公开(公告)号：US10262942B2

公开(公告)日：2019-04-16

申请号：US15661029

申请日：2017-07-27

Applicant: GLOBALFOUNDRIES INC.

Inventor： Qiang Fang ,  Haigou Huang ,  Shafaat Ahmed ,  Changhong Wu ,  Dinesh R. Koli

IPC: H01L21/4763 ,  H01L23/12 ,  H01L23/532 ,  H01L21/768 ,  H01L21/288 ,  H01L21/285 ,  H01L21/3213

Abstract: The disclosure relates to a method of forming a Co contact module, the method including depositing a liner layer on a trench block, partially plating the lined trenches with Co as a first metal such that the resulting Co layer has a top surface below an opening top surface of a shallowest trench, depositing a second metal on the Co layer and exposed surfaces of the liner layer, planarizing the second metal layer, and etching the second metal layer and portions of the liner layer. The disclosure also relates to a Co contact module formed by the noted method.

公开(公告)号：US20190035739A1

公开(公告)日：2019-01-31

申请号：US15661029

申请日：2017-07-27

Applicant: GLOBALFOUNDRIES INC.

Inventor： Qiang Fang ,  Haigou Huang ,  Shafaat Ahmed ,  Changhong Wu ,  Dinesh R. Koli

IPC: H01L23/532 ,  H01L21/768 ,  H01L21/288 ,  H01L21/285 ,  H01L21/3213

Abstract: The disclosure relates to a method of forming a Co contact module, the method including depositing a liner layer on a trench block, partially plating the lined trenches with Co as a first metal such that the resulting Co layer has a top surface below an opening top surface of a shallowest trench, depositing a second metal on the Co layer and exposed surfaces of the liner layer, planarizing the second metal layer, and etching the second metal layer and portions of the liner layer. The disclosure also relates to a Co contact module formed by the noted method.

公开(公告)号：US10109521B1

公开(公告)日：2018-10-23

申请号：US15606895

申请日：2017-05-26

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Qiang Fang ,  Shafaat Ahmed ,  Changhong Wu ,  Zhiguo Sun ,  Jiehui Shu

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/532

Abstract: A method of forming hybrid Co and Cu CA/CB contacts and the resulting device are provided. Embodiments include forming a forming a plurality of trenches through an ILD down to a substrate; forming a first metal liner on side and bottom surfaces of each trench and over the ILD; annealing the first metal liner; forming a second metal liner over the first metal liner; forming a first plating layer over a portion of the second metal liner in each trench; forming a second plating layer over the second metal liner and first plating layer in a remaining portion of each trench, the first and second plating layers being different materials; and planarizing the second plating layer and the second and first metal liners down to the ILD.