公开(公告)号：US09293439B2

公开(公告)日：2016-03-22

申请号：US14567052

申请日：2014-12-11

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Edmund Blackshear ,  Elaine Cyr ,  Benjamin Vito Fasano ,  Paul Francis Fortier ,  Marcus E. Interrante ,  Roger Lam ,  Shidong Li ,  Thomas Edward Lombardi ,  Hilton T. Toy ,  Thomas Weiss

IPC: H01L23/00 ,  H01L21/50 ,  H01L23/10 ,  H01L23/367 ,  H01L23/373 ,  H01L23/055 ,  H01L23/42 ,  H01L23/498

CPC classification number: H01L24/83 ,  H01L21/50 ,  H01L23/055 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/49811 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2224/29036 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83862 ,  H01L2924/15311

Abstract: An improved electronic module assembly and method of fabrication is disclosed. A patterned array of adhesive is deposited on a laminate, to which a chip is attached. Each region of adhesive is referred to as a lid tie. A lid is placed on the laminate, and is in contact with the lid ties. The lid ties serve to add stability to the laminate and reduce flexing during thermal processing and mechanical stress.

公开(公告)号：US09401315B1

公开(公告)日：2016-07-26

申请号：US14669775

申请日：2015-03-26

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Paul F. Bodenweber ,  Taryn J. Davis ,  Marcus E. Interrante ,  Chenzhou Lian ,  Kenneth C. Marston ,  Kathryn C. Rivera ,  Kamal K. Sikka ,  Hilton T. Toy

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/492 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L23/10 ,  H01L23/373 ,  H01L23/3732 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/492 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/83201 ,  H01L2224/83447 ,  H01L2224/83493 ,  H01L2224/839 ,  H01L2224/83901 ,  H01L2924/16747 ,  H01L2924/16793 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/01006 ,  H01L2924/00014

Abstract: A semiconductor device package which includes a semiconductor package, a semiconductor device joined to the semiconductor package; and a lid to be placed over the semiconductor device and joined to the semiconductor package. The lid includes: a block of a first material having a first surface and a second surface, the second surface facing the semiconductor device, the block having perforations extending between the first surface and the second surface; inserts for filling the perforations, each of the inserts being made of a second material, at least one of the inserts protrudes beyond the second surface towards the semiconductor device; and a bonding material to bond the inserts to the block so that the at least one of the inserts protrudes beyond the second surface towards the semiconductor device. Also included is a method of assembling a semiconductor device package.

Abstract translation: 一种半导体器件封装，其包括半导体封装，与半导体封装相连接的半导体器件; 以及放置在半导体器件上并连接到半导体封装的盖子。 所述盖包括：第一材料的块，具有第一表面和第二表面，所述第二表面面向所述半导体器件，所述块具有在所述第一表面和所述第二表面之间延伸的穿孔; 用于填充穿孔的插入件，每个插入件由第二材料制成，至少一个插入件朝向半导体器件突出超过第二表面; 以及接合材料，以将所述插入件结合到所述块，使得所述插入件中的所述至少一个插入件朝向所述半导体器件突出超过所述第二表面。 还包括组装半导体器件封装的方法。