公开(公告)号：US09865521B2

公开(公告)日：2018-01-09

申请号：US15410625

申请日：2017-01-19

申请人： Intel Corporation

发明人： Chandra M. Jha ,  Feras Eid ,  Johanna M. Swan ,  Ashish Gupta

IPC分类号： H01L23/34 ,  H01L23/373 ,  H01L23/00

CPC分类号： H01L23/3733 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/433 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05568 ,  H01L2224/05647 ,  H01L2224/1133 ,  H01L2224/1147 ,  H01L2224/1182 ,  H01L2224/11826 ,  H01L2224/13017 ,  H01L2224/13019 ,  H01L2224/13078 ,  H01L2224/13147 ,  H01L2224/13193 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/271 ,  H01L2224/27436 ,  H01L2224/2745 ,  H01L2224/29193 ,  H01L2224/2929 ,  H01L2224/29347 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81011 ,  H01L2224/81191 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/16724 ,  H01L2924/16747 ,  H01L2924/3511 ,  Y10T428/249921 ,  Y10T428/26 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00014

摘要： A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters.

公开(公告)号：US09780079B2

公开(公告)日：2017-10-03

申请号：US14700222

申请日：2015-04-30

申请人： Micron Technology, Inc.

发明人： Jian Li ,  Steven K. Groothuis

IPC分类号： H01L23/34 ,  H01L25/18 ,  H01L25/065 ,  H01L23/367 ,  H01L25/00 ,  H01L23/055 ,  H01L23/13 ,  H01L23/00 ,  H01L21/683

CPC分类号： H01L25/18 ,  H01L21/6835 ,  H01L23/055 ,  H01L23/13 ,  H01L23/3675 ,  H01L23/3677 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2224/0401 ,  H01L2224/05082 ,  H01L2224/05147 ,  H01L2224/05171 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83102 ,  H01L2224/83191 ,  H01L2224/92225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15793 ,  H01L2924/16251 ,  H01L2924/16747 ,  H01L2924/014 ,  H01L2924/00014

摘要： Semiconductor die assemblies and methods of forming the same are described herein. As an example, a semiconductor die assembly may include a thermally conductive casing, a first face of a logic die coupled to the thermally conductive casing to form a thermal path that transfers heat away from the logic die to the thermally conductive casing, a substrate coupled to a second face of the logic die, and a die embedded at least partially in a cavity of the substrate.

公开(公告)号：US09721866B2

公开(公告)日：2017-08-01

申请号：US14944698

申请日：2015-11-18

申请人： SOCIONEXT INC.

发明人： Takeshi Imamura ,  Nobutaka Shimizu ,  Yasunori Fujimoto

IPC分类号： H01L23/00 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H01L25/18 ,  H01L21/56 ,  H01L25/16

CPC分类号： H01L23/3675 ,  H01L21/563 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3736 ,  H01L23/42 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05575 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/16225 ,  H01L2224/27334 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81075 ,  H01L2224/81815 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83447 ,  H01L2224/83487 ,  H01L2224/83815 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01322 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device is provided, the method including: mounting a first element on a wiring substrate, placing a first heat sink on the first element with a metal material interposed between the first heat sink and the first element, attaching the first heat sink to the first element via the metal material by heating and melting the metal material, and mounting a second element on the wiring substrate after the steps of attaching the first heat sink to the first element.

公开(公告)号：US20170062373A1

公开(公告)日：2017-03-02

申请号：US15351992

申请日：2016-11-15

申请人： FUJITSU LIMITED

发明人： Kozo Shimizu ,  Seiki Sakuyama

IPC分类号： H01L23/00 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

摘要： An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

公开(公告)号：US20160247776A1

公开(公告)日：2016-08-25

申请号：US15142690

申请日：2016-04-29

申请人： FUJITSU LIMITED

发明人： KOZO SHIMIZU ,  Seiki Sakuyama

IPC分类号： H01L23/00

CPC分类号： H01L24/17 ,  B23K1/0008 ,  B23K1/0016 ,  B23K3/085 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/264 ,  B23K2101/40 ,  B23K2101/42 ,  H01L23/145 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05082 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/13016 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16157 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/16505 ,  H01L2224/16507 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/75253 ,  H01L2224/75501 ,  H01L2224/75502 ,  H01L2224/759 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81411 ,  H01L2224/81815 ,  H01L2224/81948 ,  H01L2224/81986 ,  H01L2225/06513 ,  H01L2924/014 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10335 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1579 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3512 ,  H01L2924/35121 ,  H05K1/0203 ,  H05K1/09 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/0248 ,  H05K2201/09972 ,  H05K2201/1056 ,  H05K2203/1121 ,  H05K2203/304 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/00

摘要： An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

公开(公告)号：US20160157366A1

公开(公告)日：2016-06-02

申请号：US14900675

申请日：2014-08-22

申请人： KYOCERA CORPORATION

发明人： Noritaka NIINO

IPC分类号： H05K5/00 ,  H05K5/02 ,  H05K5/06

CPC分类号： H05K5/0095 ,  H01L21/50 ,  H01L23/057 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15156 ,  H01L2924/15159 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/16747 ,  H01L2924/1676 ,  H01L2924/3025 ,  H05K5/0213 ,  H05K5/066 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2924/00

摘要： There are provided an electronic component housing package and the like which have high efficiency of heating by infrared rays. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each contain a first material as a major constituent. The electronic component housing package comprises one or more infrared-ray absorbing layers disposed between the plurality of insulating layers and/or disposed on an upper surface of uppermost one of the plurality of insulating layers. The one or more absorbing layers contain a second material which is higher in infrared absorptivity than the first material.

摘要翻译： 提供了通过红外线具有高的加热效率的电子部件壳体封装等。 一种电子部件壳体封装，包括：绝缘基板，包括堆叠在彼此顶部的多个绝缘层，所述绝缘基板的上表面设置有电子部件安装部。 多个绝缘层各自包含第一材料作为主要成分。 电子部件壳体封装包括一个或多个设置在多个绝缘层之间和/或设置在多个绝缘层中最上面的绝缘层的上表面上的红外线吸收层。 所述一个或多个吸收层含有与第一材料相比红外吸收率更高的第二材料。

公开(公告)号：US20160071782A1

公开(公告)日：2016-03-10

申请号：US14944698

申请日：2015-11-18

申请人： SOCIONEXT INC.

发明人： Takeshi Imamura ,  Nobutaka Shimizu ,  Yasunori Fujimoto

IPC分类号： H01L23/367 ,  H01L23/42 ,  H01L23/373 ,  H01L23/00 ,  H01L25/18

CPC分类号： H01L23/3675 ,  H01L21/563 ,  H01L23/04 ,  H01L23/367 ,  H01L23/3736 ,  H01L23/42 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05575 ,  H01L2224/05582 ,  H01L2224/05583 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/16225 ,  H01L2224/27334 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29155 ,  H01L2224/29166 ,  H01L2224/29191 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81075 ,  H01L2224/81815 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83447 ,  H01L2224/83487 ,  H01L2224/83815 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/01322 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device is provided, the method including: mounting a first element on a wiring substrate, placing a first heat sink on the first element with a metal material interposed between the first heat sink and the first element, attaching the first heat sink to the first element via the metal material by heating and melting the metal material, and mounting a second element on the wiring substrate after the steps of attaching the first heat sink to the first element.

摘要翻译： 提供一种制造半导体器件的方法，所述方法包括：将第一元件安装在布线基板上，将第一散热器放置在第一元件上，金属材料插入在第一散热器和第一元件之间， 通过加热和熔化金属材料，通过金属材料散热到第一元件，并且在将第一散热器附接到第一元件的步骤之后，将第二元件安装在布线基板上。

公开(公告)号：US20150349565A1

公开(公告)日：2015-12-03

申请号：US14822478

申请日：2015-08-10

申请人： International Business Machines Corporation

发明人： Mark C. Lamorey ,  Janak G. Patel ,  Peter Slota, JR. ,  David B. Stone

IPC分类号： H02J7/00 ,  H01L25/16 ,  H01L23/552 ,  H01L23/367

CPC分类号： H01L23/552 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/642 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/165 ,  H01L25/18 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/1624 ,  H01L2224/17181 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H02J7/0042 ,  H02J7/0052 ,  H02J7/345 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/0215 ,  H05K1/0216 ,  H05K1/144 ,  H05K1/162 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/041 ,  H05K2201/0999 ,  H05K2201/10515 ,  H05K2201/1056 ,  H01L2924/014 ,  H01L2924/00

摘要： Package assemblies including a die stack and related methods of use. The package assembly includes a substrate with a first surface, a second surface, and a third surface bordering a through-hole extending from the first surface to the second surface. The assembly further includes a die stack, a conductive layer, and a lid. The die stack includes a chip positioned inside the through-hole in the substrate. A section of the conductive layer is disposed on the third surface of the substrate. A portion of the lid is disposed between the first chip and the section of the conductive layer. The conductive layer is configured to be coupled with power, and the lid is configured to be coupled with ground. The portion of the lid may act as a first plate of a capacitor, and the section of the conductive layer may act as a second plate of the capacitor.

公开(公告)号：US09059127B1

公开(公告)日：2015-06-16

申请号：US14151156

申请日：2014-01-09

申请人： International Business Machines Corporation

发明人： Mark C. Lamorey ,  Janak G. Patel ,  Peter Slota, Jr. ,  David B. Stone

IPC分类号： H01L23/495 ,  H01L23/10 ,  H01L23/34 ,  H01L23/367 ,  H01L23/36 ,  H01L25/065

CPC分类号： H01L23/5286 ,  H01L23/13 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/5226 ,  H01L23/552 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L2023/4056 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/131 ,  H01L2224/16055 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/12042 ,  H01L2924/141 ,  H01L2924/1421 ,  H01L2924/143 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/16172 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/1659 ,  H01L2924/16747 ,  H01L2924/014 ,  H01L2924/00

摘要： Packages for a three-dimensional die stack, methods for fabricating a package for a three-dimensional die stack, and methods for distributing power in a package for a three-dimensional die stack. The package may include a first lid, a second lid, a die stack located between the first lid and the second lid, a first thermal interface material layer between the first lid and a first die of the die stack, and a second thermal interface material layer between the second lid and the second die of the die stack. The second thermal interface material layer is comprised of a thermal interface material having a high electrical conductivity and a high thermal conductivity.

摘要翻译： 用于三维管芯堆叠的封装，用于制造用于三维管芯堆叠的封装的方法，以及用于在用于三维管芯堆叠的封装中分配电力的方法。 该封装可以包括第一盖子，第二盖子，位于第​​一盖子和第二盖子之间的模具叠层，第一盖子和模具叠层的第一模具之间的第一热界面材料层，以及第二热界面材料 第二盖和模具叠层的第二模具之间的层。 第二热界面材料层由具有高导电性和高导热性的热界面材料构成。

公开(公告)号：US20150130046A1

公开(公告)日：2015-05-14

申请号：US14514360

申请日：2014-10-14

申请人： BRIDGE SEMICONDUCTOR CORPORATION

发明人： Charles W. C. Lin ,  Chia-Chung Wang

IPC分类号： H01L23/36 ,  H01L23/498

CPC分类号： H01L25/105 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81203 ,  H01L2224/81207 ,  H01L2224/81815 ,  H01L2224/83192 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2225/1094 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/1531 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/15793 ,  H01L2924/16153 ,  H01L2924/16172 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/16724 ,  H01L2924/16747 ,  H01L2924/1676 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00

摘要： The present invention relates to a method of making a semiconductor package with package-on-package stacking capability. In accordance with a preferred embodiment, the method is characterized by the step of attaching a chip-on-interposer subassembly on a metallic carrier with the chip inserted into a cavity of the metallic carrier, and the step of selectively removing portions of the metallic carrier to define a heat spreader for the chip. The heat spreader can provide thermal dissipation, electromagnetic shielding and moisture barrier, whereas the interposer provides a CTE-matched interface and fan-out routing for the chip.

摘要翻译： 本发明涉及制造具有封装封装堆叠能力的半导体封装的方法。 根据优选实施例，该方法的特征在于将芯片插入器子组件附接到金属载体上，其中芯片插入金属载体的空腔中，并且选择性地去除金属载体的部分的步骤 为芯片定义散热器。 散热器可以提供散热，电磁屏蔽和防潮，而插入器为芯片提供了CTE匹配的接口和扇出路由。