公开(公告)号：US08084865B2

公开(公告)日：2011-12-27

申请号：US12112588

申请日：2008-04-30

申请人： Franz Hirler ,  Walter Rieger ,  Uwe Schmalzbauer ,  Rudolf Zelsacher ,  Markus Zundel

发明人： Franz Hirler ,  Walter Rieger ,  Uwe Schmalzbauer ,  Rudolf Zelsacher ,  Markus Zundel

IPC分类号： H01L23/528 ,  H01L21/768

CPC分类号： H01L29/7813 ,  H01L21/743 ,  H01L23/535 ,  H01L29/407 ,  H01L29/4236 ,  H01L29/42372 ,  H01L29/4238 ,  H01L29/7811 ,  H01L2924/0002 ,  H01L2924/00

摘要： An anchoring structure for a metal structure of a semiconductor device includes an anchoring recess structure having at least one overhanging side wall, the metal structure being at least partly arranged within the anchoring recess structure.

摘要翻译： 用于半导体器件的金属结构的锚定结构包括具有至少一个悬垂侧壁的锚固凹槽结构，金属结构至少部分地布置在锚定凹槽结构内。

公开(公告)号：US20080265427A1

公开(公告)日：2008-10-30

申请号：US12112588

申请日：2008-04-30

申请人： Franz Hirler ,  Walter Rieger ,  Uwe Schmalzbauer ,  Rudolf Zelsacher ,  Markus Zundel

发明人： Franz Hirler ,  Walter Rieger ,  Uwe Schmalzbauer ,  Rudolf Zelsacher ,  Markus Zundel

IPC分类号： H01L23/528 ,  H01L21/768

CPC分类号： H01L29/7813 ,  H01L21/743 ,  H01L23/535 ,  H01L29/407 ,  H01L29/4236 ,  H01L29/42372 ,  H01L29/4238 ,  H01L29/7811 ,  H01L2924/0002 ,  H01L2924/00

摘要： An anchoring structure for a metal structure of a semiconductor device includes an anchoring recess structure having at least one overhanging side wall, the metal structure being at least partly arranged within the anchoring recess structure.

摘要翻译： 用于半导体器件的金属结构的锚定结构包括具有至少一个悬垂侧壁的锚固凹槽结构，金属结构至少部分地布置在锚定凹槽结构内。

公开(公告)号：US07851349B2

公开(公告)日：2010-12-14

申请号：US11527743

申请日：2006-09-26

申请人： Walter Rieger ,  Paul Ganitzer ,  Oliver Haeberlen ,  Franz Hirler ,  Markus Zundel ,  Rudolf Zelsacher ,  Erwin Bacher

发明人： Walter Rieger ,  Paul Ganitzer ,  Oliver Haeberlen ,  Franz Hirler ,  Markus Zundel ,  Rudolf Zelsacher ,  Erwin Bacher

IPC分类号： H01L21/283

CPC分类号： H01L29/7813 ,  H01L21/26586 ,  H01L29/086 ,  H01L29/0869 ,  H01L29/1095 ,  H01L29/41766 ,  H01L29/4236 ,  H01L29/456 ,  H01L29/66348 ,  H01L29/66727 ,  H01L29/66734 ,  H01L29/7397

摘要： A method for producing a connection electrode for a first semiconductor zone and a second semiconductor zone includes producing a trench extending through the first semiconductor zone right into the second semiconductor zone in such a way that the first semiconductor zone is uncovered at sidewalls of the trench and the second semiconductor zone is uncovered at least at a bottom of the trench. The method also includes applying a protective layer to a first one of the first and second semiconductor zones in the trench, and producing a first connection zone in the second of the two semiconductor zones, which is not covered by the protective layer. The method further includes depositing an electrode layer at least onto the sidewalls and the bottom of the trench for the purpose of producing the connection electrode.

摘要翻译： 一种用于制造用于第一半导体区和第二半导体区的连接电极的方法包括制造在第二半导体区内延伸通过第一半导体区的沟槽，使得第一半导体区未被覆盖在沟槽的侧壁处， 至少在沟槽的底部露出第二半导体区域。 该方法还包括向沟槽中的第一和第二半导体区域中的第一个施加保护层，并且在两个半导体区域中的第二个半导体区域中产生未被保护层覆盖的第一连接区域。 该方法还包括至少将电极层沉积到沟槽的侧壁和底部上，以产生连接电极。

公开(公告)号：US20070093019A1

公开(公告)日：2007-04-26

申请号：US11527743

申请日：2006-09-26

申请人： Walter Rieger ,  Paul Ganitzer ,  Oliver Haeberlen ,  Franz Hirler ,  Markus Zundel ,  Rudolf Zelsacher ,  Erwin Bacher

发明人： Walter Rieger ,  Paul Ganitzer ,  Oliver Haeberlen ,  Franz Hirler ,  Markus Zundel ,  Rudolf Zelsacher ,  Erwin Bacher

IPC分类号： H01L21/8242 ,  H01L21/76

CPC分类号： H01L29/7813 ,  H01L21/26586 ,  H01L29/086 ,  H01L29/0869 ,  H01L29/1095 ,  H01L29/41766 ,  H01L29/4236 ,  H01L29/456 ,  H01L29/66348 ,  H01L29/66727 ,  H01L29/66734 ,  H01L29/7397

摘要： Method for producing a connection electrode for two semiconductor zones arranged one above another The invention relates to a method for producing a connection electrode for a first semiconductor zone and a second semiconductor zone, which are arranged one above another and are doped complementarily with respect to one another, which method comprises the method steps of: producing a trench extending through the first semiconductor zone right into the second semiconductor zone in such a way that the first semiconductor zone is uncovered at sidewalls of the trench and the second semiconductor zone is uncovered at least at a bottom of the trench, applying a protective layer to one of the first and second semiconductor zones in the trench, producing a first connection zone in the other of the two semiconductor zones, which is not covered by the protective layer, by introducing dopant atoms into this other semiconductor zone via the trench, the connection zone being of the same conductivity type as said other semiconductor zone, but doped more highly, depositing an electrode layer at least onto the sidewalls and the bottom of the trench for the purpose of producing the connection electrode.

摘要翻译： 一种制造用于两个半导体区域的连接电极的方法本发明涉及一种用于制造用于第一半导体区域和第二半导体区域的连接电极的方法，所述连接电极被布置在另一个之上，并且相对于一个 另一方面，该方法包括以下方法步骤：产生通过第一半导体区域直接进入第二半导体区域的沟槽，使得第一半导体区域在沟槽的侧壁处未被覆盖，并且至少覆盖第二半导体区域 在沟槽的底部，在沟槽中的第一和第二半导体区域中的一个上施加保护层，在两个半导体区域中的另一个半导体区域中的第一连接区域中，未被保护层覆盖，通过引入掺杂剂 原子通过沟槽进入该另一半导体区，连接区具有相同的导电性 类型作为所述另一半导体区，但是掺杂更高，至少在沟槽的侧壁和底部上沉积电极层以产生连接电极。

公开(公告)号：US07601596B2

公开(公告)日：2009-10-13

申请号：US11600422

申请日：2006-11-16

申请人： Markus Zundel ,  Franz Hirler ,  Rudolf Zelsacher ,  Erwin Bacher

发明人： Markus Zundel ,  Franz Hirler ,  Rudolf Zelsacher ,  Erwin Bacher

IPC分类号： H01L21/336

CPC分类号： H01L29/7813 ,  H01L29/41766 ,  H01L29/42368 ,  H01L29/66727 ,  H01L29/66734

摘要： According to one embodiment, a method for manufacturing a semiconductor device includes forming trenches in a first side of a semiconductor material and forming a thick oxide layer on the trenches and on the first side. A part of the first side and the trenches is masked using a first mask, and the semiconductor material is doped by implantation through the thick oxide layer while the first mask is present. At least part of the thick oxide layer is removed while the first mask remains.

摘要翻译： 根据一个实施例，一种用于制造半导体器件的方法包括：在半导体材料的第一侧形成沟槽，并在沟槽和第一侧上形成厚的氧化物层。 使用第一掩模掩模第一侧面和沟槽的一部分，并且通过在第一掩模存在的情况下通过厚氧化物层的注入来掺杂半导体材料。 当第一掩模残留时，去除厚氧化物层的至少一部分。

公开(公告)号：US07446373B2

公开(公告)日：2008-11-04

申请号：US10939154

申请日：2004-09-10

申请人： Markus Zundel ,  Rudolf Zelsacher ,  Franz Hirler ,  Dietmar Kotz ,  Hermann Peri ,  Armin Willmeroth

发明人： Markus Zundel ,  Rudolf Zelsacher ,  Franz Hirler ,  Dietmar Kotz ,  Hermann Peri ,  Armin Willmeroth

IPC分类号： H01L29/76

CPC分类号： H01L29/7813 ,  H01L29/0615 ,  H01L29/0847 ,  H01L29/0878 ,  H01L29/42368 ,  H01L29/7811

摘要： A semiconductor component and also a method for producing it are disclosed. In one embodiment, the semiconductor component includes a surface region or a modified doping region is provided alternatively or simultaneously in the edge region of the cell array, in which surface region or modified doping region the doping concentration is lowered and/or in which surface region or modified doping region the conductivity type is formed such that it is opposite to the conductivity type of the actual semiconductor material region, or in which a field plate region is provided.

摘要翻译： 公开了一种半导体元件及其制造方法。 在一个实施例中，半导体部件包括表面区域或修改的掺杂区域交替地或同时地设置在电池阵列的边缘区域中，其中掺杂浓度降低的表面区域或修饰掺杂区域和/或其中表面区域 或改性掺杂区域形成导电类型，使其与实际的半导体材料区域的导电类型相反，或者设置有场板区域。

公开(公告)号：US20080265318A1

公开(公告)日：2008-10-30

申请号：US12167437

申请日：2008-07-03

申请人： Markus Zundel ,  Rudolf Zelsacher ,  Franz Hirler ,  Dietmar Kotz ,  Hermann Peri ,  Armin Willmeroth

发明人： Markus Zundel ,  Rudolf Zelsacher ,  Franz Hirler ,  Dietmar Kotz ,  Hermann Peri ,  Armin Willmeroth

IPC分类号： H01L27/088 ,  H01L21/8234

CPC分类号： H01L29/7813 ,  H01L29/0615 ,  H01L29/0847 ,  H01L29/0878 ,  H01L29/42368 ,  H01L29/7811

摘要： A semiconductor component includes a surface region. A modified doping region is provided in the edge region of the cell array. In the surface region or modified doping region the doping concentration is lowered and/or in the surface region or modified doping region the conductivity type is formed such that it is opposite to the conductivity type of the actual semiconductor material region, or in which a field plate region is provided.

摘要翻译： 半导体部件包括表面区域。 在单元阵列的边缘区域中提供修改的掺杂区域。 在表面区域或改性掺杂区域中，掺杂浓度降低和/或在表面区域或修饰掺杂区域中形成导电类型，使其与实际半导体材料区域的导电类型相反，或者其中场 板区域。

公开(公告)号：US20110294289A1

公开(公告)日：2011-12-01

申请号：US12953230

申请日：2010-11-23

申请人： Walter Reiger ,  Paul Ganitzer ,  Oliver Haeberlen ,  Franz Hirler ,  Markus Zundel ,  Rudolf Zelsacher ,  Erwin Bacher

发明人： Walter Reiger ,  Paul Ganitzer ,  Oliver Haeberlen ,  Franz Hirler ,  Markus Zundel ,  Rudolf Zelsacher ,  Erwin Bacher

IPC分类号： H01L21/768

CPC分类号： H01L29/7813 ,  H01L21/26586 ,  H01L29/086 ,  H01L29/0869 ,  H01L29/1095 ,  H01L29/41766 ,  H01L29/4236 ,  H01L29/456 ,  H01L29/66348 ,  H01L29/66727 ,  H01L29/66734 ,  H01L29/7397

摘要： A method for producing a connection electrode for a first and second adjacent and complementarily doped semiconductor zones includes a step of producing a trench extending through the first semiconductor zone into the second semiconductor zone in such a way that the first semiconductor zone is uncovered at sidewalls of the trench and the second semiconductor zone is uncovered at least at a bottom of the trench. The method also includes producing a first connection zone in the first semiconductor zone by implanting dopant atoms into the sidewalls at least at a first angle. The method further includes producing a second connection zone in the second semiconductor zone by implanting dopant atoms at least at a second, different angle. The method also includes depositing an electrode layer at least onto the sidewalls and the bottom of the trench for the purpose of producing the connection electrode.

摘要翻译： 一种用于制造用于第一和第二相邻和互补掺杂的半导体区的连接电极的方法包括以下步骤：产生延伸穿过第一半导体区进入第二半导体区的沟槽，使得第一半导体区在 沟槽和第二半导体区域至少在沟槽的底部被覆盖。 该方法还包括通过至少以第一角度将掺杂剂原子注入到侧壁中来在第一半导体区域中产生第一连接区域。 该方法还包括通过至少以不同的角度注入掺杂剂原子来在第二半导体区域中产生第二连接区域。 该方法还包括至少将电极层沉积到沟槽的侧壁和底部上以产生连接电极。

公开(公告)号：US07790550B2

公开(公告)日：2010-09-07

申请号：US12186242

申请日：2008-08-05

申请人： Franz Hirler ,  Martin Poelzl ,  Markus Zundel ,  Rudolf Zelsacher

发明人： Franz Hirler ,  Martin Poelzl ,  Markus Zundel ,  Rudolf Zelsacher

IPC分类号： H01L21/336

CPC分类号： H01L29/7813 ,  H01L29/0878 ,  H01L29/404 ,  H01L29/407 ,  H01L29/42368 ,  H01L29/66734

摘要： A trench transistor having a semiconductor body, in which a trench structure and an electrode structure embedded in the trench structure is disclosed. The electrode structure is electrically insulated from the semiconductor body by an insulation structure. The electrode structure has a gate electrode structure and a field electrode structure arranged below the gate electrode structure and electrically insulated from the latter. There is provided between the gate electrode structure and the field electrode structure a shielding structure for reducing the capacitive coupling between the gate electrode structure and the field electrode structure.

摘要翻译： 公开了一种具有半导体本体的沟槽晶体管，其中沟槽结构和嵌入沟槽结构中的电极结构被公开。 电极结构通过绝缘结构与半导体本体电绝缘。 电极结构具有栅电极结构和场电极结构，其布置在栅电极结构的下方并与之电绝缘。 在栅电极结构和场电极结构之间设置有用于减小栅电极结构和场电极结构之间的电容耦合的屏蔽结构。

公开(公告)号：US20090206401A1

公开(公告)日：2009-08-20

申请号：US12186242

申请日：2008-08-05

申请人： Franz Hirler ,  Martin Poelzl ,  Markus Zundel ,  Rudolf Zelsacher

发明人： Franz Hirler ,  Martin Poelzl ,  Markus Zundel ,  Rudolf Zelsacher

IPC分类号： H01L29/78 ,  H01L21/28

CPC分类号： H01L29/7813 ,  H01L29/0878 ,  H01L29/404 ,  H01L29/407 ,  H01L29/42368 ,  H01L29/66734

摘要： A trench transistor having a semiconductor body, in which a trench structure and an electrode structure embedded in the trench structure is disclosed. The electrode structure is electrically insulated from the semiconductor body by an insulation structure. The electrode structure has a gate electrode structure and a field electrode structure arranged below the gate electrode structure and electrically insulated from the latter. There is provided between the gate electrode structure and the field electrode structure a shielding structure for reducing the capacitive coupling between the gate electrode structure and the field electrode structure.

摘要翻译： 公开了一种具有半导体本体的沟槽晶体管，其中沟槽结构和嵌入沟槽结构中的电极结构被公开。 电极结构通过绝缘结构与半导体本体电绝缘。 电极结构具有栅电极结构和场电极结构，其布置在栅电极结构的下方并与之电绝缘。 在栅电极结构和场电极结构之间设置有用于减小栅电极结构和场电极结构之间的电容耦合的屏蔽结构。