Abstract:
Via redundancy insertion is described. A via layout is analyzed by identifying each via, and for each via, identifying a location therefore in the layout, whether the via is redundant and a layout configuration for the via. Each via is classified into a bin of similar layout configurations. For each bin of redundant vias, possible via replacement candidates are determined from a database of possible replacement vias, and the candidates are ranked according to rule-based, recommendation-based and/or model-based criteria. For each via in each bin having a replacement(s), an optimal replacement is identified from among the ranked candidates taken in ranked order that first satisfies another criteria, such as not violating an applicable design rule. The layout is then updated with the optimal replacement.
Abstract:
Via redundancy insertion is described. A via layout is analyzed by identifying each via, and for each via, identifying a location therefore in the layout, whether the via is redundant and a layout configuration for the via. Each via is classified into a bin of similar layout configurations. For each bin of redundant vias, possible via replacement candidates are determined from a database of possible replacement vias, and the candidates are ranked according to rule-based, recommendation-based and/or model-based criteria. For each via in each bin having a replacement(s), an optimal replacement is identified from among the ranked candidates taken in ranked order that first satisfies another criteria, such as not violating an applicable design rule. The layout is then updated with the optimal replacement.
Abstract:
Methodologies and an apparatus enabling an improvement of a manufacturing yield of an IC design are disclosed. Embodiments include: determining a portion of a layout of an IC design, the portion including a first pattern including a plurality of design connections; determining a function performed by the first pattern based, at least in part, on the design connections; and selecting, by a processor, a second pattern based on the function.
Abstract:
A process and apparatus are provided for automated pattern-based semiconductor design layout correction. Embodiments include: determining a portion of a layout of an IC design, the portion comprising a first pattern of a plurality of routes connecting a plurality of design connections; determining one or more sets of the plurality of design connections based on the plurality of routes; and determining, by a processor, a second pattern of a plurality of routes connecting the plurality of design connections within the portion based on the one or more sets.