料施加到芯片的第一表面侧。 第一光致抗蚀剂材料被图案化和显影以在其中限定至少一个墨通孔位置。 将蚀刻停止材料施加到芯片的第二表面侧。 通过干法蚀刻工艺将至少一个墨通孔从芯片的第一表面侧通过硅片的厚度直到蚀刻停止层。 与传统的油墨通孔形成技术相反，该方法显着提高了硅芯片的生产量，并减少了由于断屑和破裂造成的损耗。 所得到的芯片对于长期的打印头使用更可靠。

公开(公告)号：US20070229575A1

公开(公告)日：2007-10-04

申请号：US11685334

申请日：2007-03-13

申请人： David Christopher Graham ,  Eric Spencer Hall ,  Gary Anthony Holt ,  Richard Leo Hubert ,  Johnny Dale Massie ,  Sean Terrance Weaver ,  Jonathan Harold Laurer ,  Rich Wells

发明人： David Christopher Graham ,  Eric Spencer Hall ,  Gary Anthony Holt ,  Richard Leo Hubert ,  Johnny Dale Massie ,  Sean Terrance Weaver ,  Jonathan Harold Laurer ,  Rich Wells

IPC分类号： B41J2/015

CPC分类号： B41J2/1623 ,  B41J2/14024 ,  B41J2/1408 ,  B41J2/1603

摘要： Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

摘要翻译： 可热固化的密封剂组合物，微流体喷射装置和用于保护微流体喷射头的方法。 一种这样的密封剂组合物可以包括具有约50.0至约95.0重量％的至少一种具有柔性骨架的可交联树脂的组合物; 约0.1至约20.0重量％的至少一种热固化剂; 和约0.0-约50.0重量％的填料，并且在固化时表现出相对较低的剪切模量（例如在25℃下小于约10.0MPa）。

公开(公告)号：US07819506B2

公开(公告)日：2010-10-26

申请号：US11685334

申请日：2007-03-13

申请人： David Christopher Graham ,  Eric Spencer Hall ,  Gary Anthony Holt, Jr. ,  Richard Leo Hubert, II ,  Johnny Dale Massie ,  Sean Terrance Weaver ,  Jonathan Harold Laurer ,  Rich Wells

发明人： David Christopher Graham ,  Eric Spencer Hall ,  Gary Anthony Holt, Jr. ,  Richard Leo Hubert, II ,  Johnny Dale Massie ,  Sean Terrance Weaver ,  Jonathan Harold Laurer ,  Rich Wells

IPC分类号： B41J2/05

CPC分类号： B41J2/1623 ,  B41J2/14024 ,  B41J2/1408 ,  B41J2/1603

摘要： Thermally curable encapsulant compositions, micro-fluid ejection devices, and methods for protecting micro-fluid ejection heads. One such encapsulant composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin having a flexible backbone; from about 0.1 to about 20.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 50.0 percent by weight filler, and exhibits a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25° C.).

摘要翻译： 可热固化的密封剂组合物，微流体喷射装置和用于保护微流体喷射头的方法。 一种这样的密封剂组合物可以包括具有约50.0至约95.0重量％的至少一种具有柔性骨架的可交联树脂的组合物; 约0.1至约20.0重量％的至少一种热固化剂; 和约0.0-约50.0重量％的填料，并且在固化时表现出相对较低的剪切模量（例如在25℃下小于约10.0MPa）。

公开(公告)号：US07594708B2

公开(公告)日：2009-09-29

申请号：US11323809

申请日：2005-12-30

申请人： Lucas David Barkley ,  Bruce David Gibson ,  Eric Spencer Hall ,  David G. King ,  George K. Parish

发明人： Lucas David Barkley ,  Bruce David Gibson ,  Eric Spencer Hall ,  David G. King ,  George K. Parish

IPC分类号： B41J29/38

CPC分类号： B41J2/195 ,  B41J2/04563 ,  B41J2/0458

摘要： Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor.

摘要翻译： 用于与打印装置一起使用的加热器芯片，例如包括基本上邻近第一通孔定位的第一加热器阵列的加热器芯片和基本上邻近第二通孔定位的第二加热器阵列。 加热器芯片还可以包括位于第一加热器阵列和第二加热器阵列之间的区域，以及温度感测元件，其可操作以感测区域的温度，其中温度感测元件相对于该区域基本上居中设置。 根据本发明的一个实施例，温度感测元件包括温度感测电阻器。

公开(公告)号：US06502926B2

公开(公告)日：2003-01-07

申请号：US09772721

申请日：2001-01-30

申请人： William Paul Cook ,  Stephen Francis DeFosse ,  Curtis Ray Droege ,  Hrishikesh Pramod Gogate ,  Eric Spencer Hall

发明人： William Paul Cook ,  Stephen Francis DeFosse ,  Curtis Ray Droege ,  Hrishikesh Pramod Gogate ,  Eric Spencer Hall

IPC分类号： B41S205

CPC分类号： B41J2/1623 ,  B41J2/1408 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1632 ,  B41J2/1634

摘要： The invention provides a printhead for an ink jet printer and a method for making a printhead for an ink jet printer. The printhead includes a printhead body having a chip surface side, an ink surface side opposite the chip surface side and a first coefficient of thermal expansion (CTE). A semiconductor chip containing ink ejector devices is adhesively attached to the chip surface side of the printhead body. A stiffener is adhesively attached to the ink surface side to provide body stiffening during curing of the adhesive. The semiconductor chip has a second CTE and the stiffener has a third CTE wherein the second and third CTE's have a similar value. The invention provides an improved structure for printheads which resist warpage and/or breakage of the semiconductor chips during the manufacturing process used to make the printheads.