公开(公告)号：US10340183B1

公开(公告)日：2019-07-02

申请号：US15860318

申请日：2018-01-02

Applicant: GLOBALFOUNDRIES INC.

Inventor： Qiang Fang ,  Shafaat Ahmed ,  Zhiguo Sun ,  Jiehui Shu ,  Dinesh R. Koli ,  Wei-Tsu Tseng

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/532

CPC classification number: H01L21/76844 ,  H01L21/76807 ,  H01L21/76877 ,  H01L23/5226 ,  H01L23/53238

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a cobalt plated via integration scheme and methods of manufacture. The structure includes: a via structure composed of cobalt material; and a wiring structure above the via structure. The wiring structure is lined with a barrier liner and the cobalt material and filled with conductive material.

公开(公告)号：US10262942B2

公开(公告)日：2019-04-16

申请号：US15661029

申请日：2017-07-27

Applicant: GLOBALFOUNDRIES INC.

Inventor： Qiang Fang ,  Haigou Huang ,  Shafaat Ahmed ,  Changhong Wu ,  Dinesh R. Koli

IPC: H01L21/4763 ,  H01L23/12 ,  H01L23/532 ,  H01L21/768 ,  H01L21/288 ,  H01L21/285 ,  H01L21/3213

Abstract: The disclosure relates to a method of forming a Co contact module, the method including depositing a liner layer on a trench block, partially plating the lined trenches with Co as a first metal such that the resulting Co layer has a top surface below an opening top surface of a shallowest trench, depositing a second metal on the Co layer and exposed surfaces of the liner layer, planarizing the second metal layer, and etching the second metal layer and portions of the liner layer. The disclosure also relates to a Co contact module formed by the noted method.

公开(公告)号：US20190283215A1

公开(公告)日：2019-09-19

申请号：US15924792

申请日：2018-03-19

Applicant: GLOBALFOUNDRIES INC.

Inventor： Sunghoon Lee ,  Sung Pyo Jung ,  Eric J. Bodensieck ,  Aldrin Bernard Anak Vincent Eddy ,  Dinesh R. Koli

IPC: B24D3/34 ,  B24B53/12 ,  H01L21/304 ,  H01L21/321

Abstract: A gimbal for a conditioning system for a CMP tool is configured to maintain a conditioning disk in contact with a polishing pad of the CMP tool. The gimbal includes an arm coupling for coupling to a conditioning swing arm of the CMP tool; and a disk holder for holding the conditioning disk. A flexible diaphragm extends between the arm coupling and the disk holder. The flexible diaphragm allows the disk holder to flex relative to the arm coupling. The flexible diaphragm is made of a metal or metal alloy.

公开(公告)号：US20190035739A1

公开(公告)日：2019-01-31

申请号：US15661029

申请日：2017-07-27

Applicant: GLOBALFOUNDRIES INC.

Inventor： Qiang Fang ,  Haigou Huang ,  Shafaat Ahmed ,  Changhong Wu ,  Dinesh R. Koli

IPC: H01L23/532 ,  H01L21/768 ,  H01L21/288 ,  H01L21/285 ,  H01L21/3213

Abstract: The disclosure relates to a method of forming a Co contact module, the method including depositing a liner layer on a trench block, partially plating the lined trenches with Co as a first metal such that the resulting Co layer has a top surface below an opening top surface of a shallowest trench, depositing a second metal on the Co layer and exposed surfaces of the liner layer, planarizing the second metal layer, and etching the second metal layer and portions of the liner layer. The disclosure also relates to a Co contact module formed by the noted method.

公开(公告)号：US10814457B2

公开(公告)日：2020-10-27

申请号：US15924792

申请日：2018-03-19

Applicant: GLOBALFOUNDRIES INC.

Inventor： Sunghoon Lee ,  Sung Pyo Jung ,  Eric J. Bodensieck ,  Aldrin Bernard Anak Vincent Eddy ,  Dinesh R. Koli

IPC: B24D3/34 ,  B24B53/12 ,  H01L21/321 ,  H01L21/304 ,  B24B53/017 ,  B24B37/26

Abstract: A gimbal for a conditioning system for a CMP tool is configured to maintain a conditioning disk in contact with a polishing pad of the CMP tool. The gimbal includes an arm coupling for coupling to a conditioning swing arm of the CMP tool; and a disk holder for holding the conditioning disk. A flexible diaphragm extends between the arm coupling and the disk holder. The flexible diaphragm allows the disk holder to flex relative to the arm coupling. The flexible diaphragm is made of a metal or metal alloy.